JP2009532915A5 - - Google Patents
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- Publication number
- JP2009532915A5 JP2009532915A5 JP2009504392A JP2009504392A JP2009532915A5 JP 2009532915 A5 JP2009532915 A5 JP 2009532915A5 JP 2009504392 A JP2009504392 A JP 2009504392A JP 2009504392 A JP2009504392 A JP 2009504392A JP 2009532915 A5 JP2009532915 A5 JP 2009532915A5
- Authority
- JP
- Japan
- Prior art keywords
- annealing
- gas
- oxygen
- torr
- annealing step
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000000137 annealing Methods 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 24
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 19
- 239000001301 oxygen Substances 0.000 claims description 19
- 229910052760 oxygen Inorganic materials 0.000 claims description 19
- 239000007789 gas Substances 0.000 claims description 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000010703 silicon Substances 0.000 claims description 8
- 230000001590 oxidative effect Effects 0.000 claims description 7
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 claims description 6
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 claims description 6
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 3
- 229910001882 dioxygen Inorganic materials 0.000 claims description 3
- 239000001272 nitrous oxide Substances 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims 2
- 229910001873 dinitrogen Inorganic materials 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000011261 inert gas Substances 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 description 5
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/397,010 US7429540B2 (en) | 2003-03-07 | 2006-04-03 | Silicon oxynitride gate dielectric formation using multiple annealing steps |
| US11/397,010 | 2006-04-03 | ||
| PCT/US2007/065650 WO2007118031A2 (en) | 2006-04-03 | 2007-03-30 | Silicon oxynitride gate dielectric formation using multiple annealing steps |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009532915A JP2009532915A (ja) | 2009-09-10 |
| JP2009532915A5 true JP2009532915A5 (https=) | 2012-10-11 |
| JP5105627B2 JP5105627B2 (ja) | 2012-12-26 |
Family
ID=38581764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009504392A Active JP5105627B2 (ja) | 2006-04-03 | 2007-03-30 | 複数のアニールステップを用いた酸窒化シリコンゲート誘電体の形成 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7429540B2 (https=) |
| JP (1) | JP5105627B2 (https=) |
| KR (1) | KR101014938B1 (https=) |
| CN (1) | CN101416286B (https=) |
| TW (1) | TWI375276B (https=) |
| WO (1) | WO2007118031A2 (https=) |
Families Citing this family (73)
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| US7745352B2 (en) * | 2007-08-27 | 2010-06-29 | Applied Materials, Inc. | Curing methods for silicon dioxide thin films deposited from alkoxysilane precursor with harp II process |
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| US8357435B2 (en) | 2008-05-09 | 2013-01-22 | Applied Materials, Inc. | Flowable dielectric equipment and processes |
| US7638442B2 (en) * | 2008-05-09 | 2009-12-29 | Promos Technologies, Inc. | Method of forming a silicon nitride layer on a gate oxide film of a semiconductor device and annealing the nitride layer |
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| KR101410429B1 (ko) * | 2008-09-05 | 2014-07-03 | 삼성전자주식회사 | 비휘발성 기억 소자 및 그 형성 방법 |
| US8980382B2 (en) | 2009-12-02 | 2015-03-17 | Applied Materials, Inc. | Oxygen-doping for non-carbon radical-component CVD films |
| US7935643B2 (en) * | 2009-08-06 | 2011-05-03 | Applied Materials, Inc. | Stress management for tensile films |
| US8741788B2 (en) | 2009-08-06 | 2014-06-03 | Applied Materials, Inc. | Formation of silicon oxide using non-carbon flowable CVD processes |
| US7989365B2 (en) | 2009-08-18 | 2011-08-02 | Applied Materials, Inc. | Remote plasma source seasoning |
| US8449942B2 (en) | 2009-11-12 | 2013-05-28 | Applied Materials, Inc. | Methods of curing non-carbon flowable CVD films |
| SG181670A1 (en) | 2009-12-30 | 2012-07-30 | Applied Materials Inc | Dielectric film growth with radicals produced using flexible nitrogen/hydrogen ratio |
| US8329262B2 (en) | 2010-01-05 | 2012-12-11 | Applied Materials, Inc. | Dielectric film formation using inert gas excitation |
| JP2013517616A (ja) | 2010-01-06 | 2013-05-16 | アプライド マテリアルズ インコーポレイテッド | 酸化物ライナを使用する流動可能な誘電体 |
| WO2011084752A2 (en) | 2010-01-07 | 2011-07-14 | Applied Materials, Inc. | In-situ ozone cure for radical-component cvd |
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| US8318584B2 (en) | 2010-07-30 | 2012-11-27 | Applied Materials, Inc. | Oxide-rich liner layer for flowable CVD gapfill |
