JP2009137276A - 基板上への光重合性ドライフィルムのウェットラミネーションおよびそれに関連する組成物 - Google Patents
基板上への光重合性ドライフィルムのウェットラミネーションおよびそれに関連する組成物 Download PDFInfo
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- JP2009137276A JP2009137276A JP2008218536A JP2008218536A JP2009137276A JP 2009137276 A JP2009137276 A JP 2009137276A JP 2008218536 A JP2008218536 A JP 2008218536A JP 2008218536 A JP2008218536 A JP 2008218536A JP 2009137276 A JP2009137276 A JP 2009137276A
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- lamination
- liquid
- dry film
- wet
- acid
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- 150000002978 peroxides Chemical class 0.000 description 1
- 125000005385 peroxodisulfate group Chemical group 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-N peroxydisulfuric acid Chemical compound OS(=O)(=O)OOS(O)(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-N 0.000 description 1
- 229960005323 phenoxyethanol Drugs 0.000 description 1
- 229960000502 poloxamer Drugs 0.000 description 1
- 229920001983 poloxamer Polymers 0.000 description 1
- 229920001987 poloxamine Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229940057950 sodium laureth sulfate Drugs 0.000 description 1
- PFUVRDFDKPNGAV-UHFFFAOYSA-N sodium peroxide Chemical group [Na+].[Na+].[O-][O-] PFUVRDFDKPNGAV-UHFFFAOYSA-N 0.000 description 1
- SXHLENDCVBIJFO-UHFFFAOYSA-M sodium;2-[2-(2-dodecoxyethoxy)ethoxy]ethyl sulfate Chemical compound [Na+].CCCCCCCCCCCCOCCOCCOCCOS([O-])(=O)=O SXHLENDCVBIJFO-UHFFFAOYSA-M 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical compound NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 1
- 239000003760 tallow Substances 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- DAFQZPUISLXFBF-UHFFFAOYSA-N tetraoxathiolane 5,5-dioxide Chemical compound O=S1(=O)OOOO1 DAFQZPUISLXFBF-UHFFFAOYSA-N 0.000 description 1
- 150000003557 thiazoles Chemical class 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0038—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving application of liquid to the layers prior to lamination, e.g. wet laminating
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Materials For Photolithography (AREA)
Abstract
【解決手段】本発明は、回路基板パネルまたは他の基板上に光重合性フィルムをウェットラミネートするためのプロセスに有用なラミネーション液を対象とする。このラミネーションシステムは、1)ドライフィルムフォトレジスト、2)i)銅、ii)ステンレス鋼、iii)非金属の表面、を含む積層品、3)ラミネーション液、および4)積層品上に液を適用する装置を含む。このラミネーション液は、水および界面エネルギー改変剤を含む。この界面エネルギー改変剤は、0.0001と3.0モル/リットルとの間の範囲で存在し、液のpHは、3と11との間である。
【選択図】図1
Description
1.特にラミネーション接触面(複数も)が凸凹であるか、別の非平面である場合に、不都合な空気封じ込めが起こり得るし、かつ
2.不都合な残留物質(例えば、基板表面が銅またはステンレス鋼である場合等の変色防止剤残留物)がドライフィルムの接着を妨げ得るが、
そうであれば、最終製品が、不都合な断線または他の欠陥のありがちな回路線を有する回路パターンを有する恐れがある。
1.有機アルコール、
2.有機リン酸エステル、
3.以下のようなフルオロアルコール:
4.以下のものを含む、硫酸、スルホン酸、またはカルボン酸陰イオンに基づく界面活性剤等の陰イオン界面活性剤:
a.ドデシル硫酸ナトリウム(SDS)、
b.ラウレス硫酸ナトリウム(ラウリルエーテル硫酸ナトリウム)、
c.ラウリル硫酸アンモニウム、および
d.アルキルベンゼンスルホン酸、
e.脂肪酸塩、
f.ドデシル硫酸ナトリウム(SDS)、ラウリル硫酸アンモニウム、および他のアルキル硫酸塩、
5.以下のような陽イオン界面活性剤:
a.臭化セチルトリメチルアンモニウム(CTAB)、別名、臭化ヘキサデシルトリメチルアンモニウム、および他のアルキルトリメチルアンモニウム塩
b.塩化セチルピリジニウム(CPC)
c.牛脂アミンポリエトキシレート(POEA)
d.塩化ベンザルコニウム(BAC)
e.塩化ベンゼトニウム(BZT)
6.以下のような双性イオン(両性)界面活性剤
a.ドデシルベタイン
b.酸化ドデシルジメチルアミン
c.コカミドプロピルベタイン
d.ヤシ油両性グリシン塩、
7.以下のような非イオン性界面活性剤:
a.アルキルポリ(エチレンオキサイド)、
b.ポリ(エチレンオキサイド)およびポリ(プロピレンオキサイド)(商品名PoloxamerまたはPoloxamine)のコポリマー、
