JP2009242605A - 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 - Google Patents

粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 Download PDF

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JP2009242605A
JP2009242605A JP2008091250A JP2008091250A JP2009242605A JP 2009242605 A JP2009242605 A JP 2009242605A JP 2008091250 A JP2008091250 A JP 2008091250A JP 2008091250 A JP2008091250 A JP 2008091250A JP 2009242605 A JP2009242605 A JP 2009242605A
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group
adhesive
chip
adhesive layer
adhesive composition
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Japanese (ja)
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JP2009242605A5 (enExample
Inventor
Isao Ichikawa
功 市川
Naoya Saeki
尚哉 佐伯
Hironori Shizuhata
弘憲 賤機
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Lintec Corp
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Lintec Corp
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Priority to JP2008091250A priority Critical patent/JP2009242605A/ja
Priority to US12/415,509 priority patent/US20090246915A1/en
Publication of JP2009242605A publication Critical patent/JP2009242605A/ja
Publication of JP2009242605A5 publication Critical patent/JP2009242605A5/ja
Pending legal-status Critical Current

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    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
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    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
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    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
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    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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    • C09J2463/00—Presence of epoxy resin
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
    • H10W72/01336—Manufacture or treatment of die-attach connectors using blanket deposition in solid form, e.g. by using a powder or by laminating a foil
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
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    • H10W72/075—Connecting or disconnecting of bond wires
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    • H10W72/00—Interconnections or connectors in packages
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    • H10W72/321—Structures or relative sizes of die-attach connectors
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    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
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    • H10W72/531—Shapes of wire connectors
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    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
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    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
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    • H10W90/00—Package configurations
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    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Adhesive Tapes (AREA)
JP2008091250A 2008-03-31 2008-03-31 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 Pending JP2009242605A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008091250A JP2009242605A (ja) 2008-03-31 2008-03-31 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法
US12/415,509 US20090246915A1 (en) 2008-03-31 2009-03-31 Adhesive Composition, Adhesive Sheet and Production Method of Semiconductor Device

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JP2008091250A JP2009242605A (ja) 2008-03-31 2008-03-31 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法

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JP2009242605A5 JP2009242605A5 (enExample) 2011-03-24

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011180374A (ja) * 2010-03-01 2011-09-15 Hitachi Chem Co Ltd 感光性接着シート
US8609515B2 (en) 2010-12-29 2013-12-17 Cheil Industries, Inc. Dicing die bonding film, semiconductor wafer, and semiconductor device
JP2015218320A (ja) * 2014-05-21 2015-12-07 日立化成株式会社 研削された基材の製造方法、並びにこれに用いられるフィルム状粘着剤及び積層体
JP2023139659A (ja) * 2022-03-22 2023-10-04 リンテック株式会社 接着ペースト、接着ペーストの使用方法及び半導体装置の製造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6136268B2 (ja) * 2009-10-16 2017-05-31 エルジー・ケム・リミテッド ダイアタッチフィルム
JP5680330B2 (ja) * 2010-04-23 2015-03-04 株式会社東芝 半導体装置の製造方法
JP5757707B2 (ja) * 2010-08-26 2015-07-29 ヘンケルジャパン株式会社 湿気硬化型ホットメルト接着剤
KR20120068453A (ko) * 2010-12-17 2012-06-27 제일모직주식회사 다이싱 다이 본딩 필름
CN102898958B (zh) * 2011-07-25 2016-11-02 汉高股份有限公司 一种粘合剂组合物
JP5644896B2 (ja) 2012-07-04 2014-12-24 大日本印刷株式会社 粘接着層及び粘接着シート
JP5890795B2 (ja) * 2013-03-18 2016-03-22 日本碍子株式会社 半導体製造装置用部材
JP6488554B2 (ja) 2014-04-23 2019-03-27 大日本印刷株式会社 コンクリートの剥落防止工事の作業時間短縮化方法
CN106832226B (zh) * 2015-12-04 2019-06-14 广东生益科技股份有限公司 一种无卤环氧树脂组合物以及含有它的预浸料、层压板和印制电路板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000017246A (ja) * 1998-07-06 2000-01-18 Lintec Corp 粘接着剤組成物および粘接着シート
JP2006213872A (ja) * 2005-02-04 2006-08-17 Tomoegawa Paper Co Ltd 半導体装置用接着剤組成物および半導体装置用接着シート
JP2007091816A (ja) * 2005-09-27 2007-04-12 Fujifilm Corp 紫外線硬化型再剥離性圧着組成物及び再剥離性接着加工紙
JP2008056884A (ja) * 2006-08-04 2008-03-13 Hitachi Chem Co Ltd 印刷インキ組成物及び該組成物を用いたカラーフィルターの製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0715087B2 (ja) * 1988-07-21 1995-02-22 リンテック株式会社 粘接着テープおよびその使用方法
KR100262417B1 (ko) * 1992-06-04 2000-08-01 엔다 나오또 필름접착제 및 그의 제조 방법
WO2003102049A1 (en) * 2002-05-30 2003-12-11 Mitsui Chemicals, Inc. Adhesive resin and film adhesives made by using the same
JP4107417B2 (ja) * 2002-10-15 2008-06-25 日東電工株式会社 チップ状ワークの固定方法
CN100404613C (zh) * 2003-07-08 2008-07-23 株式会社钟化 固化性组合物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000017246A (ja) * 1998-07-06 2000-01-18 Lintec Corp 粘接着剤組成物および粘接着シート
JP2006213872A (ja) * 2005-02-04 2006-08-17 Tomoegawa Paper Co Ltd 半導体装置用接着剤組成物および半導体装置用接着シート
JP2007091816A (ja) * 2005-09-27 2007-04-12 Fujifilm Corp 紫外線硬化型再剥離性圧着組成物及び再剥離性接着加工紙
JP2008056884A (ja) * 2006-08-04 2008-03-13 Hitachi Chem Co Ltd 印刷インキ組成物及び該組成物を用いたカラーフィルターの製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011180374A (ja) * 2010-03-01 2011-09-15 Hitachi Chem Co Ltd 感光性接着シート
US8609515B2 (en) 2010-12-29 2013-12-17 Cheil Industries, Inc. Dicing die bonding film, semiconductor wafer, and semiconductor device
KR101351622B1 (ko) * 2010-12-29 2014-01-15 제일모직주식회사 다이싱 다이 본딩 필름
JP2015218320A (ja) * 2014-05-21 2015-12-07 日立化成株式会社 研削された基材の製造方法、並びにこれに用いられるフィルム状粘着剤及び積層体
JP2023139659A (ja) * 2022-03-22 2023-10-04 リンテック株式会社 接着ペースト、接着ペーストの使用方法及び半導体装置の製造方法

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