JP2009250972A - 半導体ウエーハ汚染物質測定装置のスキャンステージ - Google Patents
半導体ウエーハ汚染物質測定装置のスキャンステージ Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 57
- 239000000356 contaminant Substances 0.000 title claims description 53
- 239000003344 environmental pollutant Substances 0.000 claims description 14
- 231100000719 pollutant Toxicity 0.000 claims description 14
- 238000005259 measurement Methods 0.000 claims description 9
- 230000037361 pathway Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 160
- 238000000034 method Methods 0.000 description 13
- 238000000354 decomposition reaction Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 238000004458 analytical method Methods 0.000 description 6
- 238000011109 contamination Methods 0.000 description 6
- 239000012808 vapor phase Substances 0.000 description 6
- 230000001174 ascending effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000001479 atomic absorption spectroscopy Methods 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 230000001066 destructive effect Effects 0.000 description 2
- 239000007888 film coating Substances 0.000 description 2
- 238000009501 film coating Methods 0.000 description 2
- 238000004949 mass spectrometry Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000000624 total reflection X-ray fluorescence spectroscopy Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000012636 effector Substances 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/2813—Producing thin layers of samples on a substrate, e.g. smearing, spinning-on
- G01N2001/2826—Collecting by adsorption or absorption
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
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Abstract
【解決手段】本発明は、円形の固定ハウジング11と、該固定ハウジング11の内側で回転可能に設置されてその中心部で吸着通路13を形成すると共に底部の真空ポート16と連結され、外側の回転力によって回転する吸着プレート14と、該吸着プレート14を駆動する前記固定ハウジング11の底部に設置され、前記吸着プレート14に接続されるステップモーター17から成るステージ本体10;該ステージ本体10の固定ハウジング11の下部空間を形成する柱22で支えられるベースプレート20;該ベースプレート20が上、下移動するその底部でシリンダーロッドに連結されるシリンダー24;前記ステージ本体10の外側でウエーハを支える各ジグ30を含む。
【選択図】図2
Description
本発明はこのようなスキャンステージを提供すると共に、その下部のベースプレートを上、下動可能にしてウエーハがローディングする時に下部から引き上げられることを容易にするスキャンステージを提供することを目的とする。
本発明は半導体ウエーハ汚染物質測定装置のスキャンステージのウエーハ吸着プレートが回転する構造を提供することを目的とする。
本発明は半導体ウエーハ汚染物質測定装置のスキャンステージの外郭側でウエーハをローディングする時に分離が容易になるように独立的な各ジグを備えたスキャンステージを提供することを目的とする。
本発明による半導体ウエーハ汚染物質測定装置のスキャンステージは吸着プレート構造を改善して固定ハウジングの内側で回転可能にすると共に、回転体の上面でウエーハが真空吸着される吸着口を形成し、真空ラインと真空ポートとしてスキャンステージ上にウエーハが吸着維持されることを目的とする。
本発明は回転体と固定ハウジングとに二元化してステップモーターを固定ハウジングに設置し、回転体の段階別の回転が精密に行われるようにすることにもその目的がある。
本発明はジグが12インチと8インチウエーハとを兼ねてチャッキング可能にすることを目的とする。
前記した目的を達成するために、本発明による半導体ウエーハ汚染物質測定装置のスキャンステージの前記各ジグはウエーハの有無を検出するセンサーをさらに備えることが好ましい。
前記した目的を達成するために、本発明による半導体ウエーハ汚染物質測定装置のスキャンステージのハウジングは回転プレートの回転有無を検出するセンサーをさらに備えることが好ましい。
本発明はこのようなスキャンステージを提供すると共に、その下部のベースプレートを上、下動可能にしてウエーハをローディングする時に下部から引き上げられることが容易であるという効果がある。
