CN101603806B - 用于连接接片图案与引线的方法 - Google Patents

用于连接接片图案与引线的方法 Download PDF

Info

Publication number
CN101603806B
CN101603806B CN2009101473016A CN200910147301A CN101603806B CN 101603806 B CN101603806 B CN 101603806B CN 2009101473016 A CN2009101473016 A CN 2009101473016A CN 200910147301 A CN200910147301 A CN 200910147301A CN 101603806 B CN101603806 B CN 101603806B
Authority
CN
China
Prior art keywords
main part
contact pin
wire
connecting portion
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN2009101473016A
Other languages
English (en)
Chinese (zh)
Other versions
CN101603806A (zh
Inventor
美齐津英司
平本真事
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Minebea Co Ltd
Original Assignee
Minebea Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minebea Co Ltd filed Critical Minebea Co Ltd
Publication of CN101603806A publication Critical patent/CN101603806A/zh
Application granted granted Critical
Publication of CN101603806B publication Critical patent/CN101603806B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49007—Indicating transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
CN2009101473016A 2008-06-10 2009-06-05 用于连接接片图案与引线的方法 Active CN101603806B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008151626 2008-06-10
JP2008151626A JP5202116B2 (ja) 2008-06-10 2008-06-10 タブパターンとリードの接合方法
JP2008-151626 2008-06-10

Publications (2)

Publication Number Publication Date
CN101603806A CN101603806A (zh) 2009-12-16
CN101603806B true CN101603806B (zh) 2013-02-27

Family

ID=41398990

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009101473016A Active CN101603806B (zh) 2008-06-10 2009-06-05 用于连接接片图案与引线的方法

Country Status (3)

Country Link
US (1) US7937822B2 (ja)
JP (1) JP5202116B2 (ja)
CN (1) CN101603806B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101657952B1 (ko) * 2010-11-15 2016-09-20 주식회사 고영테크놀러지 기판 검사방법
JP6126060B2 (ja) * 2014-10-10 2017-05-10 ミネベアミツミ株式会社 フレキシブルプリント基板とひずみゲージの接合構造
CN105445126A (zh) * 2015-11-18 2016-03-30 四川华西九方电缆有限公司 电缆的抗疲劳强度性能测试方法
JP6661348B2 (ja) * 2015-11-28 2020-03-11 株式会社共和電業 ひずみゲージ
JP2017150931A (ja) * 2016-02-24 2017-08-31 株式会社タニタ ひずみゲージ

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5619705U (ja) * 1979-07-25 1981-02-21
US5047952A (en) * 1988-10-14 1991-09-10 The Board Of Trustee Of The Leland Stanford Junior University Communication system for deaf, deaf-blind, or non-vocal individuals using instrumented glove
JPH03242903A (ja) * 1990-02-21 1991-10-29 Tdk Corp サーミスタ
JPH03251704A (ja) * 1990-02-28 1991-11-11 Showa Sokki:Kk ストレインゲージの製造方法
US5188983A (en) * 1990-04-11 1993-02-23 Wisconsin Alumni Research Foundation Polysilicon resonating beam transducers and method of producing the same
US5090254A (en) * 1990-04-11 1992-02-25 Wisconsin Alumni Research Foundation Polysilicon resonating beam transducers
JPH0526607A (ja) 1991-07-19 1993-02-02 Mitsubishi Electric Corp ひずみゲージ
DE4404716A1 (de) * 1994-02-15 1995-08-17 Hottinger Messtechnik Baldwin Dehnungsmeßstreifen und Verfahren zur Herstellung eines Dehnungsmeßstreifens sowie Meßgrößenaufnehmer
JP3040684U (ja) 1997-02-18 1997-08-26 株式会社共和電業 ひずみゲージ
JP2000133419A (ja) * 1998-10-29 2000-05-12 Kyocera Corp セラミックヒータ
US6484567B1 (en) * 2000-08-03 2002-11-26 Symyx Technologies, Inc. Rheometer for rapidly measuring small quantity samples
JP2003023244A (ja) * 2001-07-06 2003-01-24 Taiyo Yuden Co Ltd 回路基板
JP4464217B2 (ja) * 2004-07-08 2010-05-19 株式会社共和電業 ひずみ測定装置およびひずみゲージ判別方法
JP2006196916A (ja) * 2006-02-27 2006-07-27 Kyocera Corp セラミック回路基板

Also Published As

Publication number Publication date
JP2009302117A (ja) 2009-12-24
JP5202116B2 (ja) 2013-06-05
US20090300913A1 (en) 2009-12-10
US7937822B2 (en) 2011-05-10
CN101603806A (zh) 2009-12-16

Similar Documents

Publication Publication Date Title
CN101603806B (zh) 用于连接接片图案与引线的方法
JP6174172B2 (ja) コンタクトプローブ
US8963679B2 (en) Connection terminal of shunt resistor, and battery state detection device
JP5926495B2 (ja) シャント抵抗式電流センサ
US8471578B2 (en) Probe and method of manufacturing probe
US8859909B2 (en) Flexible cable for low profile electrical device
TWI375039B (ja)
JP5394309B2 (ja) プローブ及びプローブの製造方法
JP4252491B2 (ja) 検査機能付きモジュール及びその検査方法。
JP6064254B2 (ja) 電流検出用抵抗器
JP2008180716A (ja) プローブ及びこれを持つプローブカード
JP4897964B2 (ja) 電流検出装置
JP2008309786A (ja) プローブ及びプローブ組立体、並びにこれを有するプローブカード
CN103221330A (zh) 包括优选为多层的陶瓷基板的传感器及其制造方法
US20210181048A1 (en) Linear force sensor and method of use
EP3358326B1 (en) Dynamic quantity measuring apparatus
JP2014016298A (ja) シャント抵抗式電流センサ
CN117470421A (zh) 一种全桥式半导体应变片及其制作方法
CN101191801B (zh) 探针卡
KR101602218B1 (ko) 고정자 슬롯 온도센서 및 그 제조 방법
KR100448528B1 (ko) 반도체장치의 검사장치 및 그를 이용한 반도체제조방법
KR20150047546A (ko) 분로 저항형 전류 센서
JP2005106800A5 (ja)
JP2009222680A (ja) プローブカード及びプローブカードの製造方法
JP4964743B2 (ja) フレキシブル配線材用コネクタ装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant