JP2009505442A5 - - Google Patents

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Publication number
JP2009505442A5
JP2009505442A5 JP2008544315A JP2008544315A JP2009505442A5 JP 2009505442 A5 JP2009505442 A5 JP 2009505442A5 JP 2008544315 A JP2008544315 A JP 2008544315A JP 2008544315 A JP2008544315 A JP 2008544315A JP 2009505442 A5 JP2009505442 A5 JP 2009505442A5
Authority
JP
Japan
Prior art keywords
solder pads
side surfaces
pwb
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008544315A
Other languages
English (en)
Other versions
JP2009505442A (ja
Filing date
Publication date
Priority claimed from US11/161,872 external-priority patent/US7919717B2/en
Application filed filed Critical
Publication of JP2009505442A publication Critical patent/JP2009505442A/ja
Publication of JP2009505442A5 publication Critical patent/JP2009505442A5/ja
Pending legal-status Critical Current

Links

Claims (3)

  1. 上面、下面、および１つ以上の側面を形成する一緒に積層された２層以上の絶縁層と、
    前記１つ以上の側面のうち少なくとも１つの側面に位置した１つ以上の半田パッドとを備え、前記半田パッドの少なくとも１つが少なくとも１つのビア（VIA）およびトレースを介して上面および下面の少なくとも一方と電気的に接続することを特徴とするプリント配線基板（ＰＷＢ）。
  2. 前記１つ以上の半田パッドが、前記１つ以上の側面に露出された空隙部を含む請求項１に記載のＰＷＢ。
  3. 前記上面および前記下面の少なくとも一方が１つ以上の半田パッドを有する請求項２に記載のＰＷＢ。
JP2008544315A 2005-08-19 2006-05-18 三次元プリント回路基板 Pending JP2009505442A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/161,872 US7919717B2 (en) 2005-08-19 2005-08-19 Three-dimensional printed circuit board
PCT/US2006/019333 WO2008060256A2 (en) 2005-08-19 2006-05-18 Three-dimensional printed circuit board and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JP2009505442A JP2009505442A (ja) 2009-02-05
JP2009505442A5 true JP2009505442A5 (ja) 2009-07-02

Family

ID=37882933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008544315A Pending JP2009505442A (ja) 2005-08-19 2006-05-18 三次元プリント回路基板

Country Status (4)

Country Link
US (1) US7919717B2 (ja)
EP (1) EP1949773A2 (ja)
JP (1) JP2009505442A (ja)
WO (1) WO2008060256A2 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090091892A1 (en) * 2007-09-26 2009-04-09 Rohm Co., Ltd. Semiconductor Device
US7863722B2 (en) * 2008-10-20 2011-01-04 Micron Technology, Inc. Stackable semiconductor assemblies and methods of manufacturing such assemblies
JP5636834B2 (ja) * 2010-09-10 2014-12-10 富士通株式会社 高周波回路用パッケージ及び高周波回路装置
JP5753734B2 (ja) * 2011-05-19 2015-07-22 日本特殊陶業株式会社 配線基板、多数個取り配線基板、およびその製造方法
CA2854034C (en) 2011-11-18 2019-01-22 Honeywell International Inc. Fabrication of three-dimensional printed circuit board structures
DE102012205439A1 (de) * 2012-04-03 2013-10-10 Zf Friedrichshafen Ag Schaltungsträger und Verfahren zur Herstellung desselben
US9288898B2 (en) 2012-09-18 2016-03-15 Palo Alto Research Center Incorporated Reconfigurable stretchable connector substrate
US9831144B2 (en) * 2013-08-28 2017-11-28 Qubeicon Ltd. Semiconductor die and package jigsaw submount
US10098241B2 (en) 2015-10-23 2018-10-09 International Business Machines Corporation Printed circuit board with edge soldering for high-density packages and assemblies
CN105392279A (zh) * 2015-12-17 2016-03-09 王朝 一种pcb板边缘多排焊盘及多排边缘焊盘pcb板的制备方法
US10321580B2 (en) * 2016-07-29 2019-06-11 International Business Machines Corporation Integrated circuit package assembly comprising a stack of slanted integrated circuit packages
EP3961693A4 (en) * 2019-04-23 2023-05-24 Kyocera Corporation CONNECTION BOARD, ELECTRONIC DEVICE AND ELECTRONIC MODULE

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4868712A (en) * 1987-02-04 1989-09-19 Woodman John K Three dimensional integrated circuit package
US4821007A (en) * 1987-02-06 1989-04-11 Tektronix, Inc. Strip line circuit component and method of manufacture
US5109479A (en) 1989-09-07 1992-04-28 Amp-Akzo Corporation Method of designing three dimensional electrical circuits
US6072239A (en) * 1995-11-08 2000-06-06 Fujitsu Limited Device having resin package with projections
FR2747235B1 (fr) 1996-04-03 1998-07-10 Bull Sa Boitier de circuit integre
US5914534A (en) 1996-05-03 1999-06-22 Ford Motor Company Three-dimensional multi-layer molded electronic device and method for manufacturing same
JP3447908B2 (ja) 1997-02-13 2003-09-16 富士通株式会社 ボールグリッドアレイパッケージ
US6084778A (en) 1997-04-29 2000-07-04 Texas Instruments Incorporated Three dimensional assembly using flexible wiring board
US6206705B1 (en) 1997-10-03 2001-03-27 California Institute Of Technology Three-dimensional modular electronic interconnection system
RU2176134C2 (ru) 1998-07-02 2001-11-20 Закрытое акционерное общество "Техно-ТМ" Трехмерный электронный модуль и способ его изготовления
JP2000124588A (ja) * 1998-10-19 2000-04-28 Alps Electric Co Ltd 電子回路ユニット、並びに電子回路ユニットの製造方法
US20030038366A1 (en) 1999-03-09 2003-02-27 Kabushiki Kaisha Toshiba Three-dimensional semiconductor device having plural active semiconductor components
US6675472B1 (en) * 1999-04-29 2004-01-13 Unicap Electronics Industrial Corporation Process and structure for manufacturing plastic chip carrier
JP3664001B2 (ja) * 1999-10-25 2005-06-22 株式会社村田製作所 モジュール基板の製造方法
JP2001326441A (ja) 2000-05-17 2001-11-22 Sony Corp 複合配線板及びその製造方法
US6760227B2 (en) * 2000-11-02 2004-07-06 Murata Manufacturing Co., Ltd. Multilayer ceramic electronic component and manufacturing method thereof
JP2004523908A (ja) 2001-01-17 2004-08-05 ハネウェル・インターナショナル・インコーポレーテッド プラスチックリード付きチップキャリア（ｐｌｃｃ）および他の表面実装技術（ｓｍｔ）チップキャリアのためのアダプタ
US6721187B2 (en) 2001-03-16 2004-04-13 International Business Machines Corporation Multi-layered high density connections
DE60220405T2 (de) 2001-06-04 2008-01-31 Polymer Group, Inc. Dreidimensionales vliesstoffsubstrat für leiterplatte
DE10134620A1 (de) * 2001-07-17 2003-02-06 Bosch Gmbh Robert Mehraxiales Inertialsensorsystem und Verfahren zu seiner Herstellung
US6664864B2 (en) 2001-10-31 2003-12-16 Cts Corporation Cavity design printed circuit board for a temperature compensated crystal oscillator and a temperature compensated crystal oscillator employing the same
US6668447B2 (en) 2001-11-20 2003-12-30 St. Jude Children's Research Hospital Multilayered board comprising folded flexible circuits and method of manufacture
JP3808357B2 (ja) * 2001-12-12 2006-08-09 京セラ株式会社 配線基板
SG111069A1 (en) * 2002-06-18 2005-05-30 Micron Technology Inc Semiconductor devices including peripherally located bond pads, assemblies, packages, and methods
US6737738B2 (en) 2002-07-16 2004-05-18 Kingston Technology Corporation Multi-level package for a memory module
KR100495211B1 (ko) 2002-11-25 2005-06-14 삼성전기주식회사 세라믹 다층기판 및 그 제조방법
JP2004247699A (ja) * 2002-12-20 2004-09-02 Kyocera Corp 配線基板
US6918297B2 (en) 2003-02-28 2005-07-19 Honeywell International, Inc. Miniature 3-dimensional package for MEMS sensors
US7040922B2 (en) 2003-06-05 2006-05-09 Analog Devices, Inc. Multi-surface mounting member and electronic device

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