JP2010056131A - 液冷式冷却装置 - Google Patents
液冷式冷却装置 Download PDFInfo
- Publication number
- JP2010056131A JP2010056131A JP2008216616A JP2008216616A JP2010056131A JP 2010056131 A JP2010056131 A JP 2010056131A JP 2008216616 A JP2008216616 A JP 2008216616A JP 2008216616 A JP2008216616 A JP 2008216616A JP 2010056131 A JP2010056131 A JP 2010056131A
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- Prior art keywords
- fin
- liquid
- casing
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- inlet
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- 238000001816 cooling Methods 0.000 title claims abstract description 53
- 239000000110 cooling liquid Substances 0.000 claims abstract description 25
- 239000002826 coolant Substances 0.000 claims description 30
- 239000007788 liquid Substances 0.000 claims description 23
- 230000002093 peripheral effect Effects 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/32—Safety or protection arrangements; Arrangements for preventing malfunction for limiting movements, e.g. stops, locking means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
【解決手段】液冷式冷却装置1は、後端部に冷却液入口11が形成されるとともに、前端部に冷却液出口12が形成されたケーシング2を備えている。ケーシング2内の冷却液入口11と冷却液出口12との間の位置に、複数の流路18を形成するフィン17を配置する。ケーシング2内におけるフィン17よりも後側の部分を入口ヘッダ部21とするとともに、フィン17よりも前側の部分を出口ヘッダ部22とする。入口ヘッダ部21内の後側面を、右方から左方に向かってフィン17側に傾斜させる。入口ヘッダ部21内の後側面の左端部の下部に、左右方向に直線状にのびかつフィン17の後端部の位置決めを行う位置決め用垂直面23を設ける。位置決め用垂直面23にフィン17の後端部を当接させる。
【選択図】図3
Description
入口ヘッダ部内の後側面が、左右いずれか一方から他方に向かってフィン側に傾斜しており、入口ヘッダ部内の後側面の最もフィン側に位置する端部における下部または上部に、左右方向に直線状にのびかつフィンの後端部の位置決めを行う位置決め用垂直面が設けられており、位置決め用垂直面にフィンの後端部が当接するようになっている液冷式冷却装置。
(2):ケーシング
(11):冷却液入口
(12):冷却液出口
(17):コルゲートフィン
(18):流路
(21):入口ヘッダ部
(22):出口ヘッダ部
(23):位置決め用垂直面
(24):隙間
(25):位置決め用垂直面
(26):隙間
(27)(28):逃げ部
Claims (5)
- 後端部に冷却液入口が形成されるとともに、前端部に冷却液出口が形成されたケーシングを備えており、ケーシング内における冷却液入口と冷却液出口との間の位置に、冷却液が後方から前方に流れる複数の流路を形成するフィンが配置され、ケーシング内におけるフィンよりも後側の部分が冷却液入口に通じる入口ヘッダ部となされるとともに、フィンよりも前側の部分が冷却液出口に通じる出口ヘッダ部となされている液冷式冷却装置であって、
入口ヘッダ部内の後側面が、左右いずれか一方から他方に向かってフィン側に傾斜しており、入口ヘッダ部内の後側面の最もフィン側に位置する端部における下部または上部に、左右方向に直線状にのびかつフィンの後端部の位置決めを行う位置決め用垂直面が設けられており、位置決め用垂直面にフィンの後端部が当接するようになっている液冷式冷却装置。 - 位置決め用垂直面の高さが入口ヘッダ部内の高さの1/2以下であり、入口ヘッダ部内の後側面の最もフィン側に位置する端部における位置決め用垂直面よりも上方または下方の部分と、フィンの後端部との間に冷却液が流れる隙間が形成されている請求項1記載の液冷式冷却装置。
- 出口ヘッダ部内の前側面が、左右いずれか一方から他方に向かってフィン側に傾斜しており、出口ヘッダ部内の前側面の最もフィン側に位置する端部における下部または上部に、左右方向に直線状にのびかつフィンの前端部の位置決めを行う位置決め用垂直面が設けられており、位置決め用垂直面にフィンの前端部が当接するようになっている請求項1または2記載の液冷式冷却装置。
- 位置決め用垂直面の高さが出口ヘッダ部内の高さの1/2以下であり、出口ヘッダ部内の前側面の最もフィン側に位置する端部における位置決め用垂直面よりも上方または下方の部分と、フィンの前端部との間に冷却液が流れる隙間が形成されている請求項3記載の液冷式冷却装置。
- ケーシング内の左右両側面がフィンの左右両側縁に沿っており、ケーシング内の左右両側面における位置決め用垂直面に連なった部分に、左右方向外方に膨らんだ逃げ部が設けられている請求項1〜4のうちのいずれかに記載の液冷式冷却装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008216616A JP5061065B2 (ja) | 2008-08-26 | 2008-08-26 | 液冷式冷却装置 |
