JP2009260166A5 - - Google Patents

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Publication number
JP2009260166A5
JP2009260166A5 JP2008109998A JP2008109998A JP2009260166A5 JP 2009260166 A5 JP2009260166 A5 JP 2009260166A5 JP 2008109998 A JP2008109998 A JP 2008109998A JP 2008109998 A JP2008109998 A JP 2008109998A JP 2009260166 A5 JP2009260166 A5 JP 2009260166A5
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JP
Japan
Prior art keywords
thin film
film
insulating
layer
hole
Prior art date
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Application number
JP2008109998A
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English (en)
Japanese (ja)
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JP2009260166A (ja
JP5309672B2 (ja
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Priority to JP2008109998A priority Critical patent/JP5309672B2/ja
Priority claimed from JP2008109998A external-priority patent/JP5309672B2/ja
Publication of JP2009260166A publication Critical patent/JP2009260166A/ja
Publication of JP2009260166A5 publication Critical patent/JP2009260166A5/ja
Application granted granted Critical
Publication of JP5309672B2 publication Critical patent/JP5309672B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008109998A 2008-04-21 2008-04-21 薄膜素子およびその製造方法 Expired - Fee Related JP5309672B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008109998A JP5309672B2 (ja) 2008-04-21 2008-04-21 薄膜素子およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008109998A JP5309672B2 (ja) 2008-04-21 2008-04-21 薄膜素子およびその製造方法

Publications (3)

Publication Number Publication Date
JP2009260166A JP2009260166A (ja) 2009-11-05
JP2009260166A5 true JP2009260166A5 (enExample) 2011-01-06
JP5309672B2 JP5309672B2 (ja) 2013-10-09

Family

ID=41387194

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008109998A Expired - Fee Related JP5309672B2 (ja) 2008-04-21 2008-04-21 薄膜素子およびその製造方法

Country Status (1)

Country Link
JP (1) JP5309672B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5483151B2 (ja) * 2009-03-05 2014-05-07 カシオ計算機株式会社 薄膜素子およびその製造方法
KR101695296B1 (ko) * 2012-12-27 2017-01-13 엘지디스플레이 주식회사 박막트랜지스터 어레이 기판 및 그의 제조방법
KR102340066B1 (ko) * 2016-04-07 2021-12-15 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박리 방법 및 플렉시블 디바이스의 제작 방법
KR102318625B1 (ko) * 2016-04-12 2021-10-27 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박리 방법 및 플렉시블 디바이스의 제작 방법
KR102378976B1 (ko) * 2016-05-18 2022-03-24 가부시키가이샤 한도오따이 에네루기 켄큐쇼 박리 방법, 표시 장치, 모듈, 및 전자 기기
TWI730017B (zh) * 2016-08-09 2021-06-11 日商半導體能源研究所股份有限公司 顯示裝置的製造方法、顯示裝置、顯示模組及電子裝置
JP7143210B2 (ja) 2016-10-07 2022-09-28 株式会社半導体エネルギー研究所 半導体装置の作製方法
CN111129036B (zh) * 2019-12-25 2022-07-26 Tcl华星光电技术有限公司 阵列基板及其制备方法、显示面板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3738799B2 (ja) * 1996-11-22 2006-01-25 セイコーエプソン株式会社 アクティブマトリクス基板の製造方法，アクティブマトリクス基板および液晶表示装置
JP2004349513A (ja) * 2003-05-22 2004-12-09 Seiko Epson Corp 薄膜回路装置及びその製造方法、並びに電気光学装置、電子機器

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