JP2010003739A - 基板洗浄装置 - Google Patents
基板洗浄装置 Download PDFInfo
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- JP2010003739A JP2010003739A JP2008159034A JP2008159034A JP2010003739A JP 2010003739 A JP2010003739 A JP 2010003739A JP 2008159034 A JP2008159034 A JP 2008159034A JP 2008159034 A JP2008159034 A JP 2008159034A JP 2010003739 A JP2010003739 A JP 2010003739A
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- cleaning
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- 238000004140 cleaning Methods 0.000 title claims abstract description 207
- 239000000758 substrate Substances 0.000 title claims abstract description 85
- 230000007246 mechanism Effects 0.000 claims abstract description 61
- 239000007788 liquid Substances 0.000 claims abstract description 36
- 238000003825 pressing Methods 0.000 claims abstract description 12
- 238000009826 distribution Methods 0.000 claims abstract description 9
- 230000002093 peripheral effect Effects 0.000 claims description 82
- 230000008859 change Effects 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 25
- 229920005989 resin Polymers 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 19
- 238000005406 washing Methods 0.000 claims description 17
- 230000001965 increasing effect Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- 230000006870 function Effects 0.000 description 9
- 235000019589 hardness Nutrition 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 7
- 230000003028 elevating effect Effects 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B9/00—Arrangements of the bristles in the brush body
- A46B9/06—Arrangement of mixed bristles or tufts of bristles, e.g. wire, fibre, rubber
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B13/00—Brushes with driven brush bodies or carriers
- A46B13/008—Disc-shaped brush bodies
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B15/00—Other brushes; Brushes with additional arrangements
- A46B15/0002—Arrangements for enhancing monitoring or controlling the brushing process
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B15/00—Other brushes; Brushes with additional arrangements
- A46B15/0002—Arrangements for enhancing monitoring or controlling the brushing process
- A46B15/0004—Arrangements for enhancing monitoring or controlling the brushing process with a controlling means
- A46B15/0006—Arrangements for enhancing monitoring or controlling the brushing process with a controlling means with a controlling brush technique device, e.g. stroke movement measuring device
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- A—HUMAN NECESSITIES
- A46—BRUSHWARE
- A46B—BRUSHES
- A46B2200/00—Brushes characterized by their functions, uses or applications
- A46B2200/30—Brushes for cleaning or polishing
- A46B2200/3073—Brush for cleaning specific unusual places not otherwise covered, e.g. gutters, golf clubs, tops of tin cans, corners
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biophysics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
【解決手段】基板洗浄装置1は、基板Wを回転可能に保持するスピンチャック3と、スピンチャック3に保持されている基板Wを回転するモーター4と、スピンチャック3に保持されている基板Wに洗浄液を供給する洗浄液供給機構10と、洗浄時に基板Wの周縁部に接触する周縁部洗浄部21cを有するブラシ21、ブラシ21を回転させる回転機構33,34、およびブラシ21をウエハWに押しつける押しつけ機構27を有する洗浄機構20とを具備する。周縁部洗浄部21cは、径方向で洗浄力分布が形成されるように径方向に沿って状態が変化している状態変化部分52を有する。
【選択図】 図1
Description
2;チャンバ
3;スピンチャック
4;モーター
5;カップ
6;排気・排液管
7;搬入出口
10;洗浄液供給機構
11;洗浄液ノズル
12;洗浄液供給源
20;洗浄機構
21、21′、21″;ブラシ
21a;ブラシ支持軸
21b、21b′;端面洗浄部
21c、21c′;周縁部洗浄部
22;回転支持部材
23;ブラシ支持部材
25;回動アーム
26;シャフト部
27;回動・昇降部
30;制御部
61;コントローラ
W;半導体ウエハ(基板)
Claims (9)
- 基板の周縁部をブラシ洗浄する基板洗浄装置であって、
基板を回転可能に保持する基板保持機構と、
前記基板保持機構に保持されている基板を回転する基板回転機構と、
前記基板保持機構に保持されている基板に洗浄液を供給する洗浄液供給機構と、
洗浄時に基板の周縁部に接触する周縁部洗浄部を有するブラシと、前記周縁部洗浄部を基板の周縁部に押しつける押しつけ機構とを有する洗浄機構と
を具備し、
前記周縁部洗浄部は、径方向で洗浄力分布が形成されるように径方向に沿って状態が変化している状態変化部分を有することを特徴とする基板洗浄装置。 - 前記状態変化部分は、径方向に沿って、高さ、形状、硬さ、および材質の少なくとも1つが変化していることを特徴とする請求項1に記載の基板洗浄装置。
- 前記状態変化部分は、径方向に沿って複数の部分に分割されており、隣接する部分間で高さ、形状、硬さ、および材質の少なくとも1つが異なっていることを特徴とする請求項1または請求項2に記載の基板洗浄装置。
- 前記洗浄機構は、前記ブラシを回転させるブラシ回転機構をさらに有し、前記ブラシ回転機構により前記ブラシを回転しつつ前記押しつけ機構により前記周縁部洗浄部を基板の周縁部に押しつけて基板の周縁部を洗浄することを特徴とする請求項1から請求項3のいずれか1項に記載の基板洗浄装置。
- 前記周縁部洗浄部は、周方向に沿って複数のブラシ部に分割されており、隣接するブラシ部間で状態が異なっており、これら複数のブラシ部のうち少なくとも1つが前記状態変化部であることを特徴とする請求項4に記載の基板洗浄装置。
- 前記周縁部洗浄部は、ブラシ支持部材に支持されていることを特徴とする請求項1から請求項5のいずれか1項に記載の基板洗浄装置。
- 前記ブラシは、前記周縁部洗浄部と同軸状にかつ一体的に設けられ、基板の端面に接触する端面洗浄部を有することを特徴とする請求項1から請求項6のいずれか1項に記載の基板洗浄装置。
- 前記端面洗浄部は、スポンジ状樹脂からなることを特徴とする請求項7に記載の基板洗浄装置。
- 前記押しつけ機構は、前記端面洗浄部を基板端面に押しつけることを特徴とする請求項7または請求項8に記載の基板洗浄装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008159034A JP2010003739A (ja) | 2008-06-18 | 2008-06-18 | 基板洗浄装置 |
KR1020090049906A KR20090131642A (ko) | 2008-06-18 | 2009-06-05 | 기판 세정 장치 |
TW098119282A TW201010800A (en) | 2008-06-18 | 2009-06-09 | Substrate cleaning device |
US12/487,259 US20090313776A1 (en) | 2008-06-18 | 2009-06-18 | Substrate cleaning apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008159034A JP2010003739A (ja) | 2008-06-18 | 2008-06-18 | 基板洗浄装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012145965A Division JP2012182507A (ja) | 2012-06-28 | 2012-06-28 | 基板洗浄装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2010003739A true JP2010003739A (ja) | 2010-01-07 |
Family
ID=41429742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008159034A Pending JP2010003739A (ja) | 2008-06-18 | 2008-06-18 | 基板洗浄装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20090313776A1 (ja) |
JP (1) | JP2010003739A (ja) |
KR (1) | KR20090131642A (ja) |
TW (1) | TW201010800A (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015138929A (ja) * | 2014-01-24 | 2015-07-30 | 東京エレクトロン株式会社 | 接合システム、接合方法、プログラム、コンピュータ記憶媒体 |
JP2017005030A (ja) * | 2015-06-05 | 2017-01-05 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置及び記憶媒体 |