US12/546,149 US9159645B2 (en) | 2008-08-26 | 2009-08-24 | Liquid-cooled-type cooling device |
KR1020090078444A KR101043543B1 (ko) | 2008-08-26 | 2009-08-25 | 액냉식 냉각 장치 |
EP09168644A EP2159839B1 (en) | 2008-08-26 | 2009-08-26 | Liquid-cooled-type cooling device |
CN200910163520.3A CN101661914B (zh) | 2008-08-26 | 2009-08-26 | 液冷式冷却装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008216616A JP5061065B2 (ja) | 2008-08-26 | 2008-08-26 | 液冷式冷却装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010056131A true JP2010056131A (ja) | 2010-03-11 |
JP2010056131A5 JP2010056131A5 (ja) | 2011-01-06 |
JP5061065B2 JP5061065B2 (ja) | 2012-10-31 |
Family
ID=41392770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008216616A Active JP5061065B2 (ja) | 2008-08-26 | 2008-08-26 | 液冷式冷却装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9159645B2 (ja) |
EP (1) | EP2159839B1 (ja) |
JP (1) | JP5061065B2 (ja) |
KR (1) | KR101043543B1 (ja) |
CN (1) | CN101661914B (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011132736A1 (ja) * | 2010-04-21 | 2011-10-27 | 富士電機システムズ株式会社 | 半導体モジュール及び冷却器 |
JP2012016073A (ja) * | 2010-06-29 | 2012-01-19 | Denso Corp | 電力変換装置 |
US20150090802A1 (en) * | 2012-05-02 | 2015-04-02 | Webasto SE | Heating device for a vehicle and method of operating the heating device |
JP2015065334A (ja) * | 2013-09-25 | 2015-04-09 | 京セラ株式会社 | 冷却基板、素子収納用パッケージおよび電子装置 |
JPWO2013140704A1 (ja) * | 2012-03-21 | 2015-08-03 | 富士電機株式会社 | 電力変換装置 |
DE102019216778A1 (de) | 2018-11-22 | 2020-05-28 | Fuji Electric Co., Ltd. | Halbleitermodul, Fahrzeug und Fertigungsverfahren |
US12009279B2 (en) | 2018-10-03 | 2024-06-11 | Fuji Electric Co., Ltd. | Semiconductor apparatus including cooler for cooling semiconductor element |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009069578A1 (ja) * | 2007-11-26 | 2009-06-04 | Kabushiki Kaisha Toyota Jidoshokki | 液冷式冷却装置 |
DE102010061768A1 (de) * | 2010-11-23 | 2012-05-24 | Behr Gmbh & Co. Kg | Vorrichtung zur Kühlung einer Wärmequelle eines Kraftfahrzeugs |
WO2012147544A1 (ja) | 2011-04-26 | 2012-11-01 | 富士電機株式会社 | 半導体モジュール用冷却器及び半導体モジュール |
CN103597591A (zh) * | 2011-06-15 | 2014-02-19 | 丰田自动车株式会社 | 半导体元件的冷却构造 |
JP5900506B2 (ja) | 2011-10-12 | 2016-04-06 | 富士電機株式会社 | 半導体モジュール用冷却器及び半導体モジュール |
WO2014069174A1 (ja) * | 2012-10-29 | 2014-05-08 | 富士電機株式会社 | 半導体装置 |
WO2014185088A1 (ja) * | 2013-05-17 | 2014-11-20 | 富士通株式会社 | 半導体装置とその製造方法、及び電子機器 |
US11421947B2 (en) * | 2015-09-07 | 2022-08-23 | Mitsubishi Electric Corporation | Laminated header, heat exchanger, and air-conditioning apparatus |
US10292316B2 (en) * | 2017-09-08 | 2019-05-14 | Hamilton Sundstrand Corporation | Power module with integrated liquid cooling |
JP6663899B2 (ja) * | 2017-11-29 | 2020-03-13 | 本田技研工業株式会社 | 冷却装置 |
