JP2009302117A - タブパターンとリードの接合方法 - Google Patents
タブパターンとリードの接合方法 Download PDFInfo
- Publication number
- JP2009302117A JP2009302117A JP2008151626A JP2008151626A JP2009302117A JP 2009302117 A JP2009302117 A JP 2009302117A JP 2008151626 A JP2008151626 A JP 2008151626A JP 2008151626 A JP2008151626 A JP 2008151626A JP 2009302117 A JP2009302117 A JP 2009302117A
- Authority
- JP
- Japan
- Prior art keywords
- tab
- pattern
- joining
- lead
- base sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
- G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10287—Metal wires as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49007—Indicating transducer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
【解決手段】 ベースシート2上に形成した少なくともタブ本体部3tm…及びこのタブ本体部3tm…の一端辺3tms…から連続形成した接続部3tc…を有するタブパターン3t…における当該タブ本体部3tm…に対して半田付けによりリード4…を接合するに際し、接続部3tc…の延長線Fsに対して所定幅Lx以上オフセットさせる第一位置条件及び一端辺3tms…から所定幅Ly以内となる第二位置条件の双方を満たすタブ本体部3tm…上の位置にリード4…を半田付けする。
【選択図】 図1
Description
Claims (5)
- ベースシート上に形成した少なくともタブ本体部及びこのタブ本体部の一端辺から連続形成した接続部を有するタブパターンにおける当該タブ本体部に対して半田付けによりリードを接合するタブパターンとリードの接合方法において、前記接続部の延長線に対して所定幅以上オフセットさせる第一位置条件及び前記一端辺から所定幅以内となる第二位置条件の双方を満たす前記タブ本体部上の位置に前記リードを半田付けすることを特徴とするタブパターンとリードの接合方法。
- 前記タブパターンは、前記タブ本体部を矩形状に形成するとともに、このタブ本体部における前記一端辺の一側の端部から前記接続部を連続形成することを特徴とする請求項1記載のタブパターンとリードの接合方法。
- 前記ベースシート上の他の部位にひずみゲージ素子パターンを形成し、このゲージ素子パターンと前記接続部を連続形成してなるひずみゲージに適用することを特徴とする請求項1又は2記載のタブパターンとリードの接合方法。
- 前記リードは、前記タブパターンから引き出す外部接続用のリード線であることを特徴とする請求項1,2又は3記載のタブパターンとリードの接合方法。
- 前記リードは、前記ベースシートに実装した電子部品の端子リードであることを特徴とする請求項1,2又は3記載のタブパターンとリードの接合方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008151626A JP5202116B2 (ja) | 2008-06-10 | 2008-06-10 | タブパターンとリードの接合方法 |
US12/454,967 US7937822B2 (en) | 2008-06-10 | 2009-05-27 | Method for connecting tab pattern and lead wire |
CN2009101473016A CN101603806B (zh) | 2008-06-10 | 2009-06-05 | 用于连接接片图案与引线的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008151626A JP5202116B2 (ja) | 2008-06-10 | 2008-06-10 | タブパターンとリードの接合方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009302117A true JP2009302117A (ja) | 2009-12-24 |
JP5202116B2 JP5202116B2 (ja) | 2013-06-05 |
Family
ID=41398990
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008151626A Active JP5202116B2 (ja) | 2008-06-10 | 2008-06-10 | タブパターンとリードの接合方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7937822B2 (ja) |
JP (1) | JP5202116B2 (ja) |
CN (1) | CN101603806B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016078037A (ja) * | 2014-10-10 | 2016-05-16 | ミネベア株式会社 | フレキシブルプリント基板とひずみゲージの接合構造 |
JP2017096900A (ja) * | 2015-11-28 | 2017-06-01 | 株式会社共和電業 | ひずみゲージ |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101657952B1 (ko) * | 2010-11-15 | 2016-09-20 | 주식회사 고영테크놀러지 | 기판 검사방법 |
CN105445126A (zh) * | 2015-11-18 | 2016-03-30 | 四川华西九方电缆有限公司 | 电缆的抗疲劳强度性能测试方法 |
JP2017150931A (ja) * | 2016-02-24 | 2017-08-31 | 株式会社タニタ | ひずみゲージ |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5619705U (ja) * | 1979-07-25 | 1981-02-21 | ||
JPH03242903A (ja) * | 1990-02-21 | 1991-10-29 | Tdk Corp | サーミスタ |
JPH03251704A (ja) * | 1990-02-28 | 1991-11-11 | Showa Sokki:Kk | ストレインゲージの製造方法 |
JP2000133419A (ja) * | 1998-10-29 | 2000-05-12 | Kyocera Corp | セラミックヒータ |
JP2003023244A (ja) * | 2001-07-06 | 2003-01-24 | Taiyo Yuden Co Ltd | 回路基板 |
JP2006023212A (ja) * | 2004-07-08 | 2006-01-26 | Kyowa Electron Instr Co Ltd | ひずみ測定装置およびひずみゲージ判別方法 |
JP2006196916A (ja) * | 2006-02-27 | 2006-07-27 | Kyocera Corp | セラミック回路基板 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5047952A (en) * | 1988-10-14 | 1991-09-10 | The Board Of Trustee Of The Leland Stanford Junior University | Communication system for deaf, deaf-blind, or non-vocal individuals using instrumented glove |
