JP2010044044A - プローブカードの製造方法 - Google Patents
プローブカードの製造方法 Download PDFInfo
- Publication number
- JP2010044044A JP2010044044A JP2009015245A JP2009015245A JP2010044044A JP 2010044044 A JP2010044044 A JP 2010044044A JP 2009015245 A JP2009015245 A JP 2009015245A JP 2009015245 A JP2009015245 A JP 2009015245A JP 2010044044 A JP2010044044 A JP 2010044044A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- thermoplastic resin
- probe card
- probe head
- resin substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/061—Lamination of previously made multilayered subassemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
【解決手段】プローブヘッドの一面に熱可塑性樹脂基板を接合する工程と、上記プローブヘッドの他面に複数の端子を形成する工程と、上記熱可塑性樹脂基板に金属基板を接合する工程と、上記金属基板を選択的にエッチングしてプローブチップを形成する工程と、を含むことを特徴とするプローブカードの製造方法を提供する。
【選択図】図1
Description
240 プローブヘッド
250 端子
260 金属基板
270 プローブチップ
Claims (8)
- プローブヘッドの一面に熱可塑性樹脂基板を接合する工程と、
前記プローブヘッドの他面に複数の端子を形成する工程と、
前記熱可塑性樹脂基板に金属基板を接合する工程と、
前記金属基板を選択的にエッチングしてプローブチップを形成する工程と、
を含むプローブカードの製造方法。 - 前記プローブヘッドがセラミック基板から形成されることを特徴とする請求項1に記載のプローブカードの製造方法。
- 前記熱可塑性樹脂基板が、分散されたガラス繊維をさらに含むことを特徴とする請求項1に記載のプローブカードの製造方法。
- 前記熱可塑性樹脂基板が、液晶高分子、ポリエーテルイミド、ポリエーテルスルホン、ポリエーテルエーテルケトン、及びポリテトラフルオロエチレンの何れか1種またはこれらの組み合わせから形成されることを特徴とする請求項1に記載のプローブカードの製造方法。
- プローブヘッドの両面に熱可塑性樹脂基板を接合する工程と、
前記プローブヘッドの他面に接合された前記熱可塑性樹脂基板に複数の端子を形成する工程と、
前記プローブヘッドの一面に接合された前記熱可塑性樹脂基板に金属基板を接合する工程と、
前記金属基板を選択的にエッチングしてプローブチップを形成する工程と、
を含むプローブカードの製造方法。 - 前記プローブヘッドがセラミック基板から形成されることを特徴とする請求項5に記載のプローブカードの製造方法。
- 前記熱可塑性樹脂基板が、分散されたガラス繊維をさらに含むことを特徴とする請求項5に記載のプローブカードの製造方法。
- 前記熱可塑性樹脂基板が、液晶高分子、ポリエーテルイミド、ポリエーテルスルホン、ポリエーテルエーテルケトン、及びポリテトラフルオロエチレンの何れか1種またはこれらの組み合わせから形成されることを特徴とする請求項5に記載のプローブカードの製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080078635A KR20100019885A (ko) | 2008-08-11 | 2008-08-11 | 프로브 카드 제조 방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2010044044A true JP2010044044A (ja) | 2010-02-25 |
Family
ID=41651600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009015245A Pending JP2010044044A (ja) | 2008-08-11 | 2009-01-27 | プローブカードの製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20100031504A1 (ja) |
JP (1) | JP2010044044A (ja) |
KR (1) | KR20100019885A (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101108726B1 (ko) * | 2010-01-26 | 2012-02-29 | 삼성전기주식회사 | 수평도 조절부재 |
RU2655460C2 (ru) * | 2016-11-02 | 2018-05-28 | Акционерное общество "Научно-исследовательский институт технологии и автоматизации производства" | Способ изготовления монолитных контактов и зондов |
JP6947708B2 (ja) * | 2018-08-29 | 2021-10-13 | 日本特殊陶業株式会社 | 配線基板 |
KR20220132632A (ko) * | 2020-03-11 | 2022-09-30 | 닛폰 하츠죠 가부시키가이샤 | 프로브 카드 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001208773A (ja) * | 1999-11-18 | 2001-08-03 | Ibiden Co Ltd | 検査装置およびプローブカード |
JP2004279046A (ja) * | 2003-03-12 | 2004-10-07 | Dainippon Printing Co Ltd | 電子デバイス検査用コンタクトシートおよびその製造方法 |
JP2005337737A (ja) * | 2004-05-24 | 2005-12-08 | Tokyo Electron Ltd | 積層基板及びプローブカード |
JP2006269488A (ja) * | 2005-03-22 | 2006-10-05 | Fujitsu Ltd | 回路基板及びその製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1248292A4 (en) * | 2000-07-25 | 2007-08-15 | Ibiden Co Ltd | INSPECTION DEVICE AND PROBE CARD |
JP4199198B2 (ja) * | 2003-01-16 | 2008-12-17 | 富士通株式会社 | 多層配線基板およびその製造方法 |
-
2008
- 2008-08-11 KR KR1020080078635A patent/KR20100019885A/ko not_active Application Discontinuation
-
2009
- 2009-01-06 US US12/349,305 patent/US20100031504A1/en not_active Abandoned
- 2009-01-27 JP JP2009015245A patent/JP2010044044A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001208773A (ja) * | 1999-11-18 | 2001-08-03 | Ibiden Co Ltd | 検査装置およびプローブカード |
JP2004279046A (ja) * | 2003-03-12 | 2004-10-07 | Dainippon Printing Co Ltd | 電子デバイス検査用コンタクトシートおよびその製造方法 |
JP2005337737A (ja) * | 2004-05-24 | 2005-12-08 | Tokyo Electron Ltd | 積層基板及びプローブカード |
JP2006269488A (ja) * | 2005-03-22 | 2006-10-05 | Fujitsu Ltd | 回路基板及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US20100031504A1 (en) | 2010-02-11 |
KR20100019885A (ko) | 2010-02-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Lu et al. | Reliability and flexibility of ultra-thin chip-on-flex (UTCOF) interconnects with anisotropic conductive adhesive (ACA) joints | |
US20170169931A1 (en) | Pre space transformer, space transformer manufactured using the pre space transformer, and semiconductor device inspecting apparatus including the space transformer | |
TWI694567B (zh) | 印刷電路板及其測試方法以及製造半導體封裝的方法 | |
TW201528432A (zh) | 半導體裝置及其形成方法 | |
JP2010044044A (ja) | プローブカードの製造方法 | |
JP2014122872A (ja) | 予備空間変換器及びこれを用いて製造された空間変換器、並びに前記空間変換器を備える半導体素子検査装置 | |
CN110010511B (zh) | 一种射频芯片系统级封装模组的测试方式 | |
TW202223409A (zh) | 探針裝置及其組裝方法 | |
JP2002076576A (ja) | 配線パターン形成方法およびその方法に用いられる原版 | |
JP2011049337A (ja) | 半導体装置の製造方法 | |
JP4019328B2 (ja) | 電極の接続方法 | |
JP2009128357A (ja) | プローブカード | |
JP2008244311A (ja) | 半導体パッケージ基板及び半導体装置 | |
JP2015111061A (ja) | 接合位置検査システム、方法、および回路基板 | |
KR101987302B1 (ko) | 패키지 검사 장치 및 패키지 검사 방법 | |
JP2002124527A (ja) | チップ状電子部品の製造方法、及びその製造に用いる疑似ウェーハの製造方法 | |
JP5018625B2 (ja) | 半導体装置の製造方法 | |
KR102322780B1 (ko) | 인터페이스 보드 및 상기 인터페이스 제조 방법 | |
CN107205315B (zh) | 印刷电路板以及组件制造方法 | |
KR20100027736A (ko) | 프로브 본딩 방법 | |
JP4877465B2 (ja) | 半導体装置、半導体装置の検査方法、半導体ウェハ | |
Li | Failure analysis challenges for chip-scale packages | |
JP2004165659A (ja) | 電極の接続方法および該方法で得た電極の接続構造 | |
US20130187263A1 (en) | Semiconductor stacked package and method of fabricating the same | |
JP2008241646A (ja) | 膜密着性評価方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20091126 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20100107 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20100108 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110719 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20111220 |