JP2009504891A5 - - Google Patents

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Publication number
JP2009504891A5
JP2009504891A5 JP2008527142A JP2008527142A JP2009504891A5 JP 2009504891 A5 JP2009504891 A5 JP 2009504891A5 JP 2008527142 A JP2008527142 A JP 2008527142A JP 2008527142 A JP2008527142 A JP 2008527142A JP 2009504891 A5 JP2009504891 A5 JP 2009504891A5
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JP
Japan
Prior art keywords
composition
polymer
substrate
olefin
olefin polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008527142A
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English (en)
Japanese (ja)
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JP5519935B2 (ja
JP2009504891A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2006/032171 external-priority patent/WO2007022372A2/en
Publication of JP2009504891A publication Critical patent/JP2009504891A/ja
Publication of JP2009504891A5 publication Critical patent/JP2009504891A5/ja
Application granted granted Critical
Publication of JP5519935B2 publication Critical patent/JP5519935B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2008527142A 2005-08-17 2006-08-17 耐熱性の改良されたポリオレフィン基体のホットメルト接着剤 Expired - Fee Related JP5519935B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US70895305P 2005-08-17 2005-08-17
US60/708,953 2005-08-17
PCT/US2006/032171 WO2007022372A2 (en) 2005-08-17 2006-08-17 Polyolefin based hot melt adhesive having improved heat resistance

Publications (3)

Publication Number Publication Date
JP2009504891A JP2009504891A (ja) 2009-02-05
JP2009504891A5 true JP2009504891A5 (cg-RX-API-DMAC7.html) 2009-09-24
JP5519935B2 JP5519935B2 (ja) 2014-06-11

Family

ID=37607258

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008527142A Expired - Fee Related JP5519935B2 (ja) 2005-08-17 2006-08-17 耐熱性の改良されたポリオレフィン基体のホットメルト接着剤

Country Status (6)

Country Link
US (1) US8476359B2 (cg-RX-API-DMAC7.html)
EP (1) EP1924648B1 (cg-RX-API-DMAC7.html)
JP (1) JP5519935B2 (cg-RX-API-DMAC7.html)
CA (1) CA2619351C (cg-RX-API-DMAC7.html)
ES (1) ES2389968T3 (cg-RX-API-DMAC7.html)
WO (1) WO2007022372A2 (cg-RX-API-DMAC7.html)

