JP2009532915A - 複数のアニールステップを用いた酸窒化シリコンゲート誘電体の形成 - Google Patents
複数のアニールステップを用いた酸窒化シリコンゲート誘電体の形成 Download PDFInfo
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- 238000000137 annealing Methods 0.000 title claims abstract description 50
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 37
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 37
- 239000010703 silicon Substances 0.000 title claims abstract description 37
- 230000015572 biosynthetic process Effects 0.000 title description 7
- 238000000034 method Methods 0.000 claims abstract description 51
- 239000007789 gas Substances 0.000 claims abstract description 32
- 230000001590 oxidative effect Effects 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000012545 processing Methods 0.000 claims abstract description 9
- 239000004065 semiconductor Substances 0.000 claims abstract description 9
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910001882 dioxygen Inorganic materials 0.000 claims abstract description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 35
- 229910052760 oxygen Inorganic materials 0.000 claims description 35
- 239000001301 oxygen Substances 0.000 claims description 35
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 30
- 229910052757 nitrogen Inorganic materials 0.000 claims description 15
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 claims description 10
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 claims description 10
- 239000001272 nitrous oxide Substances 0.000 claims description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 4
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 229910052786 argon Inorganic materials 0.000 claims description 2
- 239000001307 helium Substances 0.000 claims description 2
- 229910052734 helium Inorganic materials 0.000 claims description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 abstract 1
- 239000002253 acid Substances 0.000 abstract 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 abstract 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000004151 rapid thermal annealing Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
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Abstract
【選択図】 図2
Description
[0001]本発明の実施形態は、一般的には、酸窒化シリコン膜を形成することを含む半導体処理に関する。より詳細には、本発明は、プラズマ窒化物形成と二つのステップのアニールプロセスを用いた酸窒化シリコン膜を形成する方法に関する。
