CN104377156A - 一种固定装置 - Google Patents
一种固定装置 Download PDFInfo
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- CN104377156A CN104377156A CN201410504502.8A CN201410504502A CN104377156A CN 104377156 A CN104377156 A CN 104377156A CN 201410504502 A CN201410504502 A CN 201410504502A CN 104377156 A CN104377156 A CN 104377156A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
本发明提供一种固定装置,用于固定基板或引线框架,包括底座,以及向放置在底座上的基板或引线框架提供下压力的压板,底座具有用于使基板或引线框架与底座均匀、紧密接合的真空结构。
Description
技术领域
本发明涉及一种固定装置,尤其涉及一种半导体封装固定装置,更确切的说是涉及一种半导体封装过程中固定产品的真空固定装置。
背景技术
半导体封装过程中,需要用到引线框架固定装置,引线框架放置在固定装置上,通过上方增加压板来固定,用以纠正引线框架在受热过程中出现翘曲。如图1所示,传统的固定装置结构较为简单,仅包含底座1及压板2,利用磁性吸着作用使引线框架5,与底座相对固定以达到纠正引线框架翘曲的目的。但实际作业过程中,引线框架的产品部分是露出来的,被固定的只是产品的四周,当翘曲量偏大时,如图2所示,仅依靠四周压着固定是无法使引线框架与固定装置的底座表面紧密贴合的,从而造成引线框架在产品部分翘曲,达不到纠正引线框架翘曲的目的,无法从根本上解决由引线框架与芯片之间的膨胀差异而导致的焊接不良问题。
发明内容
在下文中给出关于本发明的简要概述,以便提供关于本发明的某些方面的基本理解。应当理解,这个概述并不是关于本发明的穷举性概述。它并不是意图确定本发明的关键或重要部分,也不是意图限定本发明的范围。其目的仅仅是以简化的形式给出某些概念,以此作为稍后论述的更详细描述的前序。
本发明提供一种固定装置,用于固定基板或引线框架,包括底座,以及向放置在底座上的基板或引线框架提供向下压力的压板,底座具有用于使基板或引线框架与底座均匀、紧密接合的真空结构。
采用本发明的固定装置,增加了真空吸附力,从而可以将整个基板或引线框架吸附固定,避免产品中间翘曲拱起,从根本上解决基板或引线框架与芯片之间膨胀差异导致的焊接不良问题。
附图说明
参照下面结合附图对本发明实施例的说明,会更加容易地理解本发明的以上和其它目的、特点和优点。附图中的部件只是为了示出本发明的原理。在附图中,相同的或类似的技术特征或部件将采用相同或类似的附图标记来表示。
图1是现有固定装置结构示意图;
图2是现有固定装置上出现引线框架翘曲拱起现象的示意图;
图3是本发明实施例一提供的固定装置的结构示意图;
图4是本发明实施例一提供的固定装置工作状态示意图。
具体实施方式
下面参照附图来说明本发明的实施例。在本发明的一个附图或一种实施方式中描述的元素和特征可以与一个或更多个其它附图或实施方式中示出的元素和特征相结合。应当注意,为了清楚的目的,附图和说明中省略了与本发明无关的、本领域普通技术人员已知的部件和处理的表示和描述。
图3为本发明实施例一提供的固定装置的结构示意图,图4是本发明实施例一提供的固定装置工作状态示意图。
结合图3、图4所示,本实施例提供一种固定装置,用于固定基板或引线框架5,包括底座1,以及向放置在底座上的基板或引线框架5提供下压力的压板2,底座1具有用于使基板或引线框架5与底座1均匀、紧密接合的真空结构4。
真空结构4使基板或引线框架5与底座1均匀、紧密接合,有效防止了基板或引线框架5的翘曲。
进一步的,上述实施例中的真空结构4包括多个第一通道,第一通道的一端与底座上表面连通,底座1与基板或引线框架5接触的一面为底座上表面;真空结构还包括第二通道,第一通道的远离上表面的另一端与第二通道的连通;固定装置还包括固定在底座上的真空电机3,第二通道的与真空电机3连通;真空电机3用于抽吸由基板或引线框架5与第一通道、第二通道形成的空间中的空气。
多个第一通道与第二通道相连通,在底座上表面与真空电机3之间形成了有空气存在的空间,当真空电机3开启时,空间中的空气被真空电机3抽吸,进而对底座上表面的基板或引线框架5形成了真空压力,基板或引线框架5由于真空压力的作用会与底座1均匀、紧密的贴合。
进一步的,上述实施例中多条第一通道平行设置。
第一通道平行设置会有利于空气从第一通道被抽吸到第二通道之中,进而被真空电机3抽走,有利于制造真空压力。
进一步的,上述实施例中任意相邻的两条第一通道之间的间距相等。
将任意相邻的两条第一通道之间的间距设置为相等,可以使基板或引线框架5受到均等的真空压力,有效保证了其与底座1贴合的均匀、紧密。
进一步的,上述实施例中压板2与底座上表面分别对应设置有多个极性相反的磁吸结构。
压板2与底座上表面分别对应设置有多个极性相反的磁吸结构,在压板2与底座上表面之间形成相互吸引的磁力作用,相互吸引的磁力作用在基板或引线框架5上,使基板或引线框架5与底座1、压板2贴合的更紧密,在真空压力的作用之外,又提供了磁力吸引的作用,使基板或引线框架5底座1贴合的均匀、紧密。
采用本发明的固定装置,由于增加了真空吸附力,从而可以将整个基板或引线框架吸附固定,避免产品中间翘曲拱起,从根本上解决基板或引线框架与芯片之间膨胀差异导致的焊接不良问题。
最后应说明的是:以上实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。
Claims (5)
1.一种固定装置,用于固定基板或引线框架,包括底座,以及向放置在所述底座上的所述基板或引线框架提供向下压力的压板,其特征在于,所述底座具有用于使所述基板或引线框架与所述底座均匀、紧密接合的真空结构。
2.根据权利要求1所述的固定装置,其特征在于:
所述真空结构包括多个第一通道,所述第一通道的一端与所述底座上表面连通,所述底座与所述基板或引线框架接触的一面为底座上表面;
所述真空结构还包括第二通道,所述第一通道的远离所述上表面的另一端与所述第二通道连通;所述固定装置还包括固定在所述底座上的真空电机,所述第二通道与所述真空电机连通;
所述真空电机用于抽吸由所述基板或引线框架与第一通道、第二通道形成的空间中的空气。
3.根据权利要求2所述的固定装置,其特征在于:
所述多条第一通道平行设置。
4.根据权利要求3所述的固定装置,其特征在于:
任意相邻的两条所述第一通道之间的间距相等。
5.根据权利要求1-4任一项所述的固定装置,其特征在于,所述压板与所述底座上表面分别对应设置有多个极性相反的磁吸结构。
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104977815A (zh) * | 2015-07-03 | 2015-10-14 | 苏州微影光电科技有限公司 | 直写式曝光系统中的扫描台 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101241874A (zh) * | 2008-02-21 | 2008-08-13 | 日月光半导体制造股份有限公司 | 封装设备及其基板载具 |
US20090250569A1 (en) * | 2008-04-03 | 2009-10-08 | Korea Techno Co., Ltd | Scan stage for semiconductor wafer pollutant measurement apparatus |
CN102593028A (zh) * | 2012-03-19 | 2012-07-18 | 南通富士通微电子股份有限公司 | 双面贴装器件的基板的固定装置 |
CN103372825A (zh) * | 2012-04-27 | 2013-10-30 | 三星钻石工业股份有限公司 | 基板吸附装置 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101241874A (zh) * | 2008-02-21 | 2008-08-13 | 日月光半导体制造股份有限公司 | 封装设备及其基板载具 |
US20090250569A1 (en) * | 2008-04-03 | 2009-10-08 | Korea Techno Co., Ltd | Scan stage for semiconductor wafer pollutant measurement apparatus |
CN102593028A (zh) * | 2012-03-19 | 2012-07-18 | 南通富士通微电子股份有限公司 | 双面贴装器件的基板的固定装置 |
CN103372825A (zh) * | 2012-04-27 | 2013-10-30 | 三星钻石工业股份有限公司 | 基板吸附装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104977815A (zh) * | 2015-07-03 | 2015-10-14 | 苏州微影光电科技有限公司 | 直写式曝光系统中的扫描台 |
CN104977815B (zh) * | 2015-07-03 | 2018-02-23 | 苏州微影激光技术有限公司 | 直写式曝光系统中的扫描台 |
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