WO2012052241A1 - Verfahren und vorrichtung zum gravieren eines flexiblen bands mit schwenkung des bearbeitungskopfes um eine längsachse eines zylinders - Google Patents
Verfahren und vorrichtung zum gravieren eines flexiblen bands mit schwenkung des bearbeitungskopfes um eine längsachse eines zylinders Download PDFInfo
- Publication number
- WO2012052241A1 WO2012052241A1 PCT/EP2011/066325 EP2011066325W WO2012052241A1 WO 2012052241 A1 WO2012052241 A1 WO 2012052241A1 EP 2011066325 W EP2011066325 W EP 2011066325W WO 2012052241 A1 WO2012052241 A1 WO 2012052241A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cylinder
- support surface
- belt
- engraving
- machining head
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000003754 machining Methods 0.000 claims description 30
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 description 11
- 239000007789 gas Substances 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/24—Ablative recording, e.g. by burning marks; Spark recording
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0838—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt
- B23K26/0846—Devices involving movement of the workpiece in at least one axial direction by using an endless conveyor belt for moving elongated workpieces longitudinally, e.g. wire or strip material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
- B41F17/08—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for for printing on filamentary or elongated articles, or on articles with cylindrical surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
- H10K30/80—Constructional details
- H10K30/81—Electrodes
- H10K30/82—Transparent electrodes, e.g. indium tin oxide [ITO] electrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/16—Bands or sheets of indefinite length
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Definitions
- the invention relates to a method and apparatus for engraving a flexible belt with a propulsion device for moving the tape in a longitudinal direction of the belt, with a guide means for guiding the tape in a circumferential direction of a cylinder over a surface segment of the cylinder as a support surface, with a on the support surface directed machining head for engraving the tape by means of at least one directed onto the support surface tool, and with a drive means for moving the machining head.
- Methods and devices of the aforementioned type are used in particular for structuring flexible solar modules, which are present as a multi-layered strip on rolls, in a continuous process.
- a laser beam as a tool, one or more functional layers of the tape are removed in order to separate individual solar cells from one another or from edge regions of the roll material or to prepare trenches for printed conductors.
- a method and a device of the aforementioned type is known from JP 10-27918 A.
- the machining head of the device proposed there is displaceable along the longitudinal axis of the cylinder.
- the invention has for its object to engrave a single curve with a single processing head.
- the machining head is pivotable about a longitudinal axis of the cylinder by means of the drive means.
- the machining head can be moved particularly easily at a constant distance from the support surface in the circumferential and / or longitudinal direction of the cylinder.
- the feed of the tool is accelerated or slowed down on the tape.
- the engraving is correspondingly attenuated or intensified at a constant laser power.
- the longitudinal direction of the cylinder can be any engraving possible, such as cross lines or loops in loop form. While adjusting the
- Laser power or variable feed from the role of such arbitrary engraving can also be performed with locally constant power input.
- the at least one tool is a laser beam.
- the at least one tool may also be a needle for mechanically scoring the band.
- the laser beam is preferably first guided in a longitudinal axis of the cylinder, then deflected in a radial direction, then in a longitudinal direction of the cylinder and in the machining head onto the support surface.
- the beam guide first in the longitudinal axis of the cylinder, the deflection is simplified in the plane of a pivotable about this longitudinal machining head: For this purpose, only a single, fixed to the pivoted unit deflection is required, the machining head can be pivoted without the laser beam actively tracked would have to be.
- Radial direction is the deflection in the plane of a radially adjustable
- a plurality of the laser beams are divided in the machining head and parallel to the
- the cylinder is rotatably mounted on a device according to the invention about a longitudinal axis of the cylinder.
- a device according to the invention, either the cylinder may be driven by the belt or the cylinder may drive the belt.
- the circumferential speed then corresponds in each case substantially to the
- any pattern can be produced on the continuously moving belt, provided that the pattern in the direction of the belt is no longer than half the contact surface on the cylinder.
- each tool of a machining head can generate the same pattern in parallel.
