JP2009540559A - 電子部品用のサブマウント(submount) - Google Patents
電子部品用のサブマウント(submount) Download PDFInfo
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- JP2009540559A JP2009540559A JP2009513824A JP2009513824A JP2009540559A JP 2009540559 A JP2009540559 A JP 2009540559A JP 2009513824 A JP2009513824 A JP 2009513824A JP 2009513824 A JP2009513824 A JP 2009513824A JP 2009540559 A JP2009540559 A JP 2009540559A
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- substrate
- submount
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/038—Textiles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10818—Flat leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10818—Flat leads
- H05K2201/10825—Distorted or twisted flat leads, i.e. deformed by torque
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10962—Component not directly connected to the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/209—Auto-mechanical connection between a component and a PCB or between two PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Led Device Packages (AREA)
- Developing Agents For Electrophotography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Photoreceptors In Electrophotography (AREA)
Abstract
Description
本発明の実施例において、その主延長に垂直な平面内で、基板はめ込み用部材の断面は長円形を有する。
基板はめ込み用部材が、長円形の断面を有していることには利点がある。というのはこれが、部材に折り畳むための好ましい方向を指定するからである。即ち、折り軸は、自動的に断面の長軸沿いである。ピンが、自動プロセス中に折り畳まれるべき時に、これは特に利点がある。更に、部材が、電極を留めるために用いられるときに、増加した接触面積により電極と部材に間に良い接続が得られる。
更に、サブマウントにおいて、前記第1基板はめ込み用部材の長円形の断面の長軸は、前記第2基板はめ込み用部材の長円形の断面の長軸に対して15度から165度の角度を形成する。繊維基板のあるタイプにおいて、伝導電極の異なるタイプ(例えば陰極と陽極)は、非平行の方向、例えば垂直に配置される。そのような場合、断面の長手方向が、対応する伝導電極の方向と本質的に平行であるように各長円形基板はめ込み用部材が配置される事に利点がある。というのはこれが、伝導電極と基板はめ込み用手段との間の接触面積を最大にするからである。
ヘッド部材に部品を半田付け又は接着する必要が無く、且つ電気部品を望むときに容易に取り替える事ができるので、このスナップ留め具アプローチは、有利である。
Claims (24)
- 基板に電子部品を配置するためのサブマウントであって、上側(upper side)と基板側とヘッド部材の基板側から突き出た少なくとも1つの基板はめ込み用部材とを有するヘッド部材を含み、前記ヘッド部材は、少なくとも2つの互いに分離した導電部を含み、各導電部は、そこに電子部品を接触するのに適した部品接触部と、前記導電部を前記基板に含まれた回路と接触させるために前記基板側に配置された基板接触部とを含む。
- 少なくとも1つの前記基板接触部は少なくとも部分的に基板はめ込み用部材によって構成される、請求項1によるサブマウント。
- 前記少なくとも1つの基板はめ込み用部材が本質的にピンの形をしている、先行する請求項のいずれかによるサブマウント。
- 前記基板はめ込み用部材が前記基板の厚さを超える長さを有する、先行する請求項のいずれかによるサブマウント。
- 前記少なくとも1つの基板はめ込み用部材が折り畳み可能な、先行する請求項のいずれかによるサブマウント。
- 前記基板はめ込み用部材の主延長に垂直な平面内の、前記基板はめ込み用部材の断面が、長円形を有する、先行する請求項のいずれかによるサブマウント。
- 請求項6によるサブマウントが、少なくとも第1の基板はめ込み用部材及び第2基板はめ込み用部材を含み、前記第1基板はめ込み用部材の長円形の断面の長軸は、前記第2基板はめ込み用部材の長円形の断面の長軸に対して15度から165度の角度を形成するサブマウント。
- 前記少なくとも1つの基板接触部がぎざぎざした表面を有する部分を含む、先行する請求項のいずれかによるサブマウント。
- 前記少なくとも1つの電子部品が、前記部品接触部に接続する、先行する請求項のいずれかによるサブマウント。
- 前記少なくとも1つの電子部品が、発光ダイオード、集積回路パッケージ、センサー、アクチュエータ及び半導体部品から成るグループから選択される、先行する請求項のいずれかによるサブマウント。
- 前記ヘッド部材の1部分は、スナップ留め具のメス部材のはめ込みくぼみと係合するための係合突起部を含むスナップ留め具のオス部材を構成する、先行する請求項のいずれかによるサブマウント。
- はめ込みくぼみを含むスナップ留め具の前記メス部材を構成する電子部品が、前記係合突起部にスナップ留めされている、請求項11によるサブマウント。
- 前記ヘッド部材の1部分は、スナップ留め具のオス部材の係合突起部と係合するためのはめ込みくぼみを含むスナップ留め具のメス部材を構成する、先行する請求項のいずれかによるサブマウント。
- スナップ留め具の前記オス部材を構成する電子部品が、前記ヘッド部材係合くぼみにスナップ留めされる、請求項13によるサブマウント。
- 導電性接着剤が、少なくとも1つの前記基板接触部に配置される、先行する請求項のいずれかによるサブマウント。
- 前記導電性接着剤が、導電性エポキシ材又は導電性接着テープを含む、請求項15によるサブマウント。
- 前面と背面とを有し並びに少なくとも2つの分離した電極を含む繊維基板、及び請求項1から16のいずれかによるサブマウントを含む配置で、前記サブマウントの前記少なくとも1つの基板はめ込み用部材は、その前記前面から前記基板を貫き、且つ、各前記導電性電極は、前記サブマウントの別の基板接触部と接する配置。
- 前記導電性電極は、前記基板接触部と前記基板との間に留められる、請求項17による配置。
- 導電性接着剤が、少なくとも1つの前記基板接触部を前記導電性電極のうちの1つに結合する、請求項17又は18による配置。
