JP2010021244A5 - - Google Patents

Download PDF

Info

Publication number
JP2010021244A5
JP2010021244A5 JP2008178864A JP2008178864A JP2010021244A5 JP 2010021244 A5 JP2010021244 A5 JP 2010021244A5 JP 2008178864 A JP2008178864 A JP 2008178864A JP 2008178864 A JP2008178864 A JP 2008178864A JP 2010021244 A5 JP2010021244 A5 JP 2010021244A5
Authority
JP
Japan
Prior art keywords
wall surface
plasma processing
seal
processing apparatus
processing container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008178864A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010021244A (ja
JP5304062B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2008178864A external-priority patent/JP5304062B2/ja
Priority to JP2008178864A priority Critical patent/JP5304062B2/ja
Priority to US13/003,102 priority patent/US8800484B2/en
Priority to KR1020107028917A priority patent/KR101174277B1/ko
Priority to PCT/JP2009/060916 priority patent/WO2010004836A1/ja
Priority to CN200980125715.7A priority patent/CN102084469B/zh
Priority to TW098123004A priority patent/TWI425883B/zh
Publication of JP2010021244A publication Critical patent/JP2010021244A/ja
Publication of JP2010021244A5 publication Critical patent/JP2010021244A5/ja
Publication of JP5304062B2 publication Critical patent/JP5304062B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008178864A 2008-07-09 2008-07-09 プラズマ処理装置 Expired - Fee Related JP5304062B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2008178864A JP5304062B2 (ja) 2008-07-09 2008-07-09 プラズマ処理装置
CN200980125715.7A CN102084469B (zh) 2008-07-09 2009-06-16 等离子体处理装置
KR1020107028917A KR101174277B1 (ko) 2008-07-09 2009-06-16 플라즈마 처리 장치
PCT/JP2009/060916 WO2010004836A1 (ja) 2008-07-09 2009-06-16 プラズマ処理装置
US13/003,102 US8800484B2 (en) 2008-07-09 2009-06-16 Plasma processing apparatus
TW098123004A TWI425883B (zh) 2008-07-09 2009-07-08 Plasma processing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008178864A JP5304062B2 (ja) 2008-07-09 2008-07-09 プラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2010021244A JP2010021244A (ja) 2010-01-28
JP2010021244A5 true JP2010021244A5 (https=) 2012-03-01
JP5304062B2 JP5304062B2 (ja) 2013-10-02

Family

ID=41705874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008178864A Expired - Fee Related JP5304062B2 (ja) 2008-07-09 2008-07-09 プラズマ処理装置

Country Status (1)

Country Link
JP (1) JP5304062B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5837793B2 (ja) 2010-11-30 2015-12-24 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及び基板処理装置のバッフル構造
JP7281968B2 (ja) * 2019-05-30 2023-05-26 東京エレクトロン株式会社 アリ溝加工方法及び基板処理装置
CN117427792A (zh) * 2022-07-14 2024-01-23 中微半导体设备(上海)股份有限公司 等离子体处理设备、气体喷淋头及其制造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5082229B2 (ja) * 2005-11-29 2012-11-28 東京エレクトロン株式会社 プラズマ処理装置
JP4833778B2 (ja) * 2006-02-13 2011-12-07 東京エレクトロン株式会社 基板処理装置及び基板処理方法

Similar Documents

Publication Publication Date Title
US20150291830A1 (en) Apparatus and methods for plasma enhanced chemical vapor deposition of polymer coatings
EP2138604A3 (en) Film deposition apparatus, film deposition method, and computer readable storage medium
TW200802549A (en) Vertical plasma processing apparatus for semiconductor process
WO2006104921A3 (en) A plasma enhanced atomic layer deposition system and method
JP2011192872A5 (https=)
JP2012124168A5 (https=)
WO2009104918A3 (en) Apparatus and method for processing substrate
JP2012188735A5 (https=)
JP2010021244A5 (https=)
JP2009239014A5 (https=)
JP2022523367A (ja) コーティング
JP2007043038A5 (https=)
US20140141221A1 (en) Apparatus and methods for plasma enhanced chemical vapor deposition of polymer coatings
CN102206815A (zh) 等离子体镀膜装置
JP2020013983A5 (https=)
JP2004063521A5 (https=)
JP5570900B2 (ja) 基板載置面に樹脂突起物層を形成する方法及び樹脂突起物層転写部材
JP2010021243A5 (https=)
WO2008123295A1 (ja) プラズマ処理装置
JP2012104703A5 (ja) 半導体装置の製造方法、半導体装置、基板処理装置
JP2004079528A5 (https=)
JP4698454B2 (ja) 誘導結合型プラズマ処理装置
JP2013140918A (ja) プラズマ処理装置
JP5787917B2 (ja) 成膜方法及び成膜装置
US11849543B2 (en) Plasma ashing for coated devices