- Such patterns are particularly important in photovoltaics, as can be so
- the head For the transverse lines in the circumferential direction of the cylinder, once the head is moved faster than the tape in the feed direction and once against the feed direction. For the longitudinal lines in the longitudinal direction of the cylinder, the head is the same
- such a device according to the invention comprises drive elements for moving in a longitudinal direction and / or for moving in a radial direction of the cylinder.
- the distance of the machining head to the support surface can be adjusted. This is particularly important when using a laser beam as a tool when processing a tape with different thicknesses, the laser spot diameter on the tape or the laser power applied to the tape to be adapted locally.
- the tool is employed against the advancing direction of the belt by an angle of attack of 30 to 60 ° relative to a solder on the support surface.
- this hits the tape at the angle of attack.
- chopping off flaking material is not guided back into the laser beam, in particular there is not heated, evaporated or splintered and does not affect the further processing.
- the cylinder surface is advantageously made of a material that is neither removed by the laser radiation or otherwise permanently influenced, nor reflected the laser radiation back so that the back-reflected radiation adversely affects the material to be processed.
- Fig. 1 shows a device according to the invention in a side view
- FIG. 3a shows a engravable with a device according to the invention pattern
- Fig. 3b shows a detail of this pattern.
- the inventive device 1 shown in Figures 1 and 2 has a
- Cylinder 2 with a support surface 3 for supporting a flexible belt 4 and a
- the band 4 is a multilayered one
- the cylinder 2 has a diameter 13 of 30 cm and a width 14, which exceeds the width 7 of the precursor by 2 to 4 cm, is rotatably mounted on the device 1 about its longitudinal axis 15 and is - as well as the guide rollers 9, 11th - taken from the band 4.
- a brake not shown, on the first roller 8, the band 4 is easily kept under tension.
- the surface 16 of the cylinder 2 is ceramic coated and is actively cooled.
- the machining head 5 is also pivotally mounted on the device 1 about the longitudinal axis 15 and provided with a pivot drive, as well as one drive for the process in the radial direction 17 and in a longitudinal direction 18 of the cylinder 2.
- the pivot drive and the two other drives of the machining head 5 are not shown.
- the laser beams are starting from a pulsed, not shown
- Processing head 5 the laser beams are divided and performed in parallel on the support surface 3.
- the individual laser beams can be moved against each other with single heads, not shown.
- the laser beams are employed against the advancing direction of the belt 4 by an angle of attack 20 of 45 ° with respect to a solder 21 on the support surface 3. This avoids that material removed from the belt 4 influences the laser beam and thus the processing, that the laser beam heats the flaked material, evaporates it or further bursts and that the partial products are conveyed back to the surface to be processed.
- the device 1 according to the invention has gas nozzles (not shown) near the points of incidence of the laser beams on the belt 4 for introducing compressed air, inert gas or process-supporting gas. The gas supports this in the ongoing process
- the device 1 according to the invention also has a recognition sensor, not shown, which recognizes structures on or on the film (in particular edges, structures or markings which were applied in preliminary processes). With the device 1 according to the invention structures can thus be produced on the belt 4, which are aligned very precisely to existing structures.
- Processing head 5 with which, for example, a delamination "on the fly", ie during the forward movement and transverse to the direction of conveyance can be done without the machining distance changes.On prolonged processing, the heat introduced can also be dissipated into the material through the roller.
- the device 1 according to the invention is a pilot plant.
- the productive use of another device according to the invention appears useful with precursors in widths up to 150 cm, in particular 120 cm or other multiples of 30 cm.
- Diameter of the cylinder 2 should not be chosen in another device according to the invention not smaller than 10 cm and not larger than 100 cm, on the one hand the
- Other devices according to the invention may have other laser parameters, in particular other wavelengths and pulse durations.
- different wavelengths are chosen to maximize absorption in the layer to be removed while increasing the absorption of the remaining material
- FIG. 3 a shows a pattern 22 engravable with the device 1 according to the invention for a flexible module (not shown) in monolithic configuration.
- the pattern consists of nine blocks 23, each with three equidistant transverse lines 24, 25, 26 in the circumferential direction 10 and two parallel longitudinal lines 27, 28 in the longitudinal direction 18 of the cylinder 2.
- Each block 23 is used with exactly one of the tools 6 according to the in FIG 3b engraved machining process, during the processing, the belt 4 is driven by means of the cylinder 2 continuously in a feed direction 29. Starting from a starting point a on the moving belt, the tool 6 first engraves the first transverse line 24 up to the second point b.
- the tool 6 moves empty to a third point c and from there to a fourth point d engraves the second transverse line 25 Then the tool 6 moves empty to a fifth point e and from there engraves the first longitudinal line 27 up to the sixth point f. In the next step, the tool 6 again moves empty to the seventh point g and engraves the third transverse line 26 up to the eighth point h. Finally, the tool 6 moves to the ninth point j empty and engraves the second longitudinal line 28 up to the tenth point k,
- Processing head 5 and moves simultaneously in or against the longitudinal direction of the
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013534228A JP5763201B2 (ja) | 2010-10-19 | 2011-09-20 | シリンダの縦軸線を中心とする加工ヘッドの旋回によりフレキシブルな帯を彫刻する方法及び装置 |
CN201180050324.0A CN103228395B (zh) | 2010-10-19 | 2011-09-20 | 通过加工头围绕圆柱体的纵向轴线的摆动来雕刻柔性带状物的方法和装置 |
KR1020137012620A KR20130103554A (ko) | 2010-10-19 | 2011-09-20 | 실린더의 종축을 중심으로 가공 헤드가 선회되는, 가요성 스트립에 각인하기 위한 방법 및 장치 |
US13/865,263 US9132509B2 (en) | 2010-10-19 | 2013-04-18 | Method and apparatus for engraving a flexible strip with pivoting a processing head about a longitudinal axis of a cylinder |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010038259.0 | 2010-10-19 | ||
DE102010038259A DE102010038259B4 (de) | 2010-10-19 | 2010-10-19 | Verfahren und Vorrichtung zum Gravieren eines flexiblen Bands |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/865,263 Continuation US9132509B2 (en) | 2010-10-19 | 2013-04-18 | Method and apparatus for engraving a flexible strip with pivoting a processing head about a longitudinal axis of a cylinder |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012052241A1 true WO2012052241A1 (de) | 2012-04-26 |
Family
ID=44653338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2011/066325 WO2012052241A1 (de) | 2010-10-19 | 2011-09-20 | Verfahren und vorrichtung zum gravieren eines flexiblen bands mit schwenkung des bearbeitungskopfes um eine längsachse eines zylinders |
Country Status (6)
Country | Link |
---|---|
US (1) | US9132509B2 (de) |
JP (1) | JP5763201B2 (de) |
KR (1) | KR20130103554A (de) |
CN (1) | CN103228395B (de) |
DE (1) | DE102010038259B4 (de) |
WO (1) | WO2012052241A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104669909B (zh) * | 2014-12-31 | 2017-01-11 | 山东晨灿机械设备股份有限公司 | 雕刻摇摆头 |
WO2016116168A1 (en) | 2015-01-23 | 2016-07-28 | Hewlett-Packard Indigo B.V. | A roller arrangement, forming a pattern, and printing a pattern |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60177985A (ja) * | 1984-02-24 | 1985-09-11 | Agency Of Ind Science & Technol | レ−ザ加工装置 |
JPH1027918A (ja) | 1996-07-09 | 1998-01-27 | Sharp Corp | レーザーパターニング装置 |
US20040159637A1 (en) * | 2003-02-19 | 2004-08-19 | Preco Laser Systems, Llc | Web securing system for laser processing |
DE102007034644A1 (de) | 2007-07-23 | 2009-01-29 | Thüringisches Institut für Textil- und Kunststoff-Forschung e.V. | Verfahren und Vorrichtung zur Laserstrukturierung von Solarzellen |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
LU80792A1 (fr) * | 1979-01-15 | 1980-08-08 | Ntre De Rech Metallurg Ct Voor | Dispsitif et procede pour effectuer des perforations a la surface des cylindres de laminoirs |
US5967394A (en) * | 1994-11-04 | 1999-10-19 | Roll Systems, Inc. | Method and apparatus for pinless feeding of web to a utilization device |
JP2001265414A (ja) * | 2000-03-15 | 2001-09-28 | Yamanashi Prefecture | 球形状等立体形状物の加工方法及び加工装置 |
CN1140376C (zh) * | 2001-02-28 | 2004-03-03 | 广州市镭密加激光科技有限公司 | Yag激光雕刻陶瓷网纹辊的方法 |
JP3956200B2 (ja) * | 2002-05-17 | 2007-08-08 | 富士電機ホールディングス株式会社 | 薄膜のレーザ加工方法および装置 |
JP4288091B2 (ja) * | 2003-03-27 | 2009-07-01 | 株式会社アマダ | 板材加工装置及び板材加工方法 |
CN101356304B (zh) * | 2005-10-11 | 2012-10-31 | Gsi集团公司 | 光学计量度盘及其基于激光的制造方法 |
JP5202876B2 (ja) * | 2007-06-06 | 2013-06-05 | 日東電工株式会社 | レーザー加工方法及びレーザー加工品 |
US8420979B2 (en) * | 2007-07-24 | 2013-04-16 | Flisom Ag | Method and apparatus for laser beam processing of an element with total transmission for light of a t least 10-5 |
JP2010165879A (ja) * | 2009-01-16 | 2010-07-29 | Fujifilm Corp | スクライブ加工装置、及びスクライブ加工方法 |
GB2467296B (en) * | 2009-01-22 | 2012-06-20 | Cav Advanced Technologies Ltd | Apparatus and method for perforating material |
GB2482868A (en) | 2010-08-16 | 2012-02-22 | Franciscus Wilhelmus Henricus Maria Merkus | A testosterone liquid spray formulation for oromucosal administration |
-
2010
- 2010-10-19 DE DE102010038259A patent/DE102010038259B4/de not_active Expired - Fee Related
-
2011
- 2011-09-20 KR KR1020137012620A patent/KR20130103554A/ko not_active Application Discontinuation
- 2011-09-20 CN CN201180050324.0A patent/CN103228395B/zh not_active Expired - Fee Related
- 2011-09-20 JP JP2013534228A patent/JP5763201B2/ja not_active Expired - Fee Related
- 2011-09-20 WO PCT/EP2011/066325 patent/WO2012052241A1/de active Application Filing
-
2013
- 2013-04-18 US US13/865,263 patent/US9132509B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60177985A (ja) * | 1984-02-24 | 1985-09-11 | Agency Of Ind Science & Technol | レ−ザ加工装置 |
JPH1027918A (ja) | 1996-07-09 | 1998-01-27 | Sharp Corp | レーザーパターニング装置 |
US20040159637A1 (en) * | 2003-02-19 | 2004-08-19 | Preco Laser Systems, Llc | Web securing system for laser processing |
DE102007034644A1 (de) | 2007-07-23 | 2009-01-29 | Thüringisches Institut für Textil- und Kunststoff-Forschung e.V. | Verfahren und Vorrichtung zur Laserstrukturierung von Solarzellen |
Also Published As
Publication number | Publication date |
---|---|
JP5763201B2 (ja) | 2015-08-12 |
JP2013541421A (ja) | 2013-11-14 |
DE102010038259A1 (de) | 2012-04-19 |
CN103228395B (zh) | 2017-07-07 |
KR20130103554A (ko) | 2013-09-23 |
US20140144894A1 (en) | 2014-05-29 |
US9132509B2 (en) | 2015-09-15 |
DE102010038259B4 (de) | 2013-02-07 |
CN103228395A (zh) | 2013-07-31 |
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