- 少なくとも1つの基板はめ込み用部材が、前記基板の背面を貫いて延び、前記背面に位置する前記基板はめ込み用部材の1部分が基板の背面の方向に曲げられる、請求項17から19のいずれかによる配置。
- 前記導電性電極の少なくとも1つが、基板の背面に配置され、前記背面に延びる基板はめ込み用部材の1部分への接触を介して前記サブマウントに接続する、請求項17から20のいずれかによる配置。
- 前記基板の背面に配置された前記導電性電極が、前記基板と前記基板はめ込み用部材との間に留められる、請求項17から21のいずれかによる配置。
- 導電性電極を絶縁するように配置された絶縁層が、前記導電性電極から前記基板接触部へ電気的接触を形成するために基板接触部により貫かれる、請求項17から22のいずれかによる配置。
- スナップ留め具のメス部材又はオス部材が、前記基板の背面に配置され且つ前記基板はめ込み用手段と係合することにより保持される、請求項17から23のいずれかによる配置。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06115109 | 2006-06-08 | ||
EP06115109.8 | 2006-06-08 | ||
EP06126499 | 2006-12-19 | ||
EP06126499.0 | 2006-12-19 | ||
PCT/IB2007/052096 WO2008007237A2 (en) | 2006-06-08 | 2007-06-05 | Submount for electronic components |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009540559A true JP2009540559A (ja) | 2009-11-19 |
JP5113160B2 JP5113160B2 (ja) | 2013-01-09 |
Family
ID=38859054
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009513824A Expired - Fee Related JP5113160B2 (ja) | 2006-06-08 | 2007-06-05 | 電子部品を配置するためのサブマウント、およびサブマウントを含む配置 |
Country Status (9)
Country | Link |
---|---|
US (1) | US8259460B2 (ja) |
EP (1) | EP2030493B1 (ja) |
JP (1) | JP5113160B2 (ja) |
KR (1) | KR101345353B1 (ja) |
CN (1) | CN101467503B (ja) |
AT (1) | ATE450134T1 (ja) |
DE (1) | DE602007003473D1 (ja) |
TW (1) | TW200810033A (ja) |
WO (1) | WO2008007237A2 (ja) |
Cited By (3)
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JP2014527711A (ja) * | 2011-07-28 | 2014-10-16 | コミッサリア ア レネルジー アトミーク エ オ エナジーズ アルタナティブス | ファブリックへの超小型電子チップデバイスの組立方法、チップデバイス及びクリンプされたチップデバイスを組み込んだファブリック |
JP2019179892A (ja) * | 2018-03-30 | 2019-10-17 | 株式会社サトーセン | 伸縮性回路基板 |
WO2020256335A1 (ko) * | 2019-06-17 | 2020-12-24 | 엘지이노텍 주식회사 | 조명 장치 |
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KR20110053923A (ko) * | 2008-04-29 | 2011-05-24 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | 전자 직물 |
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US10553540B2 (en) | 2015-08-20 | 2020-02-04 | Apple Inc. | Fabric-based items with electrical component arrays |
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US9577374B1 (en) * | 2015-10-23 | 2017-02-21 | Te Connectivity Corporation | Textile connector for an electronic textile having a snap fastener with contacts |
EP3185656A1 (en) * | 2015-12-23 | 2017-06-28 | Universiteit Gent | Module for textile applications |
JP6734680B2 (ja) * | 2016-03-30 | 2020-08-05 | 日本航空電子工業株式会社 | スナップボタン型コネクタ |
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JP2014527711A (ja) * | 2011-07-28 | 2014-10-16 | コミッサリア ア レネルジー アトミーク エ オ エナジーズ アルタナティブス | ファブリックへの超小型電子チップデバイスの組立方法、チップデバイス及びクリンプされたチップデバイスを組み込んだファブリック |
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US11732861B2 (en) | 2019-06-17 | 2023-08-22 | Lg Innotek Co., Ltd. | Lighting device |
Also Published As
Publication number | Publication date |
---|---|
ATE450134T1 (de) | 2009-12-15 |
EP2030493B1 (en) | 2009-11-25 |
WO2008007237A3 (en) | 2008-06-05 |
KR20090031552A (ko) | 2009-03-26 |
KR101345353B1 (ko) | 2013-12-31 |
DE602007003473D1 (de) | 2010-01-07 |
WO2008007237A2 (en) | 2008-01-17 |
EP2030493A2 (en) | 2009-03-04 |
TW200810033A (en) | 2008-02-16 |
JP5113160B2 (ja) | 2013-01-09 |
CN101467503B (zh) | 2011-05-18 |
US20100238637A1 (en) | 2010-09-23 |
US8259460B2 (en) | 2012-09-04 |
CN101467503A (zh) | 2009-06-24 |
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