JP2009520364A - 記憶層を有するバックゲート型半導体素子及びその製造方法 - Google Patents
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Abstract
Description
セミコンダクタ・オン・インシュレータ(SOI)基板における非揮発性メモリ(NVM)に関連した電荷蓄積の典型的な問題を克服するための、接触に使用可能なチャネルを有するバックゲート型非揮発性メモリ(NVM)素子が提供される。基板は前記ゲートを支持する。記憶層は前記ゲート上に形成され、前記記憶層は絶縁層に封入されたナノ結晶であってもよいが、窒化物等の他の種類でもよい。チャネルは前記記憶層の上に形成される。都合よく接触されることができる導電性領域が、チャネル上に形成される。これはプログラミング中に発生した少数キャリアの脱出経路をもたらし、それによりチャネル内又はチャネル付近における電荷蓄積を回避する。このことは2つのウェハを結合し、一方のウェハの大部分を切除し、切除後に導電性領域を形成し、ソース/ドレインを前記チャネルから側方にエピタキシャルに成長させると同時に、側壁スペーサを伴うこの成長から導電性領域が分離されることを含む方法によって達成可能である。
図1は合成ウェハ(図2の201)を形成するために共に結合される、2つのウェハ101及び103の側面図を示し、例えば前記合成ウェハから非揮発性メモリセルが形成される。ウェハ101はゲート材料の層109、記憶層107、及び半導体基板105を含む。一例として、基板105は単結晶性シリコンで構成されるが、他の実施形態においては、シリコン炭素、シリコンゲルマニウム、ゲルマニウム、III〜V族の半導体材料、II〜VI族の半導体材料、及び、異なる半導体材料の多数の層を含むそれらの組合せ等の、他の種類の半導体材料で構成されてもよい。いくつかの実施形態において、半導体基板105は歪を与えられる。記憶層107は薄膜記憶層又はスタックであってもよく、また、窒化物やナノ結晶等のいかなる適切な材料で構成されてもよい。ナノ結晶は、金属ナノ結晶、半導体(例えば、シリコン、ゲルマニウム、ガリウムヒ素)ナノ結晶、又はそれらの組合せが用いられてもよい。記憶層107は、化学蒸着過程、スパッタリング過程、又は他の適切な蒸着過程によって形成される。
Claims (20)
- 第1ウェハを提供することと、
第1側面及び第2側面を有する第2ウェハを提供し、前記第2ウェハは半導体構造と、記憶層と、ゲート材料の層とを含み、前記記憶層は前記半導体構造とゲート材料の層との間に配置され、前記記憶層は前記半導体構造よりも前記第2ウェハの第1側面に近接して配置されることと、
前記第2ウェハの第1側面を前記第1ウェハに接着することと、
前記接着後、前記半導体構造の層を残すために、前記半導体構造の第1部分を除去することと、
チャネル領域を有するトランジスタを形成し、前記チャネル領域の少なくとも一部は前記半導体構造の層によって形成されること
とを備える半導体素子の製造方法。 - 前記トランジスタの形成において、さらに、ウェルコンタクトとして用いるために前記チャネル領域に隣接する導電性領域を形成することを特徴とする請求項1に記載の方法。
- 前記伝導性領域の形成において、
前記チャネル領域上に犠牲層を形成することと、
前記犠牲層をパターニングして前記チャネル領域への開口部を形成することと、
ドープされた半導体材料を堆積して前記開口部を充填することと、
前記開口部の周囲のドープされた半導体材料を除去することと、
前記犠牲層を除去して伝導性領域を残すこと
とを備える請求項2に記載の方法。 - 前記トランジスタの形成において、さらに、前記トランジスタのソース/ドレインとして用いるために前記チャネルに隣接する伝導性領域をエピタキシャルに成長させることを特徴とする請求項3に記載の方法。
- 前記トランジスタの形成において、さらに、前記チャネル領域に隣接する前記ゲート材料の領域をアモルファス領域に変換し、さらに前記アモルファス領域をエッチングして前記トランジスタのゲートを残すことを特徴とする請求項4に記載の方法。
- 前記ゲート材料の領域の変換において、さらに、前記チャネル領域に隣接する前記ゲート材料の領域を注入することを含む請求項5に記載の方法。
- 基板と、
前記基板上のゲートと、
前記ゲート上の記憶層と、
前記記憶層上のチャネル領域と、
前記チャネルの側方に隣接するソース/ドレイン領域と、
前記チャネル領域上及び前記チャネル領域に直接接触し、前記チャネル領域を覆う伝導性領域
とを備える半導体素子の構造。 - 前記記憶層はナノ結晶を備える請求項7に記載の半導体素子。
- 前記伝導性領域の側方に隣接する側壁スペーサをさらに備える請求項7に記載の半導体素子。
- 前記伝導性領域はウェルコンタクトのための手段を備える請求項7に記載の半導体素子。
- 前記伝導性領域はポリシリコンを備え、かつ、前記チャネル領域は単結晶性シリコンを備える請求項7に記載の半導体素子。
- 前記ゲート上及び前記ソース/ドレイン上にシリサイド層をさらに備える請求項7に記載の半導体素子。
- 前記ソース/ドレイン領域は前記チャネルに隣接する単結晶性領域と、前記単結晶性領域に隣接するポリシリコン領域とを備える請求項7に記載の半導体素子。
- 基板と、
前記基板上の制御ゲートと、
前記制御ゲート上の記憶層と、
前記記憶層上の単結晶性チャネル領域と、
前記チャネル領域から上方に伸長し、少数キャリアを前記チャネルから除去するための伝導性領域
とを備える非揮発性メモリセル。 - 前記伝導性領域は、さらに、多結晶性であることを特徴とする請求項14に記載の非揮発性メモリセル。
- 前記制御ゲートはポリシリコンを備える請求項14に記載の非揮発性メモリセル。
- 前記記憶層はナノ結晶を備える請求項14に記載の非揮発性メモリセル。
- 前記チャネルの第1側面上のドレインと、
前記チャネルの第2側面上のソースであって、前記ソース及びドレインは単結晶性であり、前記チャネルに隣接していること
とをさらに備える請求項14に記載の非揮発性メモリセル。 - 前記ソースの一部の上の第1シリサイド層と、ドレインの一部の上の第2シリサイド層と、伝導性領域の一部の上の第3シリサイド層とをさらに備える請求項14に記載の非揮発性メモリ。
- 前記伝導性領域の側面に隣接する側壁スペーサをさらに備える請求項14に記載の非揮発性メモリセル。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/300,077 | 2005-12-14 | ||
US11/300,077 US7679125B2 (en) | 2005-12-14 | 2005-12-14 | Back-gated semiconductor device with a storage layer and methods for forming thereof |
PCT/US2006/060639 WO2007094873A2 (en) | 2005-12-14 | 2006-11-08 | Back-gated semiconductor device with a storage layer |
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US9780231B1 (en) | 2016-09-21 | 2017-10-03 | Globalfoundries Singapore Pte. Ltd. | Integrated circuits with flash memory and methods for producing the same |
CN107464817B (zh) * | 2017-08-23 | 2018-09-18 | 长江存储科技有限责任公司 | 一种3d nand闪存的制作方法 |
US10522561B2 (en) | 2017-08-23 | 2019-12-31 | Yangtze Memory Technologies Co., Ltd. | Method for forming a three-dimensional memory device |
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