JP2009500812A5 - - Google Patents

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Publication number
JP2009500812A5
JP2009500812A5 JP2008517075A JP2008517075A JP2009500812A5 JP 2009500812 A5 JP2009500812 A5 JP 2009500812A5 JP 2008517075 A JP2008517075 A JP 2008517075A JP 2008517075 A JP2008517075 A JP 2008517075A JP 2009500812 A5 JP2009500812 A5 JP 2009500812A5
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JP
Japan
Prior art keywords
plasma
plasma confinement
ring
confinement ring
process chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008517075A
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English (en)
Japanese (ja)
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JP5492411B2 (ja
JP2009500812A (ja
Filing date
Publication date
Priority claimed from US11/155,493 external-priority patent/US7713379B2/en
Application filed filed Critical
Publication of JP2009500812A publication Critical patent/JP2009500812A/ja
Publication of JP2009500812A5 publication Critical patent/JP2009500812A5/ja
Application granted granted Critical
Publication of JP5492411B2 publication Critical patent/JP5492411B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008517075A 2005-06-20 2006-06-14 ポリマーの堆積を低減するためのｒｆ吸収材料を含むプラズマ閉じ込めリング Expired - Fee Related JP5492411B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/155,493 2005-06-20
US11/155,493 US7713379B2 (en) 2005-06-20 2005-06-20 Plasma confinement rings including RF absorbing material for reducing polymer deposition
PCT/US2006/023198 WO2007001865A2 (en) 2005-06-20 2006-06-14 Plasma confinement rings including rf absorbing material for reducing polymer deposition

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011269370A Division JP5220178B2 (ja) 2005-06-20 2011-12-08 ポリマーの堆積を低減するためのｒｆ吸収材料を含むプラズマ閉じ込めリング

Publications (3)

Publication Number Publication Date
JP2009500812A JP2009500812A (ja) 2009-01-08
JP2009500812A5 true JP2009500812A5 (enExample) 2009-07-09
JP5492411B2 JP5492411B2 (ja) 2014-05-14

Family

ID=37572195

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008517075A Expired - Fee Related JP5492411B2 (ja) 2005-06-20 2006-06-14 ポリマーの堆積を低減するためのｒｆ吸収材料を含むプラズマ閉じ込めリング
JP2011269370A Expired - Fee Related JP5220178B2 (ja) 2005-06-20 2011-12-08 ポリマーの堆積を低減するためのｒｆ吸収材料を含むプラズマ閉じ込めリング

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2011269370A Expired - Fee Related JP5220178B2 (ja) 2005-06-20 2011-12-08 ポリマーの堆積を低減するためのｒｆ吸収材料を含むプラズマ閉じ込めリング

Country Status (7)

Country Link
US (3) US7713379B2 (enExample)
JP (2) JP5492411B2 (enExample)
KR (2) KR20080025690A (enExample)
CN (1) CN101553900B (enExample)
MY (1) MY164564A (enExample)
TW (1) TWI416996B (enExample)
WO (1) WO2007001865A2 (enExample)

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CN112713075B (zh) * 2019-10-25 2024-03-12 中微半导体设备(上海)股份有限公司 等离子体隔离环、等离子体处理装置与基片处理方法
CN112802729B (zh) * 2019-11-13 2024-05-10 中微半导体设备(上海)股份有限公司 带温度维持装置的隔离环
CN112928007B (zh) * 2019-12-06 2023-09-12 中微半导体设备(上海)股份有限公司 等离子体处理设备及用于等离子体处理设备的下电极组件
CN114830317A (zh) * 2019-12-19 2022-07-29 朗姆研究公司 消耗性室部件中的封装式射频识别
CN113745081B (zh) * 2020-05-27 2024-03-12 中微半导体设备(上海)股份有限公司 一种隔离环组件、等离子体处理装置及处理方法
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