JP2009135479A5 - - Google Patents
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- Publication number
- JP2009135479A5 JP2009135479A5 JP2008282666A JP2008282666A JP2009135479A5 JP 2009135479 A5 JP2009135479 A5 JP 2009135479A5 JP 2008282666 A JP2008282666 A JP 2008282666A JP 2008282666 A JP2008282666 A JP 2008282666A JP 2009135479 A5 JP2009135479 A5 JP 2009135479A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- mounting structure
- electronic component
- structure according
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 8
- 229910000679 solder Inorganic materials 0.000 claims 4
- 229910052802 copper Inorganic materials 0.000 claims 2
- 229910052732 germanium Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- 229910052738 indium Inorganic materials 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008282666A JP5202233B2 (ja) | 2007-11-01 | 2008-11-04 | 実装構造体 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007284976 | 2007-11-01 | ||
| JP2007284976 | 2007-11-01 | ||
| JP2008282666A JP5202233B2 (ja) | 2007-11-01 | 2008-11-04 | 実装構造体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009135479A JP2009135479A (ja) | 2009-06-18 |
| JP2009135479A5 true JP2009135479A5 (OSRAM) | 2011-09-15 |
| JP5202233B2 JP5202233B2 (ja) | 2013-06-05 |
Family
ID=40587897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008282666A Expired - Fee Related JP5202233B2 (ja) | 2007-11-01 | 2008-11-04 | 実装構造体 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8410377B2 (OSRAM) |
| JP (1) | JP5202233B2 (OSRAM) |
| KR (1) | KR101011199B1 (OSRAM) |
| CN (1) | CN101425511B (OSRAM) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011100718A (ja) * | 2009-10-05 | 2011-05-19 | Yazaki Corp | コネクタ |
| WO2011114759A1 (ja) * | 2010-03-19 | 2011-09-22 | 株式会社安川電機 | 電子部品の実装方法および電子機器 |
| JP5785760B2 (ja) * | 2011-04-11 | 2015-09-30 | 日本特殊陶業株式会社 | 部品実装基板 |
| US10032692B2 (en) * | 2013-03-12 | 2018-07-24 | Nvidia Corporation | Semiconductor package structure |
| EP3499554A1 (de) * | 2017-12-13 | 2019-06-19 | Heraeus Deutschland GmbH & Co. KG | Verfahren zur herstellung einer sandwichanordnung aus zwei bauelementen mit dazwischen befindlichem lot mittels heisspressens unterhalb der schmelztemperatur des lotmaterials einer lotvorform |
| JP2022502265A (ja) * | 2018-10-24 | 2022-01-11 | アルファ・アセンブリー・ソリューションズ・インコーポレイテッドAlpha Assembly Solutions Inc. | ポリマー基板、プリント回路板及び他の接合用途のための低温はんだ付け溶液 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02260592A (ja) * | 1989-03-31 | 1990-10-23 | Mitsumi Electric Co Ltd | 回路基板 |
| JPH0327441A (ja) | 1989-06-23 | 1991-02-05 | Nippon Telegr & Teleph Corp <Ntt> | 知識情報処理システムにおけるデータベース利用方式 |
| JP3027441B2 (ja) | 1991-07-08 | 2000-04-04 | 千住金属工業株式会社 | 高温はんだ |
| US5520752A (en) * | 1994-06-20 | 1996-05-28 | The United States Of America As Represented By The Secretary Of The Army | Composite solders |
| JPH09214095A (ja) * | 1996-01-30 | 1997-08-15 | Matsushita Electric Ind Co Ltd | 基板および回路モジュールおよび回路モジュールの製造方法 |
| JPH10163605A (ja) | 1996-11-27 | 1998-06-19 | Sony Corp | 電子回路装置 |
| JPH11177016A (ja) | 1997-12-15 | 1999-07-02 | Denso Corp | 混成集積回路装置 |
| JP3184491B2 (ja) * | 1998-05-20 | 2001-07-09 | 松下電子工業株式会社 | 半導体装置およびその製造方法 |
| TW569424B (en) * | 2000-03-17 | 2004-01-01 | Matsushita Electric Industrial Co Ltd | Module with embedded electric elements and the manufacturing method thereof |
| JP2001267473A (ja) * | 2000-03-17 | 2001-09-28 | Hitachi Ltd | 半導体装置およびその製造方法 |
| US6680436B2 (en) * | 2000-07-12 | 2004-01-20 | Seagate Technology Llc | Reflow encapsulant |
| US6608375B2 (en) * | 2001-04-06 | 2003-08-19 | Oki Electric Industry Co., Ltd. | Semiconductor apparatus with decoupling capacitor |
| SE520714C2 (sv) * | 2001-04-20 | 2003-08-12 | Aamic Ab | Mikroreplikerade miniatyriserade elektriska komