CN101453836B - 印刷线路板、空调机、印刷线路板的钎焊方法 - Google Patents

印刷线路板、空调机、印刷线路板的钎焊方法 Download PDF

Info

Publication number
CN101453836B
CN101453836B CN2008101334790A CN200810133479A CN101453836B CN 101453836 B CN101453836 B CN 101453836B CN 2008101334790 A CN2008101334790 A CN 2008101334790A CN 200810133479 A CN200810133479 A CN 200810133479A CN 101453836 B CN101453836 B CN 101453836B
Authority
CN
China
Prior art keywords
solder
lead
printed wiring
wiring board
surface mount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008101334790A
Other languages
English (en)
Chinese (zh)
Other versions
CN101453836A (zh
Inventor
三浦刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN101453836A publication Critical patent/CN101453836A/zh
Application granted granted Critical
Publication of CN101453836B publication Critical patent/CN101453836B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN2008101334790A 2007-12-06 2008-07-25 印刷线路板、空调机、印刷线路板的钎焊方法 Expired - Fee Related CN101453836B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007315713 2007-12-06
JP2007315713A JP2009141106A (ja) 2007-12-06 2007-12-06 プリント配線基板、空気調和機、プリント配線基板の半田付け方法
JP2007-315713 2007-12-06

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN2010105207306A Division CN101969742A (zh) 2007-12-06 2008-07-25 印刷线路板、空调机、印刷线路板的钎焊方法

Publications (2)

Publication Number Publication Date
CN101453836A CN101453836A (zh) 2009-06-10
CN101453836B true CN101453836B (zh) 2011-03-30

Family

ID=40720450

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2008101334790A Expired - Fee Related CN101453836B (zh) 2007-12-06 2008-07-25 印刷线路板、空调机、印刷线路板的钎焊方法
CN2010105207306A Pending CN101969742A (zh) 2007-12-06 2008-07-25 印刷线路板、空调机、印刷线路板的钎焊方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2010105207306A Pending CN101969742A (zh) 2007-12-06 2008-07-25 印刷线路板、空调机、印刷线路板的钎焊方法

Country Status (3)

Country Link
US (1) US20090145644A1 (enExample)
JP (1) JP2009141106A (enExample)
CN (2) CN101453836B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6921244B2 (ja) * 2018-01-15 2021-08-18 本田技研工業株式会社 ブレーズ装置及び方法
WO2019211998A1 (ja) * 2018-05-01 2019-11-07 三菱電機株式会社 はんだ付けノズル、はんだ付け装置、はんだ付け方法およびプリント配線板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10173329A (ja) 1996-12-10 1998-06-26 Matsushita Electric Works Ltd 噴流式半田付け装置
CN1852638A (zh) * 2006-01-24 2006-10-25 华为技术有限公司 一种印刷焊膏的方法及印锡钢网
JP2006313792A (ja) * 2005-05-06 2006-11-16 Sony Corp プリント配線基板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5666272A (en) * 1994-11-29 1997-09-09 Sgs-Thomson Microelectronics, Inc. Detachable module/ball grid array package
US5679929A (en) * 1995-07-28 1997-10-21 Solectron Corporqtion Anti-bridging pads for printed circuit boards and interconnecting substrates
US5877033A (en) * 1997-03-10 1999-03-02 The Foxboro Company System for detection of unsoldered components
JP3633505B2 (ja) * 2001-04-27 2005-03-30 松下電器産業株式会社 プリント配線基板およびプリント配線基板の半田付け方法
CN100446650C (zh) * 2001-12-18 2008-12-24 爱立信股份有限公司 装配电子电路的设备和方法
JP4207934B2 (ja) * 2005-08-09 2009-01-14 三菱電機株式会社 ４方向リードフラットパッケージｉｃ実装プリント配線基板、４方向リードフラットパッケージｉｃの半田付方法、空気調和機。

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10173329A (ja) 1996-12-10 1998-06-26 Matsushita Electric Works Ltd 噴流式半田付け装置
JP2006313792A (ja) * 2005-05-06 2006-11-16 Sony Corp プリント配線基板
CN1852638A (zh) * 2006-01-24 2006-10-25 华为技术有限公司 一种印刷焊膏的方法及印锡钢网

Also Published As

Publication number Publication date
CN101453836A (zh) 2009-06-10
US20090145644A1 (en) 2009-06-11
CN101969742A (zh) 2011-02-09
JP2009141106A (ja) 2009-06-25

Similar Documents

Publication Publication Date Title
US20080179379A1 (en) Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method
US10843284B2 (en) Method for void reduction in solder joints
US6998861B2 (en) Wiring board and soldering method therefor
CN101453836B (zh) 印刷线路板、空调机、印刷线路板的钎焊方法
CN108463053B (zh) 一种pcb板设计方法及pcb板
US20090294515A1 (en) Mounting integrated circuit components on substrates
JP2009283983A (ja) プリント配線基板、空気調和機、プリント配線基板の半田付け方法
JP2010267785A (ja) 噴流はんだ槽
JP2000252613A (ja) 電子回路基板及びその半田付け方法
JP2007027538A (ja) 回路基板
EP2219427A1 (en) Dual inline lead-type electronic-part-mounted printed circuit board, method of soldering dual inline lead-type electronic part, and air-conditioner
JP2010080667A (ja) 実装基板、および実装方法
CN1929717B (zh) 导线型电子器件安装印刷电路基板、导线型电子器件的软钎焊方法、空气调节器
EP1603375B1 (en) Printed circuit board, method of soldering electronic components, and air conditioning apparatus with printed circuit board
JP2008260040A (ja) 残留はんだ除去装置および残留はんだ除去方法
JPWO2015071969A1 (ja) 大型部品実装構造及び大型部品実装方法
JP4952904B2 (ja) プリント配線基板とこれを備えたモータ制御装置
JP2006100524A (ja) はんだバンプ供給装置およびリペア方法
JP2008091557A (ja) 電子部品の実装方法および実装装置
JPH09181424A (ja) 電子部品、プリント配線板及びプリント配線板の製造方法
JPH07246492A (ja) 電子部品のはんだバンプ形成方法および連結はんだ
JP4543205B2 (ja) プリント基板の部分はんだ付け方法
JP5885162B2 (ja) プリント配線基板
JP2768357B2 (ja) 多端子部品実装用プリント基板
JP2768358B2 (ja) 多端子部品実装用プリント基板

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110330

Termination date: 20130725