US5188983A (en) * | 1990-04-11 | 1993-02-23 | Wisconsin Alumni Research Foundation | Polysilicon resonating beam transducers and method of producing the same |
US5090254A (en) * | 1990-04-11 | 1992-02-25 | Wisconsin Alumni Research Foundation | Polysilicon resonating beam transducers |
JPH0526607A (ja) | 1991-07-19 | 1993-02-02 | Mitsubishi Electric Corp | ひずみゲージ |
DE4404716A1 (de) * | 1994-02-15 | 1995-08-17 | Hottinger Messtechnik Baldwin | Dehnungsmeßstreifen und Verfahren zur Herstellung eines Dehnungsmeßstreifens sowie Meßgrößenaufnehmer |
JP3040684U (ja) | 1997-02-18 | 1997-08-26 | 株式会社共和電業 | ひずみゲージ |
US6484567B1 (en) * | 2000-08-03 | 2002-11-26 | Symyx Technologies, Inc. | Rheometer for rapidly measuring small quantity samples |
-
2008
- 2008-06-10 JP JP2008151626A patent/JP5202116B2/ja active Active
-
2009
- 2009-05-27 US US12/454,967 patent/US7937822B2/en not_active Expired - Fee Related
- 2009-06-05 CN CN2009101473016A patent/CN101603806B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5619705U (ja) * | 1979-07-25 | 1981-02-21 | ||
JPH03242903A (ja) * | 1990-02-21 | 1991-10-29 | Tdk Corp | サーミスタ |
JPH03251704A (ja) * | 1990-02-28 | 1991-11-11 | Showa Sokki:Kk | ストレインゲージの製造方法 |
JP2000133419A (ja) * | 1998-10-29 | 2000-05-12 | Kyocera Corp | セラミックヒータ |
JP2003023244A (ja) * | 2001-07-06 | 2003-01-24 | Taiyo Yuden Co Ltd | 回路基板 |
JP2006023212A (ja) * | 2004-07-08 | 2006-01-26 | Kyowa Electron Instr Co Ltd | ひずみ測定装置およびひずみゲージ判別方法 |
JP2006196916A (ja) * | 2006-02-27 | 2006-07-27 | Kyocera Corp | セラミック回路基板 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016078037A (ja) * | 2014-10-10 | 2016-05-16 | ミネベア株式会社 | フレキシブルプリント基板とひずみゲージの接合構造 |
JP2017096900A (ja) * | 2015-11-28 | 2017-06-01 | 株式会社共和電業 | ひずみゲージ |
Also Published As
Publication number | Publication date |
---|---|
JP5202116B2 (ja) | 2013-06-05 |
US20090300913A1 (en) | 2009-12-10 |
CN101603806B (zh) | 2013-02-27 |
US7937822B2 (en) | 2011-05-10 |
CN101603806A (zh) | 2009-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5926495B2 (ja) | シャント抵抗式電流センサ | |
JP3883528B2 (ja) | 電子部品 | |
JP5619663B2 (ja) | シャント抵抗器の接続端子、及びバッテリー状態検知装置 | |
JP6064254B2 (ja) | 電流検出用抵抗器 | |
JP6384211B2 (ja) | シャント抵抗器 | |
JP5202116B2 (ja) | タブパターンとリードの接合方法 | |
JP4897964B2 (ja) | 電流検出装置 | |
JP2008032400A (ja) | Icソケットのコンタクトピン | |
JP4403428B2 (ja) | プリント配線板 | |
EP3780918A1 (en) | Fpc connection structure and method for connecting to printed circuit board by using same | |
WO2011077228A1 (ja) | オス型コネクタブロック及びメス型コネクタブロック及びコネクタ | |
JP5805102B2 (ja) | 接続端子 | |
JP4391918B2 (ja) | 電流検出用抵抗器 | |
CN104078194A (zh) | 具有一体化电流感测元件的磁性装置及其组装方法 | |
JP4086390B2 (ja) | 電子部品用接触子 | |
EP3035019B1 (en) | Stator slot temperature sensor and assemblying method of the same | |
JPWO2006022257A1 (ja) | セラミック電子部品 | |
JP2006024825A (ja) | 電気部品 | |
JP5903049B2 (ja) | 接続端子 | |
JP6126060B2 (ja) | フレキシブルプリント基板とひずみゲージの接合構造 | |
KR20000029040A (ko) | 이종금속접합 프로브, 그 제조방법 및 이종금속접합프로브를 이용한 프로브카드 | |
CN104869755B (zh) | 印制电路板 | |
JP4887748B2 (ja) | 抵抗器 | |
JP2005197394A (ja) | 金属抵抗器 | |
JP5143353B2 (ja) | 抵抗器の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110309 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120531 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120606 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120803 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130206 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130212 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5202116 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160222 Year of fee payment: 3 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |