JP2009544815A5 - - Google Patents
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- Publication number
- JP2009544815A5 JP2009544815A5 JP2009521906A JP2009521906A JP2009544815A5 JP 2009544815 A5 JP2009544815 A5 JP 2009544815A5 JP 2009521906 A JP2009521906 A JP 2009521906A JP 2009521906 A JP2009521906 A JP 2009521906A JP 2009544815 A5 JP2009544815 A5 JP 2009544815A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- acrylic acid
- flakes
- conductive
- precursor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 6
- 239000000853 adhesive Substances 0.000 claims 6
- 230000001070 adhesive effect Effects 0.000 claims 6
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 4
- 239000002243 precursor Substances 0.000 claims 4
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 claims 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 claims 2
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 claims 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims 2
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 claims 2
- 125000005396 acrylic acid ester group Chemical group 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 claims 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 229940088644 n,n-dimethylacrylamide Drugs 0.000 claims 2
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 claims 2
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 claims 2
- 150000003509 tertiary alcohols Chemical class 0.000 claims 2
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000000379 polymerizing effect Effects 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US82017406P | 2006-07-24 | 2006-07-24 | |
| PCT/US2007/073838 WO2008014169A1 (en) | 2006-07-24 | 2007-07-19 | Electrically conductive pressure sensitive adhesives |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009544815A JP2009544815A (ja) | 2009-12-17 |
| JP2009544815A5 true JP2009544815A5 (OSRAM) | 2010-08-26 |
Family
ID=38981795
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009521906A Pending JP2009544815A (ja) | 2006-07-24 | 2007-07-19 | 導電性感圧性接着剤 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20090311502A1 (OSRAM) |
| EP (1) | EP2044163B1 (OSRAM) |
| JP (1) | JP2009544815A (OSRAM) |
| KR (1) | KR101331679B1 (OSRAM) |
| CN (1) | CN101495587B (OSRAM) |
| AT (1) | ATE555177T1 (OSRAM) |
| TW (1) | TW200813185A (OSRAM) |
| WO (1) | WO2008014169A1 (OSRAM) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5690352B2 (ja) | 2009-11-20 | 2015-03-25 | スリーエム イノベイティブ プロパティズ カンパニー | 表面修飾ナノ粒子が共有結合した導電性粒子を含む組成物及びその製造方法 |
| JP2011140571A (ja) * | 2010-01-07 | 2011-07-21 | Nitto Denko Corp | 粘着剤組成物および粘着シート |
| JP5881676B2 (ja) | 2010-03-31 | 2016-03-09 | スリーエム イノベイティブ プロパティズ カンパニー | ディスプレイ用の電子物品、及びその製造方法 |
| CN102477269A (zh) * | 2010-11-26 | 2012-05-30 | 上海恩意材料科技有限公司 | 一种导电性胶黏剂组合物 |
| JP2013014734A (ja) * | 2011-07-06 | 2013-01-24 | Nitto Denko Corp | 導電性粘着テープ |
| DE102011080724A1 (de) | 2011-08-10 | 2013-02-14 | Tesa Se | Elektrisch leitfähige hitzeaktivierbare Klebemasse |
| DE102011080729A1 (de) * | 2011-08-10 | 2013-02-14 | Tesa Se | Elektrisch leitfähige Haftklebemasse und Haftklebeband |
| JP5660418B1 (ja) * | 2013-04-19 | 2015-01-28 | Dic株式会社 | 導電性粘着シート、その製造方法及びそれを用いて得た電子端末 |
| CN105706181B (zh) * | 2013-11-15 | 2018-11-16 | 3M创新有限公司 | 包含成型颗粒的导电制品及其制造方法 |
| US9357683B2 (en) * | 2014-09-26 | 2016-05-31 | Laird Technologies, Inc. | Electromagnetic interference (EMI) shielding apparatus including electrically-conductive foam |
| JP2018522954A (ja) | 2015-05-01 | 2018-08-16 | ロード コーポレイション | ゴム接合用接着剤 |
| JP6486192B2 (ja) * | 2015-05-19 | 2019-03-20 | マクセルホールディングス株式会社 | 粘着組成物前駆体、粘着組成物及びその製造方法、粘着シート及びその製造方法、並びに粘着シートを含む電子機器 |
| JP2018053137A (ja) * | 2016-09-29 | 2018-04-05 | 日東電工株式会社 | 導電性粘着テープ及び導電性粘着テープの製造方法 |
| KR102346866B1 (ko) | 2017-05-09 | 2022-01-04 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 전기 전도성 접착제 |
| US10058014B1 (en) | 2017-12-13 | 2018-08-21 | International Business Machines Corporation | Conductive adhesive layer for gasket assembly |
| KR102148860B1 (ko) | 2018-11-26 | 2020-08-28 | 주식회사 엘엠에스 | 접착시트 및 이를 포함하는 투명 전극 |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5153595A (ja) * | 1974-09-17 | 1976-05-12 | Haarmann & Reimer Gmbh | Noboratsukujushinoseizohoho |
| JPS61285608A (ja) * | 1985-06-12 | 1986-12-16 | 岩井 謙治 | 貴金属被覆微粒体およびその製造方法 |
