JP2010056131A5 - - Google Patents

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Publication number
JP2010056131A5
JP2010056131A5 JP2008216616A JP2008216616A JP2010056131A5 JP 2010056131 A5 JP2010056131 A5 JP 2010056131A5 JP 2008216616 A JP2008216616 A JP 2008216616A JP 2008216616 A JP2008216616 A JP 2008216616A JP 2010056131 A5 JP2010056131 A5 JP 2010056131A5
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JP
Japan
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JP2008216616A
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JP2010056131A (ja
JP5061065B2 (ja
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Priority claimed from JP2008216616A external-priority patent/JP5061065B2/ja
Priority to JP2008216616A priority Critical patent/JP5061065B2/ja
Priority to US12/546,149 priority patent/US9159645B2/en
Priority to KR1020090078444A priority patent/KR101043543B1/ko
Priority to EP09168644A priority patent/EP2159839B1/en
Priority to CN200910163520.3A priority patent/CN101661914B/zh
Publication of JP2010056131A publication Critical patent/JP2010056131A/ja
Publication of JP2010056131A5 publication Critical patent/JP2010056131A5/ja
Publication of JP5061065B2 publication Critical patent/JP5061065B2/ja
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JP2008216616A 2008-08-26 2008-08-26 液冷式冷却装置 Active JP5061065B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008216616A JP5061065B2 (ja) 2008-08-26 2008-08-26 液冷式冷却装置
US12/546,149 US9159645B2 (en) 2008-08-26 2009-08-24 Liquid-cooled-type cooling device
KR1020090078444A KR101043543B1 (ko) 2008-08-26 2009-08-25 액냉식 냉각 장치
CN200910163520.3A CN101661914B (zh) 2008-08-26 2009-08-26 液冷式冷却装置
EP09168644A EP2159839B1 (en) 2008-08-26 2009-08-26 Liquid-cooled-type cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008216616A JP5061065B2 (ja) 2008-08-26 2008-08-26 液冷式冷却装置

Publications (3)

Publication Number Publication Date
JP2010056131A JP2010056131A (ja) 2010-03-11
JP2010056131A5 true JP2010056131A5 (ja) 2011-01-06
JP5061065B2 JP5061065B2 (ja) 2012-10-31

Family

ID=41392770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008216616A Active JP5061065B2 (ja) 2008-08-26 2008-08-26 液冷式冷却装置

Country Status (5)

Country Link
US (1) US9159645B2 (ja)
EP (1) EP2159839B1 (ja)
JP (1) JP5061065B2 (ja)
KR (1) KR101043543B1 (ja)
CN (1) CN101661914B (ja)

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EP2768017B1 (en) 2011-10-12 2019-10-23 Fuji Electric Co., Ltd. Cooler for semiconductor module, and semiconductor module
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JP5975110B2 (ja) * 2012-10-29 2016-08-23 富士電機株式会社 半導体装置
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JP6154272B2 (ja) * 2013-09-25 2017-06-28 京セラ株式会社 冷却基板、素子収納用パッケージおよび電子装置
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JP6663899B2 (ja) * 2017-11-29 2020-03-13 本田技研工業株式会社 冷却装置
JP7047929B2 (ja) 2018-10-03 2022-04-05 富士電機株式会社 半導体装置
CN111129645B (zh) * 2018-10-31 2021-12-24 浙江三花汽车零部件有限公司 一种换热装置
CN111121501B (zh) * 2018-10-31 2022-11-04 浙江三花汽车零部件有限公司 一种换热装置
US11129310B2 (en) 2018-11-22 2021-09-21 Fuji Electric Co., Ltd. Semiconductor module, vehicle and manufacturing method
JP7243262B2 (ja) * 2019-02-15 2023-03-22 富士電機株式会社 半導体モジュール、車両および製造方法

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