JP2009510773A5 - - Google Patents
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- Publication number
- JP2009510773A5 JP2009510773A5 JP2008533415A JP2008533415A JP2009510773A5 JP 2009510773 A5 JP2009510773 A5 JP 2009510773A5 JP 2008533415 A JP2008533415 A JP 2008533415A JP 2008533415 A JP2008533415 A JP 2008533415A JP 2009510773 A5 JP2009510773 A5 JP 2009510773A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- ppm
- less
- amount
- transition metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 claims 23
- 229910052723 transition metal Inorganic materials 0.000 claims 15
- 150000003624 transition metals Chemical class 0.000 claims 15
- 238000000034 method Methods 0.000 claims 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 10
- 239000002002 slurry Substances 0.000 claims 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 7
- 230000000737 periodic effect Effects 0.000 claims 6
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 5
- 229910052742 iron Inorganic materials 0.000 claims 5
- 238000005498 polishing Methods 0.000 claims 5
- 229910052726 zirconium Inorganic materials 0.000 claims 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 4
- 239000000377 silicon dioxide Substances 0.000 claims 3
- 239000000126 substance Substances 0.000 claims 3
- 229910052727 yttrium Inorganic materials 0.000 claims 3
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 239000007788 liquid Substances 0.000 claims 2
- 239000000843 powder Substances 0.000 claims 2
- 229910021485 fumed silica Inorganic materials 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/238,236 US20070068901A1 (en) | 2005-09-29 | 2005-09-29 | Composition and method for enhancing pot life of hydrogen peroxide-containing CMP slurries |
| PCT/US2006/036057 WO2007040956A1 (en) | 2005-09-29 | 2006-09-15 | Composition and method for enhancing pot life of hydrogen peroxide-containing cmp slurries |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009510773A JP2009510773A (ja) | 2009-03-12 |
| JP2009510773A5 true JP2009510773A5 (enExample) | 2009-10-22 |
Family
ID=37622044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008533415A Pending JP2009510773A (ja) | 2005-09-29 | 2006-09-15 | 過酸化水素含有ｃｍｐスラリーのポットライフを長くするための組成物及び方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US20070068901A1 (enExample) |
| EP (1) | EP1929071A1 (enExample) |
| JP (1) | JP2009510773A (enExample) |
| KR (1) | KR20080059609A (enExample) |
| CN (1) | CN101316950B (enExample) |
| IL (1) | IL190426A (enExample) |
| TW (1) | TWI316096B (enExample) |
| WO (1) | WO2007040956A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102834476B (zh) * | 2009-11-06 | 2015-11-25 | 安集微电子（上海）有限公司 | 一种化学机械抛光液 |
| WO2011097954A1 (zh) * | 2010-02-11 | 2011-08-18 | 安集微电子（上海）有限公司 | 一种用于钨化学机械抛光方法 |
| CN103409757B (zh) * | 2013-08-26 | 2016-01-20 | 中核(天津)科技发展有限公司 | 一种环保型铜制品用化学抛光液及其制备方法 |
| CN104451853B (zh) * | 2014-11-06 | 2016-08-24 | 燕山大学 | 一种镍毛细管内表面的抛光方法 |
| CN111108171B (zh) * | 2017-09-29 | 2022-08-12 | 福吉米株式会社 | 研磨用组合物 |
| KR102808137B1 (ko) * | 2018-07-20 | 2025-05-16 | 주식회사 동진쎄미켐 | 화학적 기계적 연마 조성물, 화학적 기계적 연마 슬러리 및 기판의 연마 방법 |
| WO2020017894A1 (ko) | 2018-07-20 | 2020-01-23 | 주식회사 동진쎄미켐 | 화학적 기계적 연마 조성물, 화학적 기계적 연마 슬러리 및 기판의 연마 방법 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8701759D0 (en) * | 1987-01-27 | 1987-03-04 | Laporte Industries Ltd | Processing of semi-conductor materials |
| GB9326522D0 (en) * | 1993-12-29 | 1994-03-02 | Solvay Interox Ltd | Process for stabilising particulate alkali metal percarbonate |
| KR19980019046A (ko) * | 1996-08-29 | 1998-06-05 | 고사이 아키오 | 연마용 조성물 및 이의 용도(Abrasive composition and use of the same) |
| SG73683A1 (en) * | 1998-11-24 | 2000-06-20 | Texas Instruments Inc | Stabilized slurry compositions |
| US6355075B1 (en) * | 2000-02-11 | 2002-03-12 | Fujimi Incorporated | Polishing composition |
| US20040198584A1 (en) * | 2003-04-02 | 2004-10-07 | Saint-Gobain Ceramics & Plastic, Inc. | Nanoporous ultrafine alpha-alumina powders and freeze drying process of preparing same |
| US7344988B2 (en) * | 2003-10-27 | 2008-03-18 | Dupont Air Products Nanomaterials Llc | Alumina abrasive for chemical mechanical polishing |
| US20050090104A1 (en) * | 2003-10-27 | 2005-04-28 | Kai Yang | Slurry compositions for chemical mechanical polishing of copper and barrier films |
| US7253111B2 (en) * | 2004-04-21 | 2007-08-07 | Rohm And Haas Electronic Materials Cmp Holding, Inc. | Barrier polishing solution |
-
2005
- 2005-09-29 US US11/238,236 patent/US20070068901A1/en not_active Abandoned
-
2006
- 2006-09-15 KR KR1020087010173A patent/KR20080059609A/ko not_active Ceased
- 2006-09-15 WO PCT/US2006/036057 patent/WO2007040956A1/en not_active Ceased
- 2006-09-15 CN CN2006800447752A patent/CN101316950B/zh not_active Expired - Fee Related
- 2006-09-15 JP JP2008533415A patent/JP2009510773A/ja active Pending
- 2006-09-15 EP EP06803687A patent/EP1929071A1/en not_active Withdrawn
- 2006-09-28 TW TW095136029A patent/TWI316096B/zh not_active IP Right Cessation
-
2008
- 2008-01-25 US US12/011,435 patent/US20080132071A1/en not_active Abandoned
- 2008-03-25 IL IL190426A patent/IL190426A/en not_active IP Right Cessation
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