c.以下を含むアルキルポリグルコシド:
a.オクチルグルコシド
b.デシルマルトシド
d.以下を含む脂肪アルコール:
a.アセチルアルコール
b.オレイルアルコール、
e.コカミド、ならびに
8.以下のようなエーテル:
a.以下を含むグリコールエーテル:エチレングリコールモノジブチルエーテル、エチレングリコールモノフェニルエーテル(フェニルグリコール)、ジエチレングリコールモノエチルエーテル、ジエチレングリコールモノメチルエーテル、ジエチレングリコールモノブチルエーテル、ジエチレングリコールジブチルエーテル、ジエチレングリコールモノフェニルエーテル、プロピレングリコールモノブチルエーテル、プロピレングリコールモノフェニルエーテル、ジプロピレングリコールモノメチルエーテル、ジプロピレングリコールモノエチルエーテル、ジプロピレングリコールモノブチルエーテル、ジプロピレングリコールモノフェニルエーテル、トリプロピレングリコールモノメチルエーテル、トリプロピレングリコールモノエチルエーテル、およびジエチレングリコールモノエチルエーテル酢酸、
b.以下を含むグリコールエーテルの誘導体:プロピレングリコールモノメチルエーテル酢酸、およびプロピレングリコール二酢酸。
1.以下のようなチアゾール:
a.イミダゾール
b.ベンゾトリアゾール
c.ベンゾイミダゾール
d.ベンゾチアゾールおよび
e.2−メルカプトベンゾチアゾール
f.メチルイミダゾール
2.4H−オキサゾール−5−オン等のオキサゾール、
3.インダゾール等のベンゾピラゾール、および
4.これらの混合物、ならびにヒドロキシ、アミノ、イミノ、カルボキシ、メルカプト、ニトロ、およびアルキルで置換された基を有するそれらの誘導体、ならびに尿素、チオ尿素およびその他。
1.以下のようなアルコール:
a.イソプロパノール、
b.2−ブトキシ−エタノール−1、
c.イソブタノール、および
d.1−プロパノール
2.以下のようなケトン:
a.メチルイソブチルケトン、および
b.イソホロン、
3.以下のような炭化水素溶媒:
a.ベンゼン
b.C5~10パラフィン
この非水性共溶媒は、次のいずれか2つの間の(および場合によってはその値を含めた)量で存在することができる:0.1、0.5、1、2、3、4、5、6、7、8、9、10、12、15、または20重量パーセント。この非水性共溶媒の存在によってフォトレジストドライフィルム表面を濡らすことが容易になる。
1.「MX Advance 115」と呼ばれるドライフィルムフォトレジストを、ステンレス鋼表面上に、異なる3つのラミネーション条件(ドライラミネート=従来式、ウェットラミネート=脱イオン(DI)水使用、および脱イオン水への添加剤として有機アルコールを用いるウェットラミネート−S)で適用した。
2.「MX−5040」と呼ばれるドライフィルムフォトレジストを、若干の変色防止剤を含有する銅表面上に適用した。ウェットラミネート−Sは、図2に示す解像度グラフのように孤立線解像能力に関して、いくらかの向上を再び示すことができた。その上、ウェットラミネートとウェットラミネート−Sの両者は、ドライフィルムの浮き上がりも無く優れた画像品質を提供した(図3に示す写真1参照)。
Claims (2)
- ラミネーションシステムであって、
a.ラミネーション液は、水および共溶媒を含み、前記共溶媒は前記液の0.1と20重量パーセントとの間の量であり、前記共溶媒はアルコール、ケトン、炭化水素、またはそれらの組合せであり、かつ、
b.前記液は、界面エネルギー改変剤を0.0001と4.0モル/リットルとの間の範囲で含み、前記液のpHは3と11との間である、
ことを特徴とするラミネーションシステム。 - 前記界面エネルギー改変剤は、次の
a.有機アルコール、
b.有機リン酸エステル、
c.フルオロアルコール、
d.硫酸、スルホン酸、またはカルボン酸陰イオンに基づく界面活性剤等の陰イオン界面活性剤、
e.陽イオン界面活性剤、
f.双性イオン(両性)界面活性剤、および
g.コカミド、ならびに
h.エーテル
のうち少なくとも1種を含むことを特徴とする請求項1に記載のラミネーションシステム。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US96629807P | 2007-08-27 | 2007-08-27 | |
US60/966,298 | 2007-08-27 |
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JP2009137276A true JP2009137276A (ja) | 2009-06-25 |
JP5222664B2 JP5222664B2 (ja) | 2013-06-26 |
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JP2008218536A Active JP5222664B2 (ja) | 2007-08-27 | 2008-08-27 | 基板上への光重合性ドライフィルムのウェットラミネーションおよびそれに関連する組成物 |
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US (2) | US20100037799A1 (ja) |
JP (1) | JP5222664B2 (ja) |
KR (1) | KR20090023187A (ja) |
CN (1) | CN101430507A (ja) |
Cited By (3)
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JP2016024396A (ja) * | 2014-07-23 | 2016-02-08 | 旭化成イーマテリアルズ株式会社 | レジストパターンの製造方法 |
JP2017120393A (ja) * | 2015-12-28 | 2017-07-06 | 旭化成株式会社 | 積層体 |
WO2019193907A1 (ja) * | 2018-04-05 | 2019-10-10 | コニカミノルタ株式会社 | 光学物品の製造方法及び光学物品 |
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EP1584371A1 (en) * | 2004-04-07 | 2005-10-12 | Urea Casale S.A. | Fluid bed granulation process and apparatus |
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Also Published As
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JP5222664B2 (ja) | 2013-06-26 |
KR20090023187A (ko) | 2009-03-04 |
US20100037799A1 (en) | 2010-02-18 |
US20120308929A1 (en) | 2012-12-06 |
CN101430507A (zh) | 2009-05-13 |
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