JP2009544815A5 - - Google Patents
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- Publication number
- JP2009544815A5 JP2009544815A5 JP2009521906A JP2009521906A JP2009544815A5 JP 2009544815 A5 JP2009544815 A5 JP 2009544815A5 JP 2009521906 A JP2009521906 A JP 2009521906A JP 2009521906 A JP2009521906 A JP 2009521906A JP 2009544815 A5 JP2009544815 A5 JP 2009544815A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- acrylic acid
- flakes
- conductive
- precursor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 6
- 230000001070 adhesive Effects 0.000 claims 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 4
- 239000000203 mixture Substances 0.000 claims 4
- OZAIFHULBGXAKX-UHFFFAOYSA-N precursor Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims 4
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 claims 2
- RYNDYESLUKWOEE-UHFFFAOYSA-N 2-benzylprop-2-enoic acid Chemical compound OC(=O)C(=C)CC1=CC=CC=C1 RYNDYESLUKWOEE-UHFFFAOYSA-N 0.000 claims 2
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 claims 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N Itaconic acid Chemical compound OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims 2
- 229940088644 N,N-dimethylacrylamide Drugs 0.000 claims 2
- YLGYACDQVQQZSW-UHFFFAOYSA-N N,N-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 claims 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinylpyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 claims 2
- 125000005396 acrylic acid ester group Chemical group 0.000 claims 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 claims 2
- 125000004432 carbon atoms Chemical group C* 0.000 claims 2
- YNXCGLKMOXLBOD-UHFFFAOYSA-N oxolan-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CCCO1 YNXCGLKMOXLBOD-UHFFFAOYSA-N 0.000 claims 2
- 150000003509 tertiary alcohols Chemical class 0.000 claims 2
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000000379 polymerizing Effects 0.000 claims 1
Claims (9)
- アルキル基が平均４〜１４個の炭素原子を有する非三級アルコールのアクリル酸エステル、及び極性コモノマーを含む照射感応化無溶剤アクリル系感圧性接着剤前駆体の反応生成物と、
０よりも大きく５ｇ／立方センチメートル未満の密度を有する導電性フレークと、を含む、導電性接着剤。 - 前記導電性フレークが、前記接着剤組成物の５〜３５体積％を構成する、請求項１に記載の接着剤。
- 前記極性コモノマーは、アクリル酸、イタコン酸、Ｎ，Ｎジメチルアクリルアミド、Ｎ−ビニル−２−ピロリドン、Ｎ−ビニルカプロラクタム、アクリロニトリル、テトラヒドロフルフリルアクリレート、２−フェノキシエチルアクリレート、及びベンジルアクリレート、アクリル酸、並びにこれらの組み合わせから選択される、請求項１に記載の接着剤。
- ２０〜２００μｍの厚さを有する、請求項１に記載の接着剤を含むフィルム。
- 前記フレークが、前記フィルムの厚み全体に実質的に均一に分布されている、請求項４に記載のフィルム。
- 前記接着剤は、厚さ全体に亘って測定して４オーム未満の電気抵抗を有する、請求項４に記載のフィルム。
- ０よりも大きく５ｇ／立方センチメートル未満の密度を有する複数の導電性フレークを、アルキル基が平均４〜１４個の炭素原子を有する非三級アルコールのアクリル酸エステル、及び極性コモノマーを含む照射感応化無溶剤アクリル系感圧性接着剤前駆体と混合する工程と、
前記前駆体を重合して感圧性接着剤を形成する工程と、を含む、導電性感圧性接着剤の製造方法。 - 前記前駆体を混合する工程により、前記フレークが前記混合物中に懸濁される、請求項７に記載の方法。
- 前記極性コモノマーは、アクリル酸、イタコン酸、Ｎ，Ｎジメチルアクリルアミド、Ｎ−ビニル−２−ピロリドン、Ｎ−ビニルカプロラクタム、アクリロニトリル、テトラヒドロフルフリルアクリレート、２−フェノキシエチルアクリレート、及びベンジルアクリレート、アクリル酸、並びにこれらの組み合わせから選択される、請求項７に記載の方法。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US82017406P | 2006-07-24 | 2006-07-24 | |
| PCT/US2007/073838 WO2008014169A1 (en) | 2006-07-24 | 2007-07-19 | Electrically conductive pressure sensitive adhesives |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009544815A JP2009544815A (ja) | 2009-12-17 |
| JP2009544815A5 true JP2009544815A5 (ja) | 2010-08-26 |
