JP2013541421A - シリンダの縦軸線を中心とする加工ヘッドの旋回によりフレキシブルな帯を彫刻する方法及び装置 - Google Patents
シリンダの縦軸線を中心とする加工ヘッドの旋回によりフレキシブルな帯を彫刻する方法及び装置 Download PDFInfo
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- 239000011261 inert gas Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
- B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
- B41F17/08—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on filamentary or elongated articles, or on articles with cylindrical surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/24—Ablative recording, e.g. by burning marks; Spark recording
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- B23K2101/00—Articles made by soldering, welding or cutting
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- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
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- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
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Abstract
Description
本発明の根底を成す課題は、個々の加工ヘッドを用いて閉じたカーブを彫刻することである。
公知の方法から出発して、本発明によれば、加工ヘッドが駆動装置によりシリンダの縦軸線を中心に旋回可能であることが提案される。そうすると加工ヘッドは、特に簡単に支持面に対して一定の間隔でシリンダの周方向及び/又は縦方向に運動することができる。ロールから帯を一定に送りながら、同時に周方向に加工ヘッドを運動させることにより、局所的に、ベルト上の工具の送りが加速又は減速される。工具としてレーザ光線を使用する場合、一定のレーザ出力で、彫刻は、相応に強弱される。シリンダの縦方向の加工ヘッドの運動と組み合わせて、例えば横線やループ状の軌道のような任意の彫刻が可能になる。レーザ出力を同時に適合させると、又はロールからの可変の送りにより、そのような任意の彫刻は、局所的に一定の出力値で行うこともできる。
Claims (7)
- 帯(4)を、前記帯(4)の長手方向に運動させ、その際、支持面(3)としてのシリンダ(2)の表面セグメント上で前記シリンダ(2)の周方向(10)に案内し、加工ヘッド(5)から前記支持面(3)に向けられた少なくとも1つの工具(6)により彫刻する、フレキシブルな帯(4)を彫刻する方法であって、
前記加工ヘッド(5)を、前記支持面(3)の上側で、前記シリンダ(2)の縦軸線(15)を中心に旋回させることを特徴とする、フレキシブルな帯を彫刻する方法。 - 前記少なくとも1つの工具(6)は、レーザ光線である、請求項1記載の彫刻方法。
- レーザ光線を、先ず前記シリンダ(2)の縦軸線(15)上で案内し、次いで前記シリンダ(2)の半径方向(17)に案内し、そのあとで前記シリンダ(2)の縦方向(18)に案内して、前記加工ヘッド(5)内で前記支持面(3)に向かって変向させる、請求項2記載の彫刻方法。
- 複数のレーザ光線を前記加工ヘッド(5)内で分割して、相互に平行に前記支持面(3)に向ける、請求項2又は3記載の彫刻方法。
- 帯(4)の長手方向に前記帯(4)を運動させる送り装置と、支持面(3)としてのシリンダ(2)の表面セグメントを介して前記シリンダ(2)の周方向(10)に前記帯(4)を案内する案内装置と、前記支持面(3)に向けられた少なくとも1つの工具(6)により前記帯(4)を彫刻する、前記支持面(3)に向けられた加工ヘッド(5)と、前記加工ヘッド(5)を運動させる駆動装置とを備える、フレキシブルな帯(4)を彫刻する装置(1)であって、
前記加工ヘッド(5)は、前記駆動装置により、前記シリンダ(2)の縦軸線(15)を中心に旋回可能であることを特徴とする、フレキシブルな帯を彫刻する装置。 - 前記シリンダ(2)は、前記シリンダ(2)の縦軸線(15)を中心に前記彫刻装置(1)に回転可能に支持されている、請求項5記載の彫刻装置。
- 前記少なくとも1つの工具(6)は、前記帯(4)の送り方向とは逆向きに、垂線(21)に対して30°〜60°の当て付け角度(20)で、前記支持面(3)に当て付けられている、請求項5又は6記載の彫刻装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010038259.0 | 2010-10-19 | ||
DE102010038259A DE102010038259B4 (de) | 2010-10-19 | 2010-10-19 | Verfahren und Vorrichtung zum Gravieren eines flexiblen Bands |
PCT/EP2011/066325 WO2012052241A1 (de) | 2010-10-19 | 2011-09-20 | Verfahren und vorrichtung zum gravieren eines flexiblen bands mit schwenkung des bearbeitungskopfes um eine längsachse eines zylinders |
Publications (2)
Publication Number | Publication Date |
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JP2013541421A true JP2013541421A (ja) | 2013-11-14 |
JP5763201B2 JP5763201B2 (ja) | 2015-08-12 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2013534228A Expired - Fee Related JP5763201B2 (ja) | 2010-10-19 | 2011-09-20 | シリンダの縦軸線を中心とする加工ヘッドの旋回によりフレキシブルな帯を彫刻する方法及び装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9132509B2 (ja) |
JP (1) | JP5763201B2 (ja) |
KR (1) | KR20130103554A (ja) |
CN (1) | CN103228395B (ja) |
DE (1) | DE102010038259B4 (ja) |
WO (1) | WO2012052241A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104669909B (zh) * | 2014-12-31 | 2017-01-11 | 山东晨灿机械设备股份有限公司 | 雕刻摇摆头 |
US10507642B2 (en) * | 2015-01-23 | 2019-12-17 | Hp Indigo B.V. | Roller arrangement, a method of forming a pattern, a method of printing a pattern and apparatus for printing a pattern |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5594790A (en) * | 1979-01-15 | 1980-07-18 | Centre Rech Metallurgique | Device and method of drilling surface of cylinder of rolling mill |
JP2001265414A (ja) * | 2000-03-15 | 2001-09-28 | Yamanashi Prefecture | 球形状等立体形状物の加工方法及び加工装置 |
JP2003334673A (ja) * | 2002-05-17 | 2003-11-25 | Fuji Electric Co Ltd | 薄膜のレーザ加工方法および装置 |
WO2008149949A1 (ja) * | 2007-06-06 | 2008-12-11 | Nitto Denko Corporation | レーザー加工方法及びレーザー加工品 |
JP2012515654A (ja) * | 2009-01-22 | 2012-07-12 | シーエーヴィ アドヴァンスト テクノロジーズ リミテッド | 材料に穴を開けるための装置および方法 |
Family Cites Families (11)
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JPS60177985A (ja) * | 1984-02-24 | 1985-09-11 | Agency Of Ind Science & Technol | レ−ザ加工装置 |
US5967394A (en) * | 1994-11-04 | 1999-10-19 | Roll Systems, Inc. | Method and apparatus for pinless feeding of web to a utilization device |
JP3210251B2 (ja) * | 1996-07-09 | 2001-09-17 | シャープ株式会社 | レーザーパターニング装置 |
CN1140376C (zh) * | 2001-02-28 | 2004-03-03 | 广州市镭密加激光科技有限公司 | Yag激光雕刻陶瓷网纹辊的方法 |
US6794604B2 (en) * | 2003-02-19 | 2004-09-21 | Preco Laser Systems, Llc | Web securing system for laser processing |
JP4288091B2 (ja) * | 2003-03-27 | 2009-07-01 | 株式会社アマダ | 板材加工装置及び板材加工方法 |
JP2009511276A (ja) * | 2005-10-11 | 2009-03-19 | ジーエスアイ・グループ・コーポレーション | 光学的計測用スケールおよびそのレーザー式製造法 |
DE102007034644A1 (de) * | 2007-07-23 | 2009-01-29 | Thüringisches Institut für Textil- und Kunststoff-Forschung e.V. | Verfahren und Vorrichtung zur Laserstrukturierung von Solarzellen |
US8420979B2 (en) * | 2007-07-24 | 2013-04-16 | Flisom Ag | Method and apparatus for laser beam processing of an element with total transmission for light of a t least 10-5 |
JP2010165879A (ja) * | 2009-01-16 | 2010-07-29 | Fujifilm Corp | スクライブ加工装置、及びスクライブ加工方法 |
GB2482868A (en) | 2010-08-16 | 2012-02-22 | Franciscus Wilhelmus Henricus Maria Merkus | A testosterone liquid spray formulation for oromucosal administration |
-
2010
- 2010-10-19 DE DE102010038259A patent/DE102010038259B4/de not_active Expired - Fee Related
-
2011
- 2011-09-20 JP JP2013534228A patent/JP5763201B2/ja not_active Expired - Fee Related
- 2011-09-20 WO PCT/EP2011/066325 patent/WO2012052241A1/de active Application Filing
- 2011-09-20 CN CN201180050324.0A patent/CN103228395B/zh not_active Expired - Fee Related
- 2011-09-20 KR KR1020137012620A patent/KR20130103554A/ko not_active Application Discontinuation
-
2013
- 2013-04-18 US US13/865,263 patent/US9132509B2/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5594790A (en) * | 1979-01-15 | 1980-07-18 | Centre Rech Metallurgique | Device and method of drilling surface of cylinder of rolling mill |
JP2001265414A (ja) * | 2000-03-15 | 2001-09-28 | Yamanashi Prefecture | 球形状等立体形状物の加工方法及び加工装置 |
JP2003334673A (ja) * | 2002-05-17 | 2003-11-25 | Fuji Electric Co Ltd | 薄膜のレーザ加工方法および装置 |
WO2008149949A1 (ja) * | 2007-06-06 | 2008-12-11 | Nitto Denko Corporation | レーザー加工方法及びレーザー加工品 |
JP2012515654A (ja) * | 2009-01-22 | 2012-07-12 | シーエーヴィ アドヴァンスト テクノロジーズ リミテッド | 材料に穴を開けるための装置および方法 |
Also Published As
Publication number | Publication date |
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US20140144894A1 (en) | 2014-05-29 |
US9132509B2 (en) | 2015-09-15 |
CN103228395A (zh) | 2013-07-31 |
WO2012052241A1 (de) | 2012-04-26 |
DE102010038259B4 (de) | 2013-02-07 |
CN103228395B (zh) | 2017-07-07 |
JP5763201B2 (ja) | 2015-08-12 |
DE102010038259A1 (de) | 2012-04-19 |
KR20130103554A (ko) | 2013-09-23 |
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