JP2010010224A - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
JP2010010224A
JP2010010224A JP2008164892A JP2008164892A JP2010010224A JP 2010010224 A JP2010010224 A JP 2010010224A JP 2008164892 A JP2008164892 A JP 2008164892A JP 2008164892 A JP2008164892 A JP 2008164892A JP 2010010224 A JP2010010224 A JP 2010010224A
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JP
Japan
Prior art keywords
film
metal
metal film
semiconductor region
gate electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008164892A
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English (en)
Japanese (ja)
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JP2010010224A5 (enExample
Inventor
Naohisa Sengoku
直久 仙石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2008164892A priority Critical patent/JP2010010224A/ja
Priority to PCT/JP2009/000827 priority patent/WO2009157113A1/ja
Publication of JP2010010224A publication Critical patent/JP2010010224A/ja
Priority to US12/712,688 priority patent/US8004046B2/en
Publication of JP2010010224A5 publication Critical patent/JP2010010224A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • H10D84/0172—Manufacturing their gate conductors
    • H10D84/0177—Manufacturing their gate conductors the gate conductors having different materials or different implants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/013—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator
    • H10D64/01302—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H10D64/01304—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H10D64/01306—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon
    • H10D64/01308—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon the conductor further comprising a non-elemental silicon additional conductive layer, e.g. a metal silicide layer formed by the reaction of silicon with an implanted metal
    • H10D64/0131—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon the conductor further comprising a non-elemental silicon additional conductive layer, e.g. a metal silicide layer formed by the reaction of silicon with an implanted metal the additional conductive layer comprising a silicide layer formed by the silicidation reaction between the layer of silicon with a metal layer which is not formed by metal implantation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/01—Manufacture or treatment
    • H10D64/013—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator
    • H10D64/01302—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H10D64/01304—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
    • H10D64/01318—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/661—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation
    • H10D64/662—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of silicon contacting the insulator, e.g. polysilicon having vertical doping variation the conductor further comprising additional layers, e.g. multiple silicon layers having different crystal structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/667—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes the conductor comprising a layer of alloy material, compound material or organic material contacting the insulator, e.g. TiN workfunction layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2008164892A 2008-06-24 2008-06-24 半導体装置及びその製造方法 Pending JP2010010224A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008164892A JP2010010224A (ja) 2008-06-24 2008-06-24 半導体装置及びその製造方法
PCT/JP2009/000827 WO2009157113A1 (ja) 2008-06-24 2009-02-25 半導体装置及びその製造方法
US12/712,688 US8004046B2 (en) 2008-06-24 2010-02-25 Semiconductor device and method for fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008164892A JP2010010224A (ja) 2008-06-24 2008-06-24 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2010010224A true JP2010010224A (ja) 2010-01-14
JP2010010224A5 JP2010010224A5 (enExample) 2010-04-02

Family

ID=41444186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008164892A Pending JP2010010224A (ja) 2008-06-24 2008-06-24 半導体装置及びその製造方法

Country Status (3)

Country Link
US (1) US8004046B2 (enExample)
JP (1) JP2010010224A (enExample)
WO (1) WO2009157113A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011071402A (ja) * 2009-09-28 2011-04-07 Panasonic Corp 半導体装置の製造方法及びそれを用いた半導体装置
US8378428B2 (en) * 2010-09-29 2013-02-19 Taiwan Semiconductor Manufacturing Company, Ltd. Metal gate structure of a semiconductor device
US9041114B2 (en) * 2013-05-20 2015-05-26 Kabushiki Kaisha Toshiba Contact plug penetrating a metallic transistor

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05206461A (ja) * 1992-01-14 1993-08-13 Nec Corp 半導体装置の製造方法
WO2001071807A1 (en) * 2000-03-24 2001-09-27 Fujitsu Limited Semiconductor device and method of manufacture thereof
JP2005236120A (ja) * 2004-02-20 2005-09-02 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JP2006237372A (ja) * 2005-02-25 2006-09-07 Toshiba Corp 半導体装置
JP2006523008A (ja) * 2001-05-26 2006-10-05 フリースケール セミコンダクター インコーポレイテッド 半導体素子とその作製法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3394022B2 (ja) 1999-08-16 2003-04-07 松下電器産業株式会社 半導体装置及びその製造方法
JP3247099B2 (ja) 2000-01-20 2002-01-15 松下電器産業株式会社 電極構造体の形成方法及び半導体装置の製造方法
US6509254B1 (en) 2000-01-20 2003-01-21 Matsushita Electric Industrial Co., Ltd. Method of forming electrode structure and method of fabricating semiconductor device
JP2007088122A (ja) 2005-09-21 2007-04-05 Renesas Technology Corp 半導体装置
KR100741857B1 (ko) 2006-05-03 2007-07-24 삼성전자주식회사 계면 저항을 줄일 수 있는 게이트 콘택 구조체를 구비하는반도체 장치 및 그 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05206461A (ja) * 1992-01-14 1993-08-13 Nec Corp 半導体装置の製造方法
WO2001071807A1 (en) * 2000-03-24 2001-09-27 Fujitsu Limited Semiconductor device and method of manufacture thereof
JP2006523008A (ja) * 2001-05-26 2006-10-05 フリースケール セミコンダクター インコーポレイテッド 半導体素子とその作製法
JP2005236120A (ja) * 2004-02-20 2005-09-02 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
JP2006237372A (ja) * 2005-02-25 2006-09-07 Toshiba Corp 半導体装置

Also Published As

Publication number Publication date
US8004046B2 (en) 2011-08-23
US20100148281A1 (en) 2010-06-17
WO2009157113A1 (ja) 2009-12-30

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