JP2009507395A5 - - Google Patents

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Publication number
JP2009507395A5
JP2009507395A5 JP2008530160A JP2008530160A JP2009507395A5 JP 2009507395 A5 JP2009507395 A5 JP 2009507395A5 JP 2008530160 A JP2008530160 A JP 2008530160A JP 2008530160 A JP2008530160 A JP 2008530160A JP 2009507395 A5 JP2009507395 A5 JP 2009507395A5
Authority
JP
Japan
Prior art keywords
heat spreader
flux
preform
solder
effective amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008530160A
Other languages
English (en)
Japanese (ja)
Other versions
JP5345848B2 (ja
JP2009507395A (ja
Filing date
Publication date
Priority claimed from US11/220,457 external-priority patent/US20070051774A1/en
Application filed filed Critical
Publication of JP2009507395A publication Critical patent/JP2009507395A/ja
Publication of JP2009507395A5 publication Critical patent/JP2009507395A5/ja
Application granted granted Critical
Publication of JP5345848B2 publication Critical patent/JP5345848B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008530160A 2005-09-06 2006-09-05 半導体パッケージに使用されるヒートスプレッダ上へのはんだの堆積を制御する方法 Expired - Fee Related JP5345848B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/220,457 2005-09-06
US11/220,457 US20070051774A1 (en) 2005-09-06 2005-09-06 Method of controlling solder deposition on heat spreader used for semiconductor package
PCT/US2006/034678 WO2007030516A1 (en) 2005-09-06 2006-09-05 Method of controlling solder deposition on heat spreader used for semiconductor package

Publications (3)

Publication Number Publication Date
JP2009507395A JP2009507395A (ja) 2009-02-19
JP2009507395A5 true JP2009507395A5 (enExample) 2009-11-05
JP5345848B2 JP5345848B2 (ja) 2013-11-20

Family

ID=37622172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008530160A Expired - Fee Related JP5345848B2 (ja) 2005-09-06 2006-09-05 半導体パッケージに使用されるヒートスプレッダ上へのはんだの堆積を制御する方法

Country Status (3)

Country Link
US (1) US20070051774A1 (enExample)
JP (1) JP5345848B2 (enExample)
WO (1) WO2007030516A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7319048B2 (en) * 2004-09-03 2008-01-15 Intel Corporation Electronic assemblies having a low processing temperature
US7968426B1 (en) * 2005-10-24 2011-06-28 Microwave Bonding Instruments, Inc. Systems and methods for bonding semiconductor substrates to metal substrates using microwave energy
DE102005053553A1 (de) * 2005-11-08 2007-05-16 Heraeus Gmbh W C Lotpasten mit harzfreien Flussmittel
US7651938B2 (en) 2006-06-07 2010-01-26 Advanced Micro Devices, Inc. Void reduction in indium thermal interface material
US7829195B2 (en) * 2006-12-31 2010-11-09 Intel Corporation Fluorination pre-treatment of heat spreader attachment indium thermal interface material
US20080156635A1 (en) * 2006-12-31 2008-07-03 Simon Bogdan M System for processes including fluorination
US8728872B2 (en) * 2011-08-18 2014-05-20 DY 4 Systems, Inc. Manufacturing process and heat dissipating device for forming interface for electronic component
HUE061641T2 (hu) * 2019-12-10 2023-07-28 Heraeus Deutschland Gmbh & Co Kg Forrasztópaszta

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US4817854A (en) * 1985-03-11 1989-04-04 The United States Of America As Represented By The Secretary Of The Air Force LED soldering method utilizing a PT migration barrier
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US5543585A (en) * 1994-02-02 1996-08-06 International Business Machines Corporation Direct chip attachment (DCA) with electrically conductive adhesives
US5411199A (en) * 1994-03-07 1995-05-02 Motorola, Inc. Method for attaching a shield
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KR0181615B1 (ko) * 1995-01-30 1999-04-15 모리시다 요이치 반도체 장치의 실장체, 그 실장방법 및 실장용 밀봉재
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US5985043A (en) * 1997-07-21 1999-11-16 Miguel Albert Capote Polymerizable fluxing agents and fluxing adhesive compositions therefrom
US6139336A (en) * 1996-11-14 2000-10-31 Berg Technology, Inc. High density connector having a ball type of contact surface
US6017634A (en) * 1997-07-21 2000-01-25 Miguel Albert Capote Carboxyl-containing polyunsaturated fluxing agent and carboxyl-reactive neutralizing agent as adhesive
US6367150B1 (en) * 1997-09-05 2002-04-09 Northrop Grumman Corporation Solder flux compatible with flip-chip underfill material
JP3311282B2 (ja) * 1997-10-13 2002-08-05 株式会社東芝 金属部材の接合方法及び接合体
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US6057381A (en) * 1998-07-02 2000-05-02 National Starch And Chemical Investment Holding Corporation Method of making an electronic component using reworkable underfill encapsulants
JP2000036518A (ja) * 1998-07-16 2000-02-02 Nitto Denko Corp ウェハスケールパッケージ構造およびこれに用いる回路基板
US6154364A (en) * 1998-11-19 2000-11-28 Delco Electronics Corp. Circuit board assembly with IC device mounted thereto
US6362435B1 (en) * 1999-12-20 2002-03-26 Delphi Technologies, Inc. Multi-layer conductor pad for reducing solder voiding
US6548790B1 (en) * 2000-02-24 2003-04-15 Trucco Horacio Andres Apparatus for manufacturing solid solder deposit PCBs
JP2001339011A (ja) * 2000-03-24 2001-12-07 Shinko Electric Ind Co Ltd 半導体装置およびその製造方法
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JP4609617B2 (ja) * 2000-08-01 2011-01-12 日本電気株式会社 半導体装置の実装方法及び実装構造体
KR100371567B1 (ko) * 2000-12-08 2003-02-07 삼성테크윈 주식회사 Ａｇ 선도금을 이용한 반도체 패키지용 리드프레임
JP2002273567A (ja) * 2001-03-16 2002-09-25 Nidec Tosok Corp スパンカツール
JP2003001408A (ja) * 2001-06-19 2003-01-08 Seiko Instruments Inc 基板同士のはんだ接合方法
US6800141B2 (en) * 2001-12-21 2004-10-05 International Business Machines Corporation Semi-aqueous solvent based method of cleaning rosin flux residue
US7846778B2 (en) * 2002-02-08 2010-12-07 Intel Corporation Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
US7182241B2 (en) * 2002-08-09 2007-02-27 Micron Technology, Inc. Multi-functional solder and articles made therewith, such as microelectronic components
US6786391B2 (en) * 2002-10-16 2004-09-07 Kac Holdings, Inc. Method of controlling solder deposition utilizing two fluxes and preform
JP2005007412A (ja) * 2003-06-17 2005-01-13 Sumitomo Metal Mining Co Ltd 半田クラッド片
US20050121776A1 (en) * 2003-12-05 2005-06-09 Deppisch Carl L. Integrated solder and heat spreader fabrication

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