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DE102006044754A1 (de) * 2006-08-18 2008-02-21 Ewald Dörken Ag Bahn und Klebeband
JP2008163129A (ja) * 2006-12-27 2008-07-17 Yokohama Rubber Co Ltd:The タイヤトレッド用ゴム組成物
US8481634B2 (en) * 2007-09-07 2013-07-09 Bostik, Inc. Hot melt desiccant matrix composition based on plasticized polyolefin binder
PL2250206T3 (pl) * 2008-01-04 2013-03-29 Johnson Controls Tech Co Element wykończeniowy o podwyższonej zawartości zasobów odnawialnych
US8076407B2 (en) * 2008-02-08 2011-12-13 Henkel Ag & Co. Kgaa Hot melt adhesive
BRPI0912369A2 (pt) * 2008-05-16 2019-09-24 Proprietect Llp produto laminado de espuma e processo para a produção do mesmo
DE102008026672A1 (de) * 2008-06-04 2009-12-10 Tesa Se Klebstoff aus Polypropylenharz
EP2396167A4 (en) 2009-02-10 2013-10-02 Proprietect Lp FOAM LAMINATE PRODUCT AND MANUFACTURING METHOD THEREFOR
JP5537824B2 (ja) * 2009-03-25 2014-07-02 阿波製紙株式会社 自動車用の耐熱コルゲートチューブに使用されるホットメルト剤コーティング無機質紙
JP5740614B2 (ja) * 2009-08-20 2015-06-24 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 低い適用温度のホットメルト接着剤
KR101174019B1 (ko) * 2010-03-17 2012-08-16 주식회사 오공 핫멜트 접착제 조성물
WO2012147951A1 (ja) * 2011-04-27 2012-11-01 東洋インキＳｃホールディングス株式会社 ホットメルト粘着剤、粘着フィルム、被覆物品および被覆物品の製造方法
JP5442061B2 (ja) * 2011-04-27 2014-03-12 東洋インキＳｃホールディングス株式会社 ホットメルト粘着剤、粘着フィルム、被覆物品および被覆物品の製造方法
WO2012149391A1 (en) 2011-04-28 2012-11-01 Adherent Laboratories, Inc. Polyolefin based hot melt adhesive composition
CA2888745C (en) * 2012-07-16 2020-09-22 Bostik, Inc. Polypropylene impact copolymer based hot melt adhesive
US9241843B2 (en) 2012-09-19 2016-01-26 The Procter & Gamble Company Article with tackifier-free adhesive
US8865824B2 (en) 2012-09-19 2014-10-21 IFS Industries Inc. Hot melt adhesive
US20140235127A1 (en) * 2013-02-21 2014-08-21 Henkel Corporation Elastic attachment adhesive and use thereof
US20140272214A1 (en) * 2013-03-12 2014-09-18 Henkel Ltd. Adhesive compostions with wide service temperature window and use thereof
BR112015029180B8 (pt) 2013-05-23 2022-04-19 Bostik Inc Adesivo fundido a quente para uso em substratos porosos
US10307995B2 (en) * 2013-07-16 2019-06-04 Bostik, Inc. Polypropylene impact copolymer based hot melt adhesive
JP6154725B2 (ja) * 2013-10-24 2017-06-28 ヘンケルジャパン株式会社 ホットメルト接着剤
US10639210B2 (en) 2013-12-19 2020-05-05 The Procter & Gamble Company Article with tackifier-free adhesive
WO2015135113A1 (en) * 2014-03-10 2015-09-17 Henkel (China) Company Limited Hot melt adhesive composition for bookbinding
CN105197344A (zh) 2014-06-25 2015-12-30 艾尔戴克斯国际公司 承载结构
PL3207103T3 (pl) * 2014-10-13 2021-11-29 Bostik, Inc. Kleje topliwe na bazie poliolefin o ulepszonych właściwościach przetwórczych i charakterystyce wiązania
MX2017009573A (es) 2015-01-23 2017-12-11 Bostik Inc Adhesivo termofusible termoformable con baja temperatura de activación basado en una poliolefina metalocénica.
JP6776253B2 (ja) 2015-03-02 2020-10-28 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 伸縮性積層体
CN107428112B (zh) * 2015-03-02 2019-12-13 宝洁公司 拉伸层压体
DE102015217376A1 (de) * 2015-09-11 2017-03-16 Tesa Se Haftklebstoff auf Basis EPDM
WO2017105531A1 (en) 2015-12-16 2017-06-22 Airdex Corporation Load bearing structure
CN109072030B (zh) * 2016-04-08 2021-02-02 H.B.富乐公司 高内聚强度聚烯烃构造粘合剂
JP2018083906A (ja) * 2016-11-24 2018-05-31 出光興産株式会社 接着剤組成物
US20180148616A1 (en) * 2016-11-28 2018-05-31 Bostik, Inc. Hot melt adhesives for bonding elastomeric components, nonwoven materials, and thermoplastic films
KR102376112B1 (ko) * 2019-06-27 2022-03-17 삼성에스디아이 주식회사 반도체 소자 밀봉용 조성물 및 반도체 소자 밀봉용 필름
US20230021854A1 (en) * 2019-11-19 2023-01-26 Japan Vilene Company, Ltd. Base material for molding
IT202100011699A1 (it) * 2021-05-07 2022-11-07 Tema Tech And Materials Srl Membrana bugnata per riscaldamento sottopavimento, con cordolo adesivo

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