JP2009141106A - プリント配線基板、空気調和機、プリント配線基板の半田付け方法 - Google Patents

プリント配線基板、空気調和機、プリント配線基板の半田付け方法 Download PDF

Info

Publication number
JP2009141106A
JP2009141106A JP2007315713A JP2007315713A JP2009141106A JP 2009141106 A JP2009141106 A JP 2009141106A JP 2007315713 A JP2007315713 A JP 2007315713A JP 2007315713 A JP2007315713 A JP 2007315713A JP 2009141106 A JP2009141106 A JP 2009141106A
Authority
JP
Japan
Prior art keywords
soldering
printed wiring
wiring board
solder
land
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007315713A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009141106A5 (enExample
Inventor
Takeshi Miura
剛 三浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2007315713A priority Critical patent/JP2009141106A/ja
Priority to US12/219,530 priority patent/US20090145644A1/en
Priority to CN2010105207306A priority patent/CN101969742A/zh
Priority to CN2008101334790A priority patent/CN101453836B/zh
Publication of JP2009141106A publication Critical patent/JP2009141106A/ja
Publication of JP2009141106A5 publication Critical patent/JP2009141106A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2007315713A 2007-12-06 2007-12-06 プリント配線基板、空気調和機、プリント配線基板の半田付け方法 Pending JP2009141106A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007315713A JP2009141106A (ja) 2007-12-06 2007-12-06 プリント配線基板、空気調和機、プリント配線基板の半田付け方法
US12/219,530 US20090145644A1 (en) 2007-12-06 2008-07-23 Printed wiring board, air conditioner, and method of soldering printed wiring board
CN2010105207306A CN101969742A (zh) 2007-12-06 2008-07-25 印刷线路板、空调机、印刷线路板的钎焊方法
CN2008101334790A CN101453836B (zh) 2007-12-06 2008-07-25 印刷线路板、空调机、印刷线路板的钎焊方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007315713A JP2009141106A (ja) 2007-12-06 2007-12-06 プリント配線基板、空気調和機、プリント配線基板の半田付け方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009199661A Division JP2009283983A (ja) 2009-08-31 2009-08-31 プリント配線基板、空気調和機、プリント配線基板の半田付け方法

Publications (2)

Publication Number Publication Date
JP2009141106A true JP2009141106A (ja) 2009-06-25
JP2009141106A5 JP2009141106A5 (enExample) 2009-08-06

Family

ID=40720450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007315713A Pending JP2009141106A (ja) 2007-12-06 2007-12-06 プリント配線基板、空気調和機、プリント配線基板の半田付け方法

Country Status (3)

Country Link
US (1) US20090145644A1 (enExample)
JP (1) JP2009141106A (enExample)
CN (2) CN101453836B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6921244B2 (ja) * 2018-01-15 2021-08-18 本田技研工業株式会社 ブレーズ装置及び方法
WO2019211998A1 (ja) * 2018-05-01 2019-11-07 三菱電機株式会社 はんだ付けノズル、はんだ付け装置、はんだ付け方法およびプリント配線板の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5666272A (en) * 1994-11-29 1997-09-09 Sgs-Thomson Microelectronics, Inc. Detachable module/ball grid array package
US5679929A (en) * 1995-07-28 1997-10-21 Solectron Corporqtion Anti-bridging pads for printed circuit boards and interconnecting substrates
JPH10173329A (ja) 1996-12-10 1998-06-26 Matsushita Electric Works Ltd 噴流式半田付け装置
US5877033A (en) * 1997-03-10 1999-03-02 The Foxboro Company System for detection of unsoldered components
JP3633505B2 (ja) * 2001-04-27 2005-03-30 松下電器産業株式会社 プリント配線基板およびプリント配線基板の半田付け方法
CN100446650C (zh) * 2001-12-18 2008-12-24 爱立信股份有限公司 装配电子电路的设备和方法
JP2006313792A (ja) * 2005-05-06 2006-11-16 Sony Corp プリント配線基板
JP4207934B2 (ja) * 2005-08-09 2009-01-14 三菱電機株式会社 ４方向リードフラットパッケージｉｃ実装プリント配線基板、４方向リードフラットパッケージｉｃの半田付方法、空気調和機。
CN1852638B (zh) * 2006-01-24 2010-05-12 华为技术有限公司 一种印刷焊膏的方法及印锡钢网

Also Published As

Publication number Publication date
CN101453836B (zh) 2011-03-30
CN101453836A (zh) 2009-06-10
US20090145644A1 (en) 2009-06-11
CN101969742A (zh) 2011-02-09

Similar Documents

Publication Publication Date Title
US10843284B2 (en) Method for void reduction in solder joints
JP4207934B2 (ja) ４方向リードフラットパッケージｉｃ実装プリント配線基板、４方向リードフラットパッケージｉｃの半田付方法、空気調和機。
JP5496118B2 (ja) プリント配線基板、４方向リードフラットパッケージｉｃの半田付方法および空気調和機
JP3988720B2 (ja) ４方向リードフラットパッケージｉｃ実装プリント配線基板及び４方向リードフラットパッケージｉｃの半田付け方法、４方向リードフラットパッケージｉｃ実装プリント配線基板を備えた空気調和機。
JP2009141106A (ja) プリント配線基板、空気調和機、プリント配線基板の半田付け方法
JP2009283983A (ja) プリント配線基板、空気調和機、プリント配線基板の半田付け方法
JP5599151B2 (ja) 二列リード形電子部品実装プリント配線基板、二列リード形電子部品の半田付け方法、空気調和機
CN1929717B (zh) 导线型电子器件安装印刷电路基板、导线型电子器件的软钎焊方法、空气调节器
CN100475002C (zh) 印刷布线基板及锡焊方法以及装配有印刷布线基板的空调器
JP2009141106A5 (enExample)
CN110958786A (zh) 一种片上贴片的pcba侧面上锡焊接的方法
JP4952904B2 (ja) プリント配線基板とこれを備えたモータ制御装置
JP2003331960A (ja) 端子付き電子部品
JP4041991B2 (ja) プリント配線基板
JP5885162B2 (ja) プリント配線基板
JPH09181424A (ja) 電子部品、プリント配線板及びプリント配線板の製造方法
JP2006286899A (ja) プリント配線板の製造方法
JP4543205B2 (ja) プリント基板の部分はんだ付け方法
JP2008091557A (ja) 電子部品の実装方法および実装装置
JP2018107381A (ja) プリント回路アセンブリ及びその製造方法
JP2013110333A (ja) 基板及びリード付き部品の半田付け方法
JP2007250732A (ja) 電子部品およびその製造方法
JPH05267833A (ja) 表面実装用プリント配線板
JP2006114720A (ja) 実装基板及びその製造方法
KR20060014117A (ko) 인쇄회로기판

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090610

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090610

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090721

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20091124