JP2009512566A5 - - Google Patents
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- Publication number
- JP2009512566A5 JP2009512566A5 JP2008536710A JP2008536710A JP2009512566A5 JP 2009512566 A5 JP2009512566 A5 JP 2009512566A5 JP 2008536710 A JP2008536710 A JP 2008536710A JP 2008536710 A JP2008536710 A JP 2008536710A JP 2009512566 A5 JP2009512566 A5 JP 2009512566A5
- Authority
- JP
- Japan
- Prior art keywords
- abrasive
- phase
- superabrasive material
- workpiece
- abrasive article
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims 9
- 229910052751 metal Inorganic materials 0.000 claims 8
- 239000002184 metal Substances 0.000 claims 8
- 239000002131 composite material Substances 0.000 claims 7
- 239000011347 resin Substances 0.000 claims 7
- 229920005989 resin Polymers 0.000 claims 7
- 238000000034 method Methods 0.000 claims 4
- 238000005498 polishing Methods 0.000 claims 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 2
- 230000001070 adhesive effect Effects 0.000 claims 2
- 229910052594 sapphire Inorganic materials 0.000 claims 2
- 239000010980 sapphire Substances 0.000 claims 2
- WKBPZYKAUNRMKP-UHFFFAOYSA-N 1-[2-(2,4-dichlorophenyl)pentyl]1,2,4-triazole Chemical compound C=1C=C(Cl)C=C(Cl)C=1C(CCC)CN1C=NC=N1 WKBPZYKAUNRMKP-UHFFFAOYSA-N 0.000 claims 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052582 BN Inorganic materials 0.000 claims 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910002601 GaN Inorganic materials 0.000 claims 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 229910000831 Steel Inorganic materials 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052787 antimony Inorganic materials 0.000 claims 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims 1
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 229910052793 cadmium Inorganic materials 0.000 claims 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 229910052732 germanium Inorganic materials 0.000 claims 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 239000011133 lead Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000005011 phenolic resin Substances 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920006254 polymer film Polymers 0.000 claims 1
- 239000010453 quartz Substances 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000002002 slurry Substances 0.000 claims 1
- 229910001220 stainless steel Inorganic materials 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 239000011135 tin Substances 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 239000011031 topaz Substances 0.000 claims 1
- 229910052853 topaz Inorganic materials 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/254,614 US7594845B2 (en) | 2005-10-20 | 2005-10-20 | Abrasive article and method of modifying the surface of a workpiece |
| US11/254,614 | 2005-10-20 | ||
| PCT/US2006/040317 WO2007047558A1 (en) | 2005-10-20 | 2006-10-16 | Abrasive article and method of modifying the surface of a workpiece |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009512566A JP2009512566A (ja) | 2009-03-26 |
| JP2009512566A5 true JP2009512566A5 (enExample) | 2009-11-26 |
| JP5379481B2 JP5379481B2 (ja) | 2013-12-25 |
Family
ID=37962831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008536710A Expired - Fee Related JP5379481B2 (ja) | 2005-10-20 | 2006-10-16 | 研磨材物品及び加工物の表面の修正方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7594845B2 (enExample) |
| EP (1) | EP1954446A4 (enExample) |
| JP (1) | JP5379481B2 (enExample) |
| KR (1) | KR101300874B1 (enExample) |
| CN (1) | CN101291780A (enExample) |
| TW (1) | TW200730304A (enExample) |
| WO (1) | WO2007047558A1 (enExample) |
Families Citing this family (75)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9868100B2 (en) | 1997-04-04 | 2018-01-16 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9221154B2 (en) | 1997-04-04 | 2015-12-29 | Chien-Min Sung | Diamond tools and methods for making the same |
| US9199357B2 (en) | 1997-04-04 | 2015-12-01 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9463552B2 (en) | 1997-04-04 | 2016-10-11 | Chien-Min Sung | Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods |
| US9238207B2 (en) | 1997-04-04 | 2016-01-19 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US9409280B2 (en) | 1997-04-04 | 2016-08-09 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
| US20070060026A1 (en) * | 2005-09-09 | 2007-03-15 | Chien-Min Sung | Methods of bonding superabrasive particles in an organic matrix |
| US8678878B2 (en) | 2009-09-29 | 2014-03-25 | Chien-Min Sung | System for evaluating and/or improving performance of a CMP pad dresser |
| US8393934B2 (en) * | 2006-11-16 | 2013-03-12 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
| US9138862B2 (en) | 2011-05-23 | 2015-09-22 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
| US8398466B2 (en) * | 2006-11-16 | 2013-03-19 | Chien-Min Sung | CMP pad conditioners with mosaic abrasive segments and associated methods |
| US9724802B2 (en) | 2005-05-16 | 2017-08-08 | Chien-Min Sung | CMP pad dressers having leveled tips and associated methods |
| US8622787B2 (en) * | 2006-11-16 | 2014-01-07 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
| US7573073B2 (en) * | 2005-11-22 | 2009-08-11 | 3M Innovative Properties Company | Arrays of light emitting articles and method of manufacturing same |
| US20080153398A1 (en) * | 2006-11-16 | 2008-06-26 | Chien-Min Sung | Cmp pad conditioners and associated methods |
| KR20090089431A (ko) * | 2006-11-17 | 2009-08-21 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Led 광원용 광학 접합 조성물 |
| CN101536201A (zh) * | 2006-11-17 | 2009-09-16 | 3M创新有限公司 | 具有光学提取器的平面化发光二极管 |
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| US8323072B1 (en) * | 2007-03-21 | 2012-12-04 | 3M Innovative Properties Company | Method of polishing transparent armor |
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| US8393938B2 (en) * | 2007-11-13 | 2013-03-12 | Chien-Min Sung | CMP pad dressers |
| TWI388402B (en) * | 2007-12-06 | 2013-03-11 | Methods for orienting superabrasive particles on a surface and associated tools | |
| JP5597140B2 (ja) * | 2007-12-31 | 2014-10-01 | スリーエム イノベイティブ プロパティズ カンパニー | プラズマ処理された研磨物品及び同物品の作製方法 |
| DE102008021636B3 (de) * | 2008-04-30 | 2009-11-19 | Esk Ceramics Gmbh & Co. Kg | Verfahren zum Fixieren eines Verbindungselements auf einem Werkstück und Bauteil aus einem Werkstück mit einem darauf fixierten Verbindungselement |
| JP2009302136A (ja) * | 2008-06-10 | 2009-12-24 | Panasonic Corp | 半導体集積回路 |
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| JP2012500865A (ja) * | 2008-08-21 | 2012-01-12 | イノーバ ダイナミクス インコーポレイテッド | 増強された表面、コーティング、および関連方法 |
| EP2419243A1 (en) * | 2009-04-17 | 2012-02-22 | 3M Innovative Properties Company | Metal particle transfer article, metal modified substrate, and method of making and using the same |
| US8801497B2 (en) | 2009-04-30 | 2014-08-12 | Rdc Holdings, Llc | Array of abrasive members with resilient support |
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| KR102370288B1 (ko) * | 2012-07-23 | 2022-03-04 | 제이에이치 로드스 컴퍼니, 인크 | 비평면 유리 연마 패드 및 상기 연마 패드 제작 방법 |
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| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
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| CN113579992A (zh) | 2014-10-17 | 2021-11-02 | 应用材料公司 | 使用加成制造工艺的具复合材料特性的cmp衬垫建构 |
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| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
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| CN116936344B (zh) * | 2023-07-24 | 2025-08-26 | 江苏邑文微电子科技有限公司 | 一种半导体材料的减薄抛光方法及减薄抛光装置 |
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| US6243520B1 (en) * | 1999-08-16 | 2001-06-05 | Schott Fiber Optics, Inc. | Optical fiber bundle having an aligned optical fiber array and method of fabricating the same |
| CA2408249A1 (en) * | 2000-05-09 | 2001-11-15 | 3M Innovative Properties Company | Porous abrasive article having ceramic abrasive composites, methods of making, and methods of use |
| US8545583B2 (en) * | 2000-11-17 | 2013-10-01 | Wayne O. Duescher | Method of forming a flexible abrasive sheet article |
| US7520800B2 (en) * | 2003-04-16 | 2009-04-21 | Duescher Wayne O | Raised island abrasive, lapping apparatus and method of use |
| JP3943348B2 (ja) * | 2001-06-06 | 2007-07-11 | 株式会社オハラ | 光学ガラス |
| JP2003231051A (ja) * | 2002-02-07 | 2003-08-19 | Nihon Micro Coating Co Ltd | 研磨装置及び方法 |
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| US7221829B2 (en) * | 2003-02-24 | 2007-05-22 | Ngk Spark Plug Co., Ltd. | Substrate assembly for supporting optical component and method of producing the same |
| DE10319274A1 (de) * | 2003-04-29 | 2004-12-02 | Osram Opto Semiconductors Gmbh | Lichtquelle |
| US7009213B2 (en) * | 2003-07-31 | 2006-03-07 | Lumileds Lighting U.S., Llc | Light emitting devices with improved light extraction efficiency |
| US7123015B2 (en) * | 2004-09-29 | 2006-10-17 | General Electric Company | Magnetic resonance system and method |
| US7304425B2 (en) * | 2004-10-29 | 2007-12-04 | 3M Innovative Properties Company | High brightness LED package with compound optical element(s) |
| US7330319B2 (en) * | 2004-10-29 | 2008-02-12 | 3M Innovative Properties Company | High brightness LED package with multiple optical elements |
| US20060091412A1 (en) * | 2004-10-29 | 2006-05-04 | Wheatley John A | Polarized LED |
| US7329982B2 (en) * | 2004-10-29 | 2008-02-12 | 3M Innovative Properties Company | LED package with non-bonded optical element |
| US20060091411A1 (en) * | 2004-10-29 | 2006-05-04 | Ouderkirk Andrew J | High brightness LED package |
| US7404756B2 (en) * | 2004-10-29 | 2008-07-29 | 3M Innovative Properties Company | Process for manufacturing optical and semiconductor elements |
| US7169031B1 (en) * | 2005-07-28 | 2007-01-30 | 3M Innovative Properties Company | Self-contained conditioning abrasive article |
| US7494519B2 (en) * | 2005-07-28 | 2009-02-24 | 3M Innovative Properties Company | Abrasive agglomerate polishing method |
| US7573073B2 (en) * | 2005-11-22 | 2009-08-11 | 3M Innovative Properties Company | Arrays of light emitting articles and method of manufacturing same |
-
2005
- 2005-10-20 US US11/254,614 patent/US7594845B2/en not_active Expired - Fee Related
-
2006
- 2006-10-16 KR KR1020087009275A patent/KR101300874B1/ko not_active Expired - Fee Related
- 2006-10-16 EP EP06826005A patent/EP1954446A4/en not_active Withdrawn
- 2006-10-16 JP JP2008536710A patent/JP5379481B2/ja not_active Expired - Fee Related
- 2006-10-16 WO PCT/US2006/040317 patent/WO2007047558A1/en not_active Ceased
- 2006-10-16 CN CNA2006800392406A patent/CN101291780A/zh active Pending
- 2006-10-19 TW TW095138664A patent/TW200730304A/zh unknown
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