| US8450221B2 (en) * | 2010-08-04 | 2013-05-28 | Texas Instruments Incorporated | Method of forming MOS transistors including SiON gate dielectric with enhanced nitrogen concentration at its sidewalls |
| JP2012079785A (ja) * | 2010-09-30 | 2012-04-19 | Tokyo Electron Ltd | 絶縁膜の改質方法 |
| US9285168B2 (en) | 2010-10-05 | 2016-03-15 | Applied Materials, Inc. | Module for ozone cure and post-cure moisture treatment |
| US8664127B2 (en) | 2010-10-15 | 2014-03-04 | Applied Materials, Inc. | Two silicon-containing precursors for gapfill enhancing dielectric liner |
| US10283321B2 (en) | 2011-01-18 | 2019-05-07 | Applied Materials, Inc. | Semiconductor processing system and methods using capacitively coupled plasma |
| US8450191B2 (en) | 2011-01-24 | 2013-05-28 | Applied Materials, Inc. | Polysilicon films by HDP-CVD |
| US8716154B2 (en) | 2011-03-04 | 2014-05-06 | Applied Materials, Inc. | Reduced pattern loading using silicon oxide multi-layers |
| US8445078B2 (en) | 2011-04-20 | 2013-05-21 | Applied Materials, Inc. | Low temperature silicon oxide conversion |
| KR101858524B1 (ko) | 2011-05-26 | 2018-05-18 | 삼성전자주식회사 | 반도체 소자의 제조 방법 |
| US8466073B2 (en) | 2011-06-03 | 2013-06-18 | Applied Materials, Inc. | Capping layer for reduced outgassing |
| US9404178B2 (en) | 2011-07-15 | 2016-08-02 | Applied Materials, Inc. | Surface treatment and deposition for reduced outgassing |
| US8617989B2 (en) | 2011-09-26 | 2013-12-31 | Applied Materials, Inc. | Liner property improvement |
| US8551891B2 (en) | 2011-10-04 | 2013-10-08 | Applied Materials, Inc. | Remote plasma burn-in |
| KR101929384B1 (ko) | 2012-05-24 | 2018-12-14 | 삼성전자주식회사 | 선택적으로 질화처리된 게이트 절연막을 갖는 반도체 장치의 제조 방법 |
| US8889566B2 (en) | 2012-09-11 | 2014-11-18 | Applied Materials, Inc. | Low cost flowable dielectric films |
| US9018108B2 (en) | 2013-01-25 | 2015-04-28 | Applied Materials, Inc. | Low shrinkage dielectric films |
| CN103871955A (zh) * | 2014-03-31 | 2014-06-18 | 上海华力微电子有限公司 | 一种栅介质等效氧化层厚度控制方法 |
| US9412581B2 (en) | 2014-07-16 | 2016-08-09 | Applied Materials, Inc. | Low-K dielectric gapfill by flowable deposition |
| US20160225652A1 (en) | 2015-02-03 | 2016-08-04 | Applied Materials, Inc. | Low temperature chuck for plasma processing systems |
| US10276411B2 (en) | 2017-08-18 | 2019-04-30 | Applied Materials, Inc. | High pressure and high temperature anneal chamber |
| CN111936664A (zh) | 2018-03-19 | 2020-11-13 | 应用材料公司 | 在航空航天部件上沉积涂层的方法 |
| US11015252B2 (en) | 2018-04-27 | 2021-05-25 | Applied Materials, Inc. | Protection of components from corrosion |
| US11009339B2 (en) | 2018-08-23 | 2021-05-18 | Applied Materials, Inc. | Measurement of thickness of thermal barrier coatings using 3D imaging and surface subtraction methods for objects with complex geometries |
| US11145504B2 (en) | 2019-01-14 | 2021-10-12 | Applied Materials, Inc. | Method of forming film stacks with reduced defects |
| EP3959356A4 (en) | 2019-04-26 | 2023-01-18 | Applied Materials, Inc. | METHOD OF PROTECTING AEROSPACE COMPONENTS AGAINST CORROSION AND OXIDATION |
| US11794382B2 (en) | 2019-05-16 | 2023-10-24 | Applied Materials, Inc. | Methods for depositing anti-coking protective coatings on aerospace components |
| US11697879B2 (en) | 2019-06-14 | 2023-07-11 | Applied Materials, Inc. | Methods for depositing sacrificial coatings on aerospace components |
| US11466364B2 (en) | 2019-09-06 | 2022-10-11 | Applied Materials, Inc. | Methods for forming protective coatings containing crystallized aluminum oxide |
| US11519066B2 (en) | 2020-05-21 | 2022-12-06 | Applied Materials, Inc. | Nitride protective coatings on aerospace components and methods for making the same |
| CN115734826A (zh) | 2020-07-03 | 2023-03-03 | 应用材料公司 | 用于翻新航空部件的方法 |
| JP7434234B2 (ja) * | 2021-09-16 | 2024-02-20 | 株式会社東芝 | 半導体装置の製造方法及び半導体装置 |
| CN114765234B (zh) * | 2022-03-23 | 2024-04-02 | 山西潞安太阳能科技有限责任公司 | 一种p型晶硅双面电池退火增强背钝化方法 |
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-
2006
- 2006-04-03 US US11/397,010 patent/US7429540B2/en not_active Expired - Lifetime
-
2007
- 2007-03-30 WO PCT/US2007/065650 patent/WO2007118031A2/en not_active Ceased
- 2007-03-30 CN CN2007800124430A patent/CN101416286B/zh not_active Expired - Fee Related
- 2007-03-30 JP JP2009504392A patent/JP5105627B2/ja active Active
- 2007-03-30 KR KR1020087026347A patent/KR101014938B1/ko active Active
- 2007-04-03 TW TW096111860A patent/TWI375276B/zh not_active IP Right Cessation
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