[0002]集積回路やトランジスタのデバイスの形が縮小するにつれて、トランジスタが必要とするゲート駆動電流に増加してきた。ゲート静電容量が増加するにつれて、トランジスタのゲート駆動電流も増加すること、また、トランジスタのゲート静電容量が、k*A/d(ここで、kは(通常は酸化シリコンである)ゲート誘電体の誘電率であり、dは誘電体の厚さであり、Aはゲートコンタクト面積である)に等しいことは、既知である。従って、ゲート誘電体の誘電体の厚さを減少させることと誘電率を増加させることが、ゲート静電容量と駆動電流を増加させる二つの方法である。
号に開示されており、この開示内容は本明細書に援用されている。
テップで酸素を添加しすぎると、過剰酸化が引き起こされるために望ましくない。
ンバに導入してもよい。酸化ガスとしては、酸素、亜酸化窒素、一酸化窒素、及びオゾンが挙げられる。好適な第二アニールステップ206において、酸素は、約15秒間、酸素分圧が約0.5トール〜3.0トールになる流量でチャンバへ流される。一例として、約1slmの流量を用いて、この範囲内の酸素分圧を得ることができる。
(窒素はアニールステップのそれぞれの残部である)、黒い丸は、1000℃において窒素で15秒間と0.5トールの酸素で15秒間の第二アニールステップを示す。黒い三角
は、1000℃において窒素で45秒間行った第一アニールステップと0.5トールの酸
素で15秒間の第二アニールステップを示し、黒い四角は、950℃において窒素で45秒間行った第一アニールステップと0.5トールの酸素で15秒間の第二アニールステッ
プを示す。これらの結果によれば、本発明の実施形態の二ステッププロセスは、一ステップアニールプロセスより良好である。酸素と窒素の双方が二ステップアニールプロセスの第一アニールステップにおいて用いることが好ましい。しかしながら、このことは好適実施形態であり、他の実施形態も本発明の範囲内であり得ることは理解される。
Claims (20)
- 半導体基板を処理する方法であって、
酸窒化シリコン膜を形成するステップと;
分圧が約1ミリトール〜約100ミリトールである酸化ガスの存在下に該酸窒化シリコン膜をアニールするステップと;
分圧が約0.5トール〜約3.0トールである酸素ガスで該酸窒化シリコン膜をアニールするステップと;
を含む、前記方法。 - 酸窒化シリコン膜を形成するステップが、プラズマ窒化物形成によって行われる、請求項1に記載の方法。
- 分圧が約1〜約100ミリトールである酸化ガスの存在下に該酸窒化シリコン膜をアニールする該ステップが、約700℃以上で行われる、請求項1に記載の方法。
- 分圧が約1〜約100ミリトールである酸化ガスの存在下に該酸窒化シリコン膜をアニールする該ステップが、約1000℃〜約1100℃で行われる、請求項3に記載の方法。
- 分圧が約1〜約100ミリトールである酸化ガスの存在下に該酸窒化シリコン膜をアニールする該ステップが、約1秒〜約120秒間行われる、請求項1に記載の方法。
- 分圧が約1〜約100ミリトールである酸化ガスの存在下に該酸窒化シリコン膜をアニールする該ステップが、約100ミリトール〜約800トールのチャンバ圧で行われる、請求項1に記載の方法。
- 該酸化ガスが、酸素、亜酸化窒素、一酸化窒素、及びオゾンより選ばれるガスである、請求項1に記載の方法。
- 該酸化ガスが、酸素である、請求項1に記載の方法。
- 分圧が約1〜約100ミリトールである酸化ガスの存在下に該酸窒化シリコン膜をアニールする該ステップが、該酸窒化シリコン膜を還元ガスでアニールする工程を更に含む、請求項1に記載の方法。
- 該還元ガスが、水素である、請求項9に記載の方法。
- 分圧が約1〜約100ミリトールである酸化ガスの存在下に該酸窒化シリコン膜をアニールする該ステップが、該酸窒化シリコン膜を不活性ガスでアニールする工程を更に含む、請求項1に記載の方法。
- 該不活性ガスが、窒素、ヘリウム、及びアルゴンより選ばれるガスである、請求項11に記載の方法。
- 流量が約1slmである酸素ガスで該酸窒化シリコン膜をアニールする該ステップが、約900℃〜約1100℃で行われる、請求項1に記載の方法。
- 流量が約1slmである酸素ガスで該酸窒化シリコン膜をアニールする該ステップが、約10ミリトール〜約100トールの圧力で行われる、請求項1に記載の方法。
- 分圧が約0.5トール〜約3.0トールである酸素ガスで該酸窒化シリコン膜をアニールする該ステップが、約1秒〜約120秒間行われる、請求項1に記載の方法。
- チャンバ内に配置され且つ酸窒化シリコン膜を有する半導体基板をアニールする方法であって、
約1〜約100ミリトールの酸化ガスを約1000℃〜約1100℃のチャンバ温度で該チャンバに流すステップと;
約0.5トール〜約3.0トールの酸素ガスを約1slmの流量で該チャンバに流すステップと;
を含み、約1〜約100ミリトールの酸化ガスを該チャンバに流す前記ステップが、約0.5トール〜約3.0トールの酸素ガスを該チャンバに流す前記ステップより高い温度と高いチャンバ圧で行われる、前記方法。 - 約1〜約100ミリトールの酸化ガスを該チャンバに流す前記ステップが、約1000℃で行われる、請求項16に記載の方法。
- 約1〜約100ミリトールの酸化ガスを該チャンバに流す前記ステップが、約1秒〜約120秒間行われる、請求項16に記載の方法。
- 約1〜約100ミリトールの酸化ガスを該チャンバに流す前記ステップが、約100ミリトール〜約800トールのチャンバ圧で行われる、請求項16に記載の方法。
- 該酸化ガスが、酸素、亜酸化窒素、一酸化窒素及びオゾンより選ばれるガスである、請求項16に記載の方法。
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