KR20170041266A (ko) | 2014-09-18 | 2017-04-14 | 샌트랄 글래스 컴퍼니 리미티드 | 웨이퍼의 세정방법 및 그 세정방법에 사용하는 약액 |
JP2019145687A (ja) * | 2018-02-21 | 2019-08-29 | 東京エレクトロン株式会社 | 洗浄具、基板洗浄装置及び基板洗浄方法 |
CN110948139A (zh) * | 2018-09-26 | 2020-04-03 | 天津龙净环保科技有限公司 | 一种焊接机器人的除尘装置 |
US10821483B2 (en) | 2016-09-21 | 2020-11-03 | SCREEN Holdings Co., Ltd. | Substrate treatment apparatus |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017030841A1 (en) * | 2015-08-14 | 2017-02-23 | M Cubed Technologies, Inc. | Method for removing contamination from a chuck surface |
US11766703B2 (en) * | 2018-08-15 | 2023-09-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus and method for wafer cleaning |
CN112967996B (zh) * | 2021-03-01 | 2024-01-05 | 昆山基侑电子科技有限公司 | 一种晶圆清洗固定装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08215645A (ja) * | 1995-02-14 | 1996-08-27 | Sony Corp | スクラブ洗浄装置 |
JPH08255776A (ja) * | 1995-01-19 | 1996-10-01 | Tokyo Electron Ltd | 洗浄装置および洗浄方法 |
JP2007273611A (ja) * | 2006-03-30 | 2007-10-18 | Sony Corp | 基板処理装置および基板処理方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0175278B1 (ko) * | 1996-02-13 | 1999-04-01 | 김광호 | 웨이퍼 세정장치 |
US5937469A (en) * | 1996-12-03 | 1999-08-17 | Intel Corporation | Apparatus for mechanically cleaning the edges of wafers |
JP4928343B2 (ja) * | 2007-04-27 | 2012-05-09 | 大日本スクリーン製造株式会社 | 基板処理装置 |
-
2008
- 2008-06-18 JP JP2008159034A patent/JP2010003739A/ja active Pending
-
2009
- 2009-06-05 KR KR1020090049906A patent/KR20090131642A/ko not_active Application Discontinuation
- 2009-06-09 TW TW098119282A patent/TW201010800A/zh unknown
- 2009-06-18 US US12/487,259 patent/US20090313776A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08255776A (ja) * | 1995-01-19 | 1996-10-01 | Tokyo Electron Ltd | 洗浄装置および洗浄方法 |
JPH08215645A (ja) * | 1995-02-14 | 1996-08-27 | Sony Corp | スクラブ洗浄装置 |
JP2007273611A (ja) * | 2006-03-30 | 2007-10-18 | Sony Corp | 基板処理装置および基板処理方法 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015138929A (ja) * | 2014-01-24 | 2015-07-30 | 東京エレクトロン株式会社 | 接合システム、接合方法、プログラム、コンピュータ記憶媒体 |
KR20170041266A (ko) | 2014-09-18 | 2017-04-14 | 샌트랄 글래스 컴퍼니 리미티드 | 웨이퍼의 세정방법 및 그 세정방법에 사용하는 약액 |
JP2017005030A (ja) * | 2015-06-05 | 2017-01-05 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置及び記憶媒体 |
US10821483B2 (en) | 2016-09-21 | 2020-11-03 | SCREEN Holdings Co., Ltd. | Substrate treatment apparatus |
JP2019145687A (ja) * | 2018-02-21 | 2019-08-29 | 東京エレクトロン株式会社 | 洗浄具、基板洗浄装置及び基板洗浄方法 |
CN110948139A (zh) * | 2018-09-26 | 2020-04-03 | 天津龙净环保科技有限公司 | 一种焊接机器人的除尘装置 |
CN110948139B (zh) * | 2018-09-26 | 2021-07-27 | 天津龙净环保科技有限公司 | 一种焊接机器人的除尘装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20090131642A (ko) | 2009-12-29 |
US20090313776A1 (en) | 2009-12-24 |
TW201010800A (en) | 2010-03-16 |
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Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20120403 |