JP2010041045A - 半導体装置及びその作製方法 - Google Patents

半導体装置及びその作製方法 Download PDF

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Publication number
JP2010041045A
JP2010041045A JP2009160474A JP2009160474A JP2010041045A JP 2010041045 A JP2010041045 A JP 2010041045A JP 2009160474 A JP2009160474 A JP 2009160474A JP 2009160474 A JP2009160474 A JP 2009160474A JP 2010041045 A JP2010041045 A JP 2010041045A
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Prior art keywords
semiconductor
sheet
electrode
organic resin
layer
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JP2009160474A
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Japanese (ja)
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JP2010041045A5 (OSRAM
Inventor
Akihiro Senda
章裕 千田
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2009160474A priority Critical patent/JP2010041045A/ja
Publication of JP2010041045A publication Critical patent/JP2010041045A/ja
Publication of JP2010041045A5 publication Critical patent/JP2010041045A5/ja
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
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JP2009160474A 2008-07-09 2009-07-07 半導体装置及びその作製方法 Withdrawn JP2010041045A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009160474A JP2010041045A (ja) 2008-07-09 2009-07-07 半導体装置及びその作製方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008179286 2008-07-09
JP2009160474A JP2010041045A (ja) 2008-07-09 2009-07-07 半導体装置及びその作製方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014079887A Division JP5663687B2 (ja) 2008-07-09 2014-04-09 半導体装置の作製方法

Publications (2)

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JP2010041045A true JP2010041045A (ja) 2010-02-18
JP2010041045A5 JP2010041045A5 (OSRAM) 2012-08-16

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JP2009160474A Withdrawn JP2010041045A (ja) 2008-07-09 2009-07-07 半導体装置及びその作製方法
JP2014079887A Expired - Fee Related JP5663687B2 (ja) 2008-07-09 2014-04-09 半導体装置の作製方法

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JP2014079887A Expired - Fee Related JP5663687B2 (ja) 2008-07-09 2014-04-09 半導体装置の作製方法

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Country Link
US (1) US8563397B2 (OSRAM)
EP (1) EP2148365A3 (OSRAM)
JP (2) JP2010041045A (OSRAM)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170130286A (ko) * 2016-05-18 2017-11-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박리 방법, 표시 장치, 모듈, 및 전자 기기
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