Family
ID=38981795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009521906A Pending JP2009544815A (ja) | 2006-07-24 | 2007-07-19 | 導電性感圧性接着剤 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20090311502A1 (ja) |
| EP (1) | EP2044163B1 (ja) |
| JP (1) | JP2009544815A (ja) |
| KR (1) | KR101331679B1 (ja) |
| CN (1) | CN101495587B (ja) |
| AT (1) | ATE555177T1 (ja) |
| TW (1) | TW200813185A (ja) |
| WO (1) | WO2008014169A1 (ja) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011063217A2 (en) | 2009-11-20 | 2011-05-26 | 3M Innovative Properties Company | Compositions comprising conductive particles with surface-modified nanoparticles covalently attached thereto, and methods of making |
| JP2011140571A (ja) * | 2010-01-07 | 2011-07-21 | Nitto Denko Corp | 粘着剤組成物および粘着シート |
| KR20130018276A (ko) | 2010-03-31 | 2013-02-20 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 디스플레이용 전자 물품 및 그 제조 방법 |
| CN102477269A (zh) * | 2010-11-26 | 2012-05-30 | 上海恩意材料科技有限公司 | 一种导电性胶黏剂组合物 |
| JP2013014734A (ja) * | 2011-07-06 | 2013-01-24 | Nitto Denko Corp | 導電性粘着テープ |
| DE102011080729A1 (de) * | 2011-08-10 | 2013-02-14 | Tesa Se | Elektrisch leitfähige Haftklebemasse und Haftklebeband |
| DE102011080724A1 (de) | 2011-08-10 | 2013-02-14 | Tesa Se | Elektrisch leitfähige hitzeaktivierbare Klebemasse |
| CN105164223B (zh) * | 2013-04-19 | 2018-05-29 | Dic株式会社 | 导电性粘合片、其制造方法和使用其的电子终端 |
| US10785900B2 (en) | 2013-11-15 | 2020-09-22 | 3M Innovative Properties Company | Electrically conductive article containing shaped particles and methods of making same |
| US9357683B2 (en) * | 2014-09-26 | 2016-05-31 | Laird Technologies, Inc. | Electromagnetic interference (EMI) shielding apparatus including electrically-conductive foam |
| CN107567486A (zh) | 2015-05-01 | 2018-01-09 | 洛德公司 | 用于橡胶粘接的粘合剂 |
| JP6486192B2 (ja) * | 2015-05-19 | 2019-03-20 | マクセルホールディングス株式会社 | 粘着組成物前駆体、粘着組成物及びその製造方法、粘着シート及びその製造方法、並びに粘着シートを含む電子機器 |
| JP2018053137A (ja) * | 2016-09-29 | 2018-04-05 | 日東電工株式会社 | 導電性粘着テープ及び導電性粘着テープの製造方法 |
| US11168235B2 (en) | 2017-05-09 | 2021-11-09 | 3M Innovative Properties Company | Electrically conductive adhesive |
| US10058014B1 (en) | 2017-12-13 | 2018-08-21 | International Business Machines Corporation | Conductive adhesive layer for gasket assembly |
| KR102148860B1 (ko) | 2018-11-26 | 2020-08-28 | 주식회사 엘엠에스 | 접착시트 및 이를 포함하는 투명 전극 |
Family Cites Families (34)
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| JPS61285608A (ja) * | 1985-06-12 | 1986-12-16 | 岩井 謙治 | 貴金属被覆微粒体およびその製造方法 |
| US5070161A (en) * | 1988-05-27 | 1991-12-03 | Nippon Paint Co., Ltd. | Heat-latent, cationic polymerization initiator and resin compositions containing same |
| US4942201A (en) * | 1988-08-29 | 1990-07-17 | Illinois Tool Works, Inc. | Adhesive for low temperature applications |
| CA2083514A1 (en) * | 1990-06-08 | 1991-12-09 | Joyce B. Hall | Reworkable adhesive for electronic applications |
| JPH05298913A (ja) * | 1991-07-19 | 1993-11-12 | Ajinomoto Co Inc | 光硬化性導電性ペースト |
| US5290857A (en) * | 1991-09-04 | 1994-03-01 | Nippon Zeon Co., Ltd. | Epoxy resin adhesive composition |
| US5362421A (en) * | 1993-06-16 | 1994-11-08 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive compositions |