| US5070161A (en) * | 1988-05-27 | 1991-12-03 | Nippon Paint Co., Ltd. | Heat-latent, cationic polymerization initiator and resin compositions containing same |
| US4942201A (en) * | 1988-08-29 | 1990-07-17 | Illinois Tool Works, Inc. | Adhesive for low temperature applications |
| EP0591174B1 (en) * | 1990-06-08 | 1997-07-16 | Minnesota Mining And Manufacturing Company | Reworkable adhesive for electronic applications |
| JPH05298913A (ja) * | 1991-07-19 | 1993-11-12 | Ajinomoto Co Inc | 光硬化性導電性ペースト |
| US5290857A (en) * | 1991-09-04 | 1994-03-01 | Nippon Zeon Co., Ltd. | Epoxy resin adhesive composition |
| US5362421A (en) * | 1993-06-16 | 1994-11-08 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive compositions |
| US5620795A (en) * | 1993-11-10 | 1997-04-15 | Minnesota Mining And Manufacturing Company | Adhesives containing electrically conductive agents |
| US5443876A (en) * | 1993-12-30 | 1995-08-22 | Minnesota Mining And Manufacturing Company | Electrically conductive structured sheets |
| WO1997003143A1 (en) * | 1995-07-10 | 1997-01-30 | Minnesota Mining And Manufacturing Company | Screen printable adhesive compositions |
| US20010028953A1 (en) * | 1998-11-16 | 2001-10-11 | 3M Innovative Properties Company | Adhesive compositions and methods of use |
| WO1997043352A1 (en) * | 1996-05-16 | 1997-11-20 | Minnesota Mining And Manufacturing Company | Adhesive compositions and methods of use |
| JPH09296158A (ja) * | 1996-05-01 | 1997-11-18 | Nippon Handa Kk | 導電性接着剤 |
| JP3747995B2 (ja) * | 1998-08-11 | 2006-02-22 | 住友ベークライト株式会社 | 導電性樹脂ペースト及びこれを用いた半導体装置 |
| JP2000169474A (ja) * | 1998-12-07 | 2000-06-20 | Kotobuki Seiyaku Kk | イソキヌクリジン誘導体及びその製造方法並びにこれを含有する高コレステロール血症治療剤 |
| JP2001064547A (ja) * | 1999-09-01 | 2001-03-13 | Toyo Ink Mfg Co Ltd | 活性エネルギー線硬化型導電性ペースト、それを用いた導体回路および非接触ｉｄ |
| JP2001207150A (ja) * | 2000-01-26 | 2001-07-31 | Sony Chem Corp | 接着剤組成物 |
| US6699351B2 (en) * | 2000-03-24 | 2004-03-02 | 3M Innovative Properties Company | Anisotropically conductive adhesive composition and anisotropically conductive adhesive film formed from it |
| JP4499889B2 (ja) * | 2000-08-10 | 2010-07-07 | 株式会社スリオンテック | 無基材導電性粘着テープ・シート及びその製造方法 |
| JP2003031028A (ja) * | 2001-07-17 | 2003-01-31 | Shin Etsu Chem Co Ltd | 導電性組成物 |
| US20040266913A1 (en) * | 2001-09-13 | 2004-12-30 | Hiroaki Yamaguchi | Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition |
| US20050256230A1 (en) * | 2002-04-01 | 2005-11-17 | Hiroaki Yamaguchi | Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition |
| US6773474B2 (en) * | 2002-04-19 | 2004-08-10 | 3M Innovative Properties Company | Coated abrasive article |
| JP2004189938A (ja) * | 2002-12-12 | 2004-07-08 | Nippon Sheet Glass Co Ltd | 導電性樹脂成形部品 |
| JP3991218B2 (ja) * | 2002-12-20 | 2007-10-17 | 信越化学工業株式会社 | 導電性接着剤及びその製造方法 |
| JP4238124B2 (ja) * | 2003-01-07 | 2009-03-11 | 積水化学工業株式会社 | 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体 |
| DE10310722A1 (de) * | 2003-03-10 | 2004-09-23 | Tesa Ag | Elektrisch erwärmbare Haftklebemasse |
| US7166491B2 (en) * | 2003-06-11 | 2007-01-23 | Fry's Metals, Inc. | Thermoplastic fluxing underfill composition and method |
| JP2005126593A (ja) * | 2003-10-24 | 2005-05-19 | Hitachi Chem Co Ltd | バインダ樹脂組成物および導電ペースト |
| US20050126697A1 (en) * | 2003-12-11 | 2005-06-16 | International Business Machines Corporation | Photochemically and thermally curable adhesive formulations |
| US20060110600A1 (en) * | 2004-11-19 | 2006-05-25 | 3M Innovative Properties Company | Anisotropic conductive adhesive composition |
| CN1277893C (zh) * | 2005-07-11 | 2006-10-04 | 大连轻工业学院 | 一种光固化导电胶及其制法 |
| US20070116961A1 (en) * | 2005-11-23 | 2007-05-24 | 3M Innovative Properties Company | Anisotropic conductive adhesive compositions |
-
2007
- 2007-07-19 JP JP2009521906A patent/JP2009544815A/ja active Pending
- 2007-07-19 CN CN2007800284001A patent/CN101495587B/zh active Active
- 2007-07-19 WO PCT/US2007/073838 patent/WO2008014169A1/en not_active Ceased
- 2007-07-19 AT AT07799694T patent/ATE555177T1/de active
- 2007-07-19 EP EP07799694A patent/EP2044163B1/en not_active Not-in-force
- 2007-07-19 US US12/374,512 patent/US20090311502A1/en not_active Abandoned
- 2007-07-19 KR KR1020097001593A patent/KR101331679B1/ko not_active Expired - Fee Related
- 2007-07-23 TW TW096126795A patent/TW200813185A/zh unknown
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