CN111121501B (zh) * | 2018-10-31 | 2022-11-04 | 浙江三花汽车零部件有限公司 | 一种换热装置 |
CN111129645B (zh) * | 2018-10-31 | 2021-12-24 | 浙江三花汽车零部件有限公司 | 一种换热装置 |
JP7243262B2 (ja) * | 2019-02-15 | 2023-03-22 | 富士電機株式会社 | 半導体モジュール、車両および製造方法 |
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JP2004060920A (ja) * | 2002-07-25 | 2004-02-26 | Denso Corp | 熱交換器 |
JP2006295178A (ja) * | 2005-04-11 | 2006-10-26 | Samsung Electronics Co Ltd | 電子素子用ヒートシンク装置 |
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2008
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-
2009
- 2009-08-24 US US12/546,149 patent/US9159645B2/en not_active Expired - Fee Related
- 2009-08-25 KR KR1020090078444A patent/KR101043543B1/ko not_active IP Right Cessation
- 2009-08-26 EP EP09168644A patent/EP2159839B1/en not_active Not-in-force
- 2009-08-26 CN CN200910163520.3A patent/CN101661914B/zh not_active Expired - Fee Related
Patent Citations (3)
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JP2000213880A (ja) * | 1999-01-20 | 2000-08-02 | Calsonic Kansei Corp | 沸騰冷却装置 |
JP2004060920A (ja) * | 2002-07-25 | 2004-02-26 | Denso Corp | 熱交換器 |
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011132736A1 (ja) * | 2010-04-21 | 2011-10-27 | 富士電機システムズ株式会社 | 半導体モジュール及び冷却器 |
JP5565459B2 (ja) * | 2010-04-21 | 2014-08-06 | 富士電機株式会社 | 半導体モジュール及び冷却器 |
US8902589B2 (en) | 2010-04-21 | 2014-12-02 | Fuji Electric Co., Ltd. | Semiconductor module and cooler |
JP2012016073A (ja) * | 2010-06-29 | 2012-01-19 | Denso Corp | 電力変換装置 |
JPWO2013140704A1 (ja) * | 2012-03-21 | 2015-08-03 | 富士電機株式会社 | 電力変換装置 |
US20150090802A1 (en) * | 2012-05-02 | 2015-04-02 | Webasto SE | Heating device for a vehicle and method of operating the heating device |
US9895957B2 (en) * | 2012-05-02 | 2018-02-20 | Webasto SE | Heating device for a vehicle and method of operating the heating device |
JP2015065334A (ja) * | 2013-09-25 | 2015-04-09 | 京セラ株式会社 | 冷却基板、素子収納用パッケージおよび電子装置 |
US12009279B2 (en) | 2018-10-03 | 2024-06-11 | Fuji Electric Co., Ltd. | Semiconductor apparatus including cooler for cooling semiconductor element |
DE102019216778A1 (de) | 2018-11-22 | 2020-05-28 | Fuji Electric Co., Ltd. | Halbleitermodul, Fahrzeug und Fertigungsverfahren |
US11129310B2 (en) | 2018-11-22 | 2021-09-21 | Fuji Electric Co., Ltd. | Semiconductor module, vehicle and manufacturing method |
Also Published As
Publication number | Publication date |
---|---|
KR101043543B1 (ko) | 2011-06-21 |
JP5061065B2 (ja) | 2012-10-31 |
CN101661914B (zh) | 2014-06-18 |
KR20100024901A (ko) | 2010-03-08 |
US9159645B2 (en) | 2015-10-13 |
US20100051234A1 (en) | 2010-03-04 |
EP2159839A3 (en) | 2010-09-08 |
CN101661914A (zh) | 2010-03-03 |
EP2159839A2 (en) | 2010-03-03 |
EP2159839B1 (en) | 2012-11-07 |
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