JP2009137007A - 基板打抜き装置 - Google Patents

基板打抜き装置 Download PDF

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Publication number
JP2009137007A
JP2009137007A JP2008308281A JP2008308281A JP2009137007A JP 2009137007 A JP2009137007 A JP 2009137007A JP 2008308281 A JP2008308281 A JP 2008308281A JP 2008308281 A JP2008308281 A JP 2008308281A JP 2009137007 A JP2009137007 A JP 2009137007A
Authority
JP
Japan
Prior art keywords
substrate
punching
base frame
clamp
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008308281A
Other languages
English (en)
Japanese (ja)
Inventor
Se Young Kim
セー ヨン キム
Cheon Hee Kim
チョン ヒ キム
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEHO ROBOT INDUSTRY CO Ltd
Original Assignee
SEHO ROBOT INDUSTRY CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40371917&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP2009137007(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by SEHO ROBOT INDUSTRY CO Ltd filed Critical SEHO ROBOT INDUSTRY CO Ltd
Publication of JP2009137007A publication Critical patent/JP2009137007A/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/38—Cutting-out; Stamping-out
    • B26F1/40—Cutting-out; Stamping-out using a press, e.g. of the ram type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Details Of Cutting Devices (AREA)
  • Press Drives And Press Lines (AREA)
JP2008308281A 2007-12-03 2008-12-03 基板打抜き装置 Pending JP2009137007A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20070124271 2007-12-03
KR1020080047534A KR100872078B1 (ko) 2007-12-03 2008-05-22 기판 타발 장치

Publications (1)

Publication Number Publication Date
JP2009137007A true JP2009137007A (ja) 2009-06-25

Family

ID=40371917

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008308281A Pending JP2009137007A (ja) 2007-12-03 2008-12-03 基板打抜き装置
JP2008308280A Pending JP2009137006A (ja) 2007-12-03 2008-12-03 基板打抜き装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2008308280A Pending JP2009137006A (ja) 2007-12-03 2008-12-03 基板打抜き装置

Country Status (2)

Country Link
JP (2) JP2009137007A (ko)
KR (4) KR100883176B1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101779886B1 (ko) 2017-04-19 2017-09-19 황태부 사전 기계가공을 위한 복합가공장비

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101168491B1 (ko) * 2010-02-03 2012-07-31 전익희 로봇을 이용한 인쇄회로기판 내지 필름 이송 및 타발 시스템 및 그 방법
JP5091961B2 (ja) * 2010-02-15 2012-12-05 三星ダイヤモンド工業株式会社 スクライブ装置
KR101086571B1 (ko) * 2011-01-20 2011-11-23 우영관 부재 플레이트의 프레스 타발 및 포장 장치
CN102615670B (zh) * 2012-03-29 2014-10-01 宁波得益机电设备有限公司 全自动数控冲孔机
KR101326198B1 (ko) * 2012-04-15 2013-11-07 세호로보트 주식회사 기판 타발 장치
KR101375227B1 (ko) 2012-09-13 2014-03-18 주식회사 테크아이 비젼프레스의 비젼카메라 이동구조
KR101380865B1 (ko) * 2012-09-13 2014-04-02 주식회사 테크아이 비젼프레스의 클램프 이동구조
KR101376120B1 (ko) * 2012-11-30 2014-03-19 김유섭 필름 절단 장치
CN106393273B (zh) * 2016-11-15 2018-06-15 苏州慧捷自动化科技有限公司 一种自动冲切叠片摆片设备
CN106738048B (zh) * 2016-11-15 2018-10-30 苏州慧捷自动化科技有限公司 一种自动冲切叠片摆片设备中的橡胶冲裁工站
KR102347900B1 (ko) * 2020-11-12 2022-01-10 덕양산업 주식회사 차량 내장재 제조방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006326655A (ja) * 2005-05-27 2006-12-07 Yamaha Fine Technologies Co Ltd パンチング装置
JP2007123724A (ja) * 2005-10-31 2007-05-17 Yamaha Fine Technologies Co Ltd コネクタ部の打ち抜き装置、コネクタ部の打ち抜き方法およびコネクタ部の打ち抜き方法を実現するためのプログラム

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4790694A (en) 1986-10-09 1988-12-13 Loma Park Associates Method and system for multi-layer printed circuit board pre-drill processing
JP2561166B2 (ja) * 1990-03-26 1996-12-04 株式会社精工舎 プリント基板の穴明け方法及びその装置
JP2873439B2 (ja) 1995-09-22 1999-03-24 セイコープレシジョン株式会社 プリント基板の穴明け装置及び穴明け方法
KR100381674B1 (ko) * 2000-04-28 2003-04-26 가부시키가이샤 무라키 기준홀 천공기 및 이송위치 보정방법
KR100381810B1 (ko) * 2001-03-09 2003-04-26 주식회사 에스아이 플렉스 플랙시블 프린트기판의 가이드마크 타발장치
JP4546663B2 (ja) 2001-04-23 2010-09-15 富士機械製造株式会社 プリント板保持装置および電気部品装着システム
JP2004327944A (ja) 2003-04-28 2004-11-18 Canon Inc 配線基板の実装方法
KR100562583B1 (ko) * 2003-08-26 2006-03-23 (주)유비프리시젼 패널 이송장치
KR100612461B1 (ko) * 2004-12-28 2006-08-16 (주)삼원피씨비 소형 인쇄회로기판의 타발방법 및 타발장치
KR100633585B1 (ko) * 2005-01-20 2006-10-13 세호로보트산업 주식회사 연성소재용 펀칭머신
JP2007185729A (ja) * 2006-01-12 2007-07-26 Sumitomo Bakelite Co Ltd 基板打抜き金型
JP4671889B2 (ja) * 2006-03-06 2011-04-20 セイコープレシジョン株式会社 穿孔装置及び穿孔方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006326655A (ja) * 2005-05-27 2006-12-07 Yamaha Fine Technologies Co Ltd パンチング装置
JP2007123724A (ja) * 2005-10-31 2007-05-17 Yamaha Fine Technologies Co Ltd コネクタ部の打ち抜き装置、コネクタ部の打ち抜き方法およびコネクタ部の打ち抜き方法を実現するためのプログラム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101779886B1 (ko) 2017-04-19 2017-09-19 황태부 사전 기계가공을 위한 복합가공장비

Also Published As

Publication number Publication date
JP2009137006A (ja) 2009-06-25
KR101003455B1 (ko) 2010-12-28
KR100883176B1 (ko) 2009-02-12
KR100872078B1 (ko) 2008-12-05
KR20090057879A (ko) 2009-06-08
KR20090057872A (ko) 2009-06-08

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