本発明は半導体ウエーハ汚染物質測定装置のスキャンステージのウエーハ吸着プレートが、固定手段から回転手段が分離されて回転する新しいタイプのスキャンステージを提供し得るという効果がある。
本発明による半導体ウエーハ汚染物質測定装置のスキャンステージは前記目的を達成すると共に、ウエーハの搭載有無を検出するか、または回転体の回転有無を検出する手段を提供し得るという効果がある。
本発明による半導体ウエーハ汚染物質測定装置のスキャンステージは回転体と固定ハウジングとに二元化してステップモーターを固定ハウジングに設置して回転体の段階別の回転が精密に行われるという効果がある。
本発明による半導体ウエーハ汚染物質測定装置のスキャンステージのジグは12インチと8インチウエーハとを兼ねてチャックキング可能にした効果がある。
11 固定ハウジング
12 回転体
13 吸着通路
14 吸着プレート
16 真空ポート
17 ステップモーター
20 ベースプレート
22 柱
24 シリンダー
30 ジグ
Claims (6)
- 半導体ウエーハ汚染物質測定装置のスキャンステージにおいて、
円形の固定ハウジングと、該固定ハウジングの内側において回転可能に設置されてその中心部で吸着通路を形成すると共に底部の真空ポートと連結され、外側の回転力によって回転する吸着プレートと、該吸着プレートを駆動するために前記固定ハウジングの底部に設置され、前記吸着プレートに接続されるステップモーターから成るステージ本体;
該ステージ本体の固定ハウジングの下部空間を形成するように柱で支えられるベースプレート;
該ベースプレートが上、下移動するようにその底部でシリンダーロッドに連結されるシリンダー;および
前記ステージ本体の外側でウエーハを支える各ジグを含むことを特徴とする半導体ウエーハ汚染物質測定装置のスキャンステージ。 - 前記吸着プレートはその外側にステップモーターで駆動される回転体をさらに備えることを特徴とする請求項1に記載の半導体ウエーハ汚染物質測定装置のスキャンステージ。
- 前記ジグは12インチウエーハと8インチウエーハとを兼ねて支えるように第1突条部と第2突条部から成ることを特徴とする請求項1または2に記載の半導体ウエーハ汚染物質測定装置のスキャンステージ。
- 前記各ジグはウエーハの搭載有無を検出するセンサーをさらに備えることを特徴とする請求項3に記載の半導体ウエーハ汚染物質測定装置のスキャンステージ。
- 前記固定ハウジングは回転体の回転有無を検出するセンサーをさらに備えることを特徴とする請求項1に記載の半導体ウエーハ汚染物質測定装置のスキャンステージ。
- 前記吸着プレートは、
固定ハウジングの内側で回転可能に設置され、該吸着プレートの上面に吸着口を形成すると共に内部で真空ラインを成し、底部の真空ポートと連通されることを特徴とする請求項1に記載の半導体ウエーハ汚染物質測定装置のスキャンステージ。
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KR1020080031130A KR100970243B1 (ko) | 2008-04-03 | 2008-04-03 | 반도체 웨이퍼 오염물질 측정장치의 스캔 스테이지 |
KR10-2008-0031130 | 2008-04-03 |
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JP2009250972A true JP2009250972A (ja) | 2009-10-29 |
JP4971283B2 JP4971283B2 (ja) | 2012-07-11 |
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KR100970243B1 (ko) * | 2008-04-03 | 2010-07-16 | 코리아테크노(주) | 반도체 웨이퍼 오염물질 측정장치의 스캔 스테이지 |
US20130291365A1 (en) * | 2012-05-03 | 2013-11-07 | Fluke Corporation | Accessory mounting system |
CN104377156A (zh) * | 2014-09-26 | 2015-02-25 | 南通富士通微电子股份有限公司 | 一种固定装置 |
KR101653987B1 (ko) * | 2015-04-10 | 2016-09-05 | 엔비스아나(주) | 기판 오염물 분석 장치 및 기판 오염물 분석 방법 |
KR102295704B1 (ko) * | 2016-02-26 | 2021-08-30 | 엔비스아나(주) | 기판 오염물 분석 장치 및 기판 오염물 분석 방법 |
CN106002682B (zh) * | 2016-06-03 | 2017-07-14 | 广东工业大学 | 一种五金件通用夹具 |
CN105973672A (zh) * | 2016-06-30 | 2016-09-28 | 湖南万通科技股份有限公司 | 一种物料缩分设备 |
US11049741B2 (en) | 2017-12-01 | 2021-06-29 | Elemental Scientific, Inc. | Systems for integrated decomposition and scanning of a semiconducting wafer |
KR102267278B1 (ko) * | 2020-10-08 | 2021-06-21 | 주식회사 위드텍 | 운송 인클로저 내부 오염도 측정 및 운송 인클로저에 포함된 웨이퍼의 표면오염 동시 측정 시스템. |
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- 2008-10-10 JP JP2008264113A patent/JP4971283B2/ja active Active
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JP4971283B2 (ja) | 2012-07-11 |
KR20090105586A (ko) | 2009-10-07 |
US7975996B2 (en) | 2011-07-12 |
KR100970243B1 (ko) | 2010-07-16 |
US20090250569A1 (en) | 2009-10-08 |
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