| US5620795A (en) * | 1993-11-10 | 1997-04-15 | Minnesota Mining And Manufacturing Company | Adhesives containing electrically conductive agents |
| US5443876A (en) * | 1993-12-30 | 1995-08-22 | Minnesota Mining And Manufacturing Company | Electrically conductive structured sheets |
| US20010028953A1 (en) * | 1998-11-16 | 2001-10-11 | 3M Innovative Properties Company | Adhesive compositions and methods of use |
| WO1997003143A1 (en) * | 1995-07-10 | 1997-01-30 | Minnesota Mining And Manufacturing Company | Screen printable adhesive compositions |
| JPH09296158A (ja) * | 1996-05-01 | 1997-11-18 | Nippon Handa Kk | 導電性接着剤 |
| AU711287B2 (en) * | 1996-05-16 | 1999-10-07 | Minnesota Mining And Manufacturing Company | Adhesive compositions and methods of use |
| JP3747995B2 (ja) * | 1998-08-11 | 2006-02-22 | 住友ベークライト株式会社 | 導電性樹脂ペースト及びこれを用いた半導体装置 |
| JP2000169474A (ja) * | 1998-12-07 | 2000-06-20 | Kotobuki Seiyaku Kk | イソキヌクリジン誘導体及びその製造方法並びにこれを含有する高コレステロール血症治療剤 |
| JP2001064547A (ja) * | 1999-09-01 | 2001-03-13 | Toyo Ink Mfg Co Ltd | 活性エネルギー線硬化型導電性ペースト、それを用いた導体回路および非接触ｉｄ |
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| US6699351B2 (en) * | 2000-03-24 | 2004-03-02 | 3M Innovative Properties Company | Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it |
| JP4499889B2 (ja) * | 2000-08-10 | 2010-07-07 | 株式会社スリオンテック | 無基材導電性粘着テープ・シート及びその製造方法 |
| JP2003031028A (ja) * | 2001-07-17 | 2003-01-31 | Shin Etsu Chem Co Ltd | 導電性組成物 |
| US20040266913A1 (en) * | 2001-09-13 | 2004-12-30 | Hiroaki Yamaguchi | Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition |
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| US6773474B2 (en) * | 2002-04-19 | 2004-08-10 | 3M Innovative Properties Company | Coated abrasive article |
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| DE10310722A1 (de) * | 2003-03-10 | 2004-09-23 | Tesa Ag | Elektrisch erwärmbare Haftklebemasse |
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| JP2005126593A (ja) * | 2003-10-24 | 2005-05-19 | Hitachi Chem Co Ltd | バインダ樹脂組成物および導電ペースト |
| US20050126697A1 (en) * | 2003-12-11 | 2005-06-16 | International Business Machines Corporation | Photochemically and thermally curable adhesive formulations |
| US20060110600A1 (en) * | 2004-11-19 | 2006-05-25 | 3M Innovative Properties Company | Anisotropic conductive adhesive composition |
| CN1277893C (zh) * | 2005-07-11 | 2006-10-04 | 大连轻工业学院 | 一种光固化导电胶及其制法 |
| US20070116961A1 (en) * | 2005-11-23 | 2007-05-24 | 3M Innovative Properties Company | Anisotropic conductive adhesive compositions |
-
2007
- 2007-07-19 AT AT07799694T patent/ATE555177T1/de active
- 2007-07-19 JP JP2009521906A patent/JP2009544815A/ja active Pending
- 2007-07-19 CN CN2007800284001A patent/CN101495587B/zh active Active
- 2007-07-19 US US12/374,512 patent/US20090311502A1/en not_active Abandoned
- 2007-07-19 KR KR1020097001593A patent/KR101331679B1/ko active IP Right Grant
- 2007-07-19 EP EP07799694A patent/EP2044163B1/en not_active Not-in-force
- 2007-07-19 WO PCT/US2007/073838 patent/WO2008014169A1/en active Application Filing
- 2007-07-23 TW TW096126795A patent/TW200813185A/zh unknown
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