JP2009283739A - 配線基板および配線基板の製造方法 - Google Patents

配線基板および配線基板の製造方法 Download PDF

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Publication number
JP2009283739A
JP2009283739A JP2008135031A JP2008135031A JP2009283739A JP 2009283739 A JP2009283739 A JP 2009283739A JP 2008135031 A JP2008135031 A JP 2008135031A JP 2008135031 A JP2008135031 A JP 2008135031A JP 2009283739 A JP2009283739 A JP 2009283739A
Authority
JP
Japan
Prior art keywords
layer
wiring
plating
hole
wiring layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008135031A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009283739A5 (enExample
Inventor
Akio Horiuchi
章夫 堀内
Kazuhiro Oshima
一宏 大島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2008135031A priority Critical patent/JP2009283739A/ja
Priority to US12/470,083 priority patent/US20090288873A1/en
Publication of JP2009283739A publication Critical patent/JP2009283739A/ja
Publication of JP2009283739A5 publication Critical patent/JP2009283739A5/ja
Priority to US13/195,936 priority patent/US20110283535A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09454—Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2008135031A 2008-05-23 2008-05-23 配線基板および配線基板の製造方法 Pending JP2009283739A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008135031A JP2009283739A (ja) 2008-05-23 2008-05-23 配線基板および配線基板の製造方法
US12/470,083 US20090288873A1 (en) 2008-05-23 2009-05-21 Wiring board and method of manufacturing the same
US13/195,936 US20110283535A1 (en) 2008-05-23 2011-08-02 Wiring board and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008135031A JP2009283739A (ja) 2008-05-23 2008-05-23 配線基板および配線基板の製造方法

Publications (2)

Publication Number Publication Date
JP2009283739A true JP2009283739A (ja) 2009-12-03
JP2009283739A5 JP2009283739A5 (enExample) 2011-03-31

Family

ID=41341255

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008135031A Pending JP2009283739A (ja) 2008-05-23 2008-05-23 配線基板および配線基板の製造方法

Country Status (2)

Country Link
US (2) US20090288873A1 (enExample)
JP (1) JP2009283739A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011091308A (ja) * 2009-10-26 2011-05-06 Denso Corp 配線基板
JP2013211502A (ja) * 2012-03-30 2013-10-10 Shinko Seisakusho:Kk フィルドメッキを有する配線基板とその製造方法
JP2014072325A (ja) * 2012-09-28 2014-04-21 Hitachi Chemical Co Ltd 多層配線基板及びその製造方法
CN103841753A (zh) * 2012-11-20 2014-06-04 三星电机株式会社 印刷电路板及其制造方法
JP2024042010A (ja) * 2018-03-28 2024-03-27 大日本印刷株式会社 配線基板

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8104171B2 (en) * 2008-08-27 2012-01-31 Advanced Semiconductor Engineering, Inc. Method of fabricating multi-layered substrate
TW201110839A (en) * 2009-09-04 2011-03-16 Advanced Semiconductor Eng Substrate structure and method for manufacturing the same
KR101097628B1 (ko) * 2010-06-21 2011-12-22 삼성전기주식회사 인쇄회로기판 및 이의 제조방법
KR20150033979A (ko) * 2013-09-25 2015-04-02 삼성전기주식회사 인터포저 기판 및 인터포저 기판 제조 방법
US20170013715A1 (en) 2015-07-10 2017-01-12 Rohde & Schwarz Gmbh & Co. Kg Printed circuit board and corresponding method for producing a printed circuit board
JP6819268B2 (ja) * 2016-12-15 2021-01-27 凸版印刷株式会社 配線基板、多層配線基板、及び配線基板の製造方法
CN109429422A (zh) * 2017-08-29 2019-03-05 上达电子（深圳）股份有限公司 电路板及其制备方法
JP7089453B2 (ja) * 2018-10-10 2022-06-22 新光電気工業株式会社 配線基板及びその製造方法
CN119208287A (zh) * 2024-08-27 2024-12-27 中国科学院微电子研究所 一种基板结构的制作方法和基板结构
CN120184130A (zh) * 2025-02-08 2025-06-20 芯爱科技(南京)有限公司 封装基板及其制法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06275959A (ja) * 1993-03-22 1994-09-30 Hitachi Ltd 多層配線基板とその製造方法および両面プリント配線板の製造方法
JP2004349672A (ja) * 2002-07-10 2004-12-09 Ngk Spark Plug Co Ltd 充填材及びそれを用いた多層配線基板並びに多層配線基板の製造方法

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EP0957664B1 (en) * 1996-06-07 2003-07-09 Asahi Kasei Kabushiki Kaisha Resin-carrying metal foil for multilayered wiring board, process for manufacturing the same, multilayered wiring board, and electronic device
KR100855529B1 (ko) * 1998-09-03 2008-09-01 이비덴 가부시키가이샤 다층프린트배선판 및 그 제조방법
JP2000101245A (ja) * 1998-09-24 2000-04-07 Ngk Spark Plug Co Ltd 積層樹脂配線基板及びその製造方法
MY139405A (en) * 1998-09-28 2009-09-30 Ibiden Co Ltd Printed circuit board and method for its production
WO2001011932A1 (en) * 1999-08-06 2001-02-15 Ibiden Co., Ltd. Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board
JP2002094200A (ja) * 2000-09-18 2002-03-29 Matsushita Electric Ind Co Ltd 回路基板用電気絶縁材と回路基板およびその製造方法
KR20080094967A (ko) * 2002-03-05 2008-10-27 히다치 가세고교 가부시끼가이샤 수지 부착 금속박, 금속 피복 적층판, 그를 이용한 프린트 배선판 및 그의 제조 방법
WO2005032227A1 (ja) * 2003-09-29 2005-04-07 Ibiden Co., Ltd. プリント配線板用層間絶縁層、プリント配線板およびその製造方法
JP2006229115A (ja) * 2005-02-21 2006-08-31 North:Kk 配線基板製造用金属部材と、それを用いた配線基板の製造方法
JP2006278774A (ja) * 2005-03-29 2006-10-12 Hitachi Cable Ltd 両面配線基板の製造方法、両面配線基板、およびそのベース基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06275959A (ja) * 1993-03-22 1994-09-30 Hitachi Ltd 多層配線基板とその製造方法および両面プリント配線板の製造方法
JP2004349672A (ja) * 2002-07-10 2004-12-09 Ngk Spark Plug Co Ltd 充填材及びそれを用いた多層配線基板並びに多層配線基板の製造方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011091308A (ja) * 2009-10-26 2011-05-06 Denso Corp 配線基板
JP2013211502A (ja) * 2012-03-30 2013-10-10 Shinko Seisakusho:Kk フィルドメッキを有する配線基板とその製造方法
JP2014072325A (ja) * 2012-09-28 2014-04-21 Hitachi Chemical Co Ltd 多層配線基板及びその製造方法
CN103841753A (zh) * 2012-11-20 2014-06-04 三星电机株式会社 印刷电路板及其制造方法
JP2014103383A (ja) * 2012-11-20 2014-06-05 Samsung Electro-Mechanics Co Ltd 印刷回路基板及びその製造方法
JP2024042010A (ja) * 2018-03-28 2024-03-27 大日本印刷株式会社 配線基板
JP7666668B2 (ja) 2018-03-28 2025-04-22 大日本印刷株式会社 配線基板

Also Published As

Publication number Publication date
US20110283535A1 (en) 2011-11-24
US20090288873A1 (en) 2009-11-26

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