JP2010012519A - ガラスシート基板コーティングをレーザスクライビングするための方法及び装置 - Google Patents
ガラスシート基板コーティングをレーザスクライビングするための方法及び装置 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 87
- 239000011521 glass Substances 0.000 title claims abstract description 63
- 238000000576 coating method Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000011248 coating agent Substances 0.000 claims abstract description 23
- 238000002679 ablation Methods 0.000 claims abstract description 13
- 239000010410 layer Substances 0.000 claims description 25
- 238000011144 upstream manufacturing Methods 0.000 claims description 7
- 239000011247 coating layer Substances 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 3
- 229910052720 vanadium Inorganic materials 0.000 claims 4
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims 4
- 230000006866 deterioration Effects 0.000 claims 1
- 230000032258 transport Effects 0.000 description 9
- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 5
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 5
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 5
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 5
- 229910001887 tin oxide Inorganic materials 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- QWVYNEUUYROOSZ-UHFFFAOYSA-N trioxido(oxo)vanadium;yttrium(3+) Chemical compound [Y+3].[O-][V]([O-])([O-])=O QWVYNEUUYROOSZ-UHFFFAOYSA-N 0.000 description 1
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
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- H—ELECTRICITY
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- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/30—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising thin-film photovoltaic cells
- H10F19/31—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising thin-film photovoltaic cells having multiple laterally adjacent thin-film photovoltaic cells deposited on the same substrate
- H10F19/33—Patterning processes to connect the photovoltaic cells, e.g. laser cutting of conductive or active layers
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- H10F71/00—Manufacture or treatment of devices covered by this subclass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
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- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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Abstract
【解決手段】少なくとも1000mm/秒の速度でスクライビングするように、コーティングを介してオーバーラッピングアブレーションを提供するために他の表面でコーティングを通過して基板の非コーティング表面に向かって、XYZガルバノメータ制御ミラーシステム90によってビームを反射させ、少なくとも8ナノ秒のパルス持続時間と、少なくとも50キロヘルツの周波数と、近赤外線基本振動数での波長とを備えたパルスレーザビーム84を提供するレーザソース83と近接して基板をコンベヤ移送することにより、ガラスシート基板のコーティングをレーザスクライビングするための方法及び装置。
【選択図】図6
Description
Claims (18)
- レーザスクライビングに関する方法であって、
一方がコーティングされておらず、他の一方がコーティングされた対向する表面を有するガラスシート基板を提供し、
少なくとも50キロヘルツのパルス周波数と少なくとも8ナノ秒のパルス持続時間を有し、近赤外線基本振動数での波長を備えたパルスレーザビームを提供するレーザソースと近接して、コーティングされたガラスシート基板を輸送の方向に沿ってコンベヤ送りさせ、
コーティングを介してオーバーラッピングアブレーションを提供するように別の表面でコーティングを通過してガラスシート基板のコーティングされていない表面に向かって、XYZガルバノメータ制御ミラーシステムによってレーザソースからパルスレーザビームを反射させ、少なくとも1000mm/秒の速度でスクライビングする、
ことを特徴とする方法。 - ガラスシート基板を、垂直方位でコンベヤ移送し、パルスレーザが基板を通る位置からコンベヤ移送の方向に沿って上流及び下流に配置された真空ポジショナとガスプレッシャとによりコンベヤ移送の方向に対して側方に位置決めし、レーザスクライビングの間、前記ボジショナが基板の平面を制御することを特徴とする、請求項1に記載のレーザスクライビングに関する方法。
- ガスプレッシャ及び真空ポジショナが、ガラスシート基板の非被覆表面でそのガラスシート基板を位置決めし、被覆表面の劣化を防止することを特徴とする、請求項2に記載のレーザスクライビングに関する方法。
- ガラスシート基板の位置を、ポジショナに近接した、レーザ検出ビームによって検出し、パルスレーザビームが前記検出された位置に対して焦点合わせされることを特徴とする請求項2に記載のレーザスクライビングに関する方法。
- ガラスシート基板のコンベヤ移送が、そのインデックス付けを提供し、レーザスクライビング中、基板が平静に保持されることを特徴とする、請求項1に記載のレーザスクライビングに関する方法。
- ガラスシート基板がコンベヤ移送されるときに、レーザスクライビングが実施されることを特徴とする、請求項1に記載のレーザスクライビングに関する方法。
- ガラスシート基板が複数の異なるコーティング層を有し、複数のレーザスクライブが異なるパワーレベルで行われ、スクライブが異なる層に延びることを特徴とする、請求項1に記載のレーザスクライビングに関する方法。
- 複数のレーザソース及び関連するXYZガルバノメータ制御ミラーが、少なくとも1000mm/秒の速度で、8乃至70ナノ秒のレンジのパルス持続時間と、50乃至100キロヘルツのレンジのパルス周波数と、近赤外線の基本振動数での波長を各々備えた、異なるパワーレベルでの異なるスクライブのパルスレーザスクライビングをそれぞれ提供することを特徴とする請求項7に記載のレーザスクライビングに関する方法。
- レーザスクライビングに関する方法であって、
一方はコーティングされておらず、他の一方は異なる層でコーティングがなされた対向する表面を備えたガラスシート基板を提供し、
少なくとも8ナノ秒のパルス持続時間と少なくとも50キロヘルツのパルス周波数を有し、近赤外線の基本振動数での波長を備えた選択されたパワーのパルスレーザビームを提供するバナジウムレーザソースに隣接してコンベヤ移送の方向に沿って、コーティングされたガラスシート基板を垂直方位でコンベヤ移送し、
ガスプレッシャ及び真空ポジショナによって、垂直方位基板を位置決めし、
コーティングの所定の層を介してオーバラップアブレーションを提供するために、他の表面でコーティングを通して、ガラスシート基板の非コーティング表面に向かって、XYZガルバノメータ制御ミラーシステムによってバナジウムレーザソースからのパルスレーザビームを反射させ、少なくとも1000mm/秒の速度でスクライビングする、
ことを特徴とする方法。 - レーザスクライビングに関する装置であって、
一方がコーティングされておらず、他の一方がコーティングされている対向する表面を備えたガラスシート基板をコンベヤ移送する方向に沿って、当該ガラスシート基板をコンベヤ移送するためのコンベヤと、
少なくとも8ナノ秒のパルス持続時間と少なくとも50キロヘルツのパルス周波数を有し、近赤外線基本振動数での波長を備えたパルスレーザビームを提供するように、コンベヤ移送の方向に沿って位置決めされたレーザソースと、
コーティングを介してオーバーラップアブレーションを提供するために、他の表面でコーティングを通してガラスシート基板の非コーティング表面に向かって、パルスレーザビームを反射するXYZガルバノメータ制御ミラーシステムと、
を有することを特徴とする装置。 - パルスレーザビームが基板を通る位置から、コンベヤ移送の方向に沿って上流と下流に配置された真空ポジショナとガスプレッシャとを更に包含し、レーザスクライビング中、前記ポジショナが基板の平面及び位置を制御する、ことを特徴とする請求項10に記載の装置。
- パルスレーザビームを焦点合わせさせるために、ポジショナに近接して、基板の位置を決定させるレーザ検知機を更に含むことを特徴とする、請求項11に記載の装置。
- 請求項10に記載のガラスシート基板をレーザスクライビングするための装置であって、
8乃至70ナノ秒のレンジのパルス持続時間と、50乃至100キロヘルツのレンジのパルス周波数と、近赤外線基本振動数での波長を各々備え、異なるパワーレベルで作動する複数のパルスレーザソースと、
少なくとも1000mm/秒の速度でスクライビングを提供するレーザソースからパルスレーザビームをそれぞれ反射する、複数のXYZガルバノメータ制御レーザミラーシステムと、
を有することを特徴とする装置。 - 一方がコーティングされておらず、他の一方が複数の層を含むコーティングを有する対向する表面を備えたガラスシート基板をコンベヤ移送する方向に沿って当該ガラスシート基板をコンベヤ移送するコンベヤと、
コンベヤ移送の方向に沿って互いに間隔が隔てられた複数のバナジウムレーザソースとを有し、前記バナジウムレーザソースが、少なくとも8ナノ秒のパルス持続時間と少なくとも50キロヘルツのパルス周波数と、近赤外線基本振動数での波長とを備えた選択されたパワーのパルスレーザビームを提供し、
1又はそれ以上のコーティング層を介してオーバーラッピングアブレーションを提供するために、他の表面でコーティングを通してガラスシート基板の非コーティング表面に向かって、パルスレーザビームを各々反射する複数のXYZガルバノメータ制御ミラーシステムとを有し、少なくとも1000mm/秒の速度でスクライビングする、
ことを特徴とするレーザスクライビングのための装置。 - パルス周波数が50乃至100キロヘルツのレンジであり、パルス持続時間が8乃至70ナノ秒のレンジであることを特徴とする請求項1に記載の方法。
- パルス周波数が50乃至100キロヘルツのレンジであり、パルス持続時間が8乃至70ナノ秒のレンジであることを特徴とする請求項9に記載の方法。
- パルス周波数が50乃至100キロヘルツのレンジであり、パルス持続時間が8乃至70ナノ秒のレンジであることを特徴とする請求項10に記載の装置。
- パルス周波数が50乃至100キロヘルツのレンジであり、パルス持続時間が8乃至70ナノ秒のレンジであることを特徴とする請求項14に記載の装置。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/928,203 US6559411B2 (en) | 2001-08-10 | 2001-08-10 | Method and apparatus for laser scribing glass sheet substrate coatings |
| US09/928,203 | 2001-08-10 |
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| JP2003518767A Division JP4429013B2 (ja) | 2001-08-10 | 2002-08-07 | ガラスシート基板コーティングをレーザスクライビングするための方法及び装置 |
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| JP2010012519A true JP2010012519A (ja) | 2010-01-21 |
| JP5280978B2 JP5280978B2 (ja) | 2013-09-04 |
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| JP2009204219A Expired - Lifetime JP5280978B2 (ja) | 2001-08-10 | 2009-09-04 | ガラスシート基板コーティングをレーザスクライビングするための方法及び装置 |
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| EP (1) | EP1423229B1 (ja) |
| JP (2) | JP4429013B2 (ja) |
| TW (1) | TW572804B (ja) |
| WO (1) | WO2003013778A1 (ja) |
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| TWI555599B (zh) * | 2013-02-25 | 2016-11-01 | 先進科技新加坡有限公司 | 在雷射劃刻裝置中執行光束特徵化之方法,及可執行此方法之雷射劃刻裝置 |
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Cited By (1)
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| TWI555599B (zh) * | 2013-02-25 | 2016-11-01 | 先進科技新加坡有限公司 | 在雷射劃刻裝置中執行光束特徵化之方法,及可執行此方法之雷射劃刻裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005519762A (ja) | 2005-07-07 |
| WO2003013778B1 (en) | 2003-08-14 |
| US6559411B2 (en) | 2003-05-06 |
| JP4429013B2 (ja) | 2010-03-10 |
| WO2003013778A1 (en) | 2003-02-20 |
| EP1423229A1 (en) | 2004-06-02 |
| JP5280978B2 (ja) | 2013-09-04 |
| US9457429B2 (en) | 2016-10-04 |
| US20050016972A1 (en) | 2005-01-27 |
| TW572804B (en) | 2004-01-21 |
| US20030029848A1 (en) | 2003-02-13 |
| US20030209527A1 (en) | 2003-11-13 |
| US6919530B2 (en) | 2005-07-19 |
| EP1423229A4 (en) | 2009-11-04 |
| EP1423229B1 (en) | 2016-02-24 |
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