JP2009542012A5 - - Google Patents

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Publication number
JP2009542012A5
JP2009542012A5 JP2009516742A JP2009516742A JP2009542012A5 JP 2009542012 A5 JP2009542012 A5 JP 2009542012A5 JP 2009516742 A JP2009516742 A JP 2009516742A JP 2009516742 A JP2009516742 A JP 2009516742A JP 2009542012 A5 JP2009542012 A5 JP 2009542012A5
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JP
Japan
Prior art keywords
semiconductor structure
bonding
semiconductor
interface area
chamber
Prior art date
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Application number
JP2009516742A
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English (en)
Japanese (ja)
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JP2009542012A (ja
JP5390380B2 (ja
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Priority claimed from US11/766,531 external-priority patent/US7948034B2/en
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Publication of JP2009542012A publication Critical patent/JP2009542012A/ja
Publication of JP2009542012A5 publication Critical patent/JP2009542012A5/ja
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Publication of JP5390380B2 publication Critical patent/JP5390380B2/ja
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JP2009516742A 2006-06-22 2007-06-22 半導体接合のための装置及び方法 Active JP5390380B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US81561906P 2006-06-22 2006-06-22
US60/815,619 2006-06-22
US11/766,531 2007-06-21
US11/766,531 US7948034B2 (en) 2006-06-22 2007-06-21 Apparatus and method for semiconductor bonding
PCT/US2007/071857 WO2007150012A2 (en) 2006-06-22 2007-06-22 Apparatus and method for semiconductor bonding

Publications (3)

Publication Number Publication Date
JP2009542012A JP2009542012A (ja) 2009-11-26
JP2009542012A5 true JP2009542012A5 (enExample) 2010-07-15
JP5390380B2 JP5390380B2 (ja) 2014-01-15

Family

ID=38834410

Family Applications (1)

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JP2009516742A Active JP5390380B2 (ja) 2006-06-22 2007-06-22 半導体接合のための装置及び方法

Country Status (5)

Country Link
US (1) US7948034B2 (enExample)
EP (1) EP2030229B1 (enExample)
JP (1) JP5390380B2 (enExample)
KR (1) KR101414399B1 (enExample)
WO (1) WO2007150012A2 (enExample)

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TWI701708B (zh) * 2016-02-24 2020-08-11 德商蘇士微科技印刷術股份有限公司 半導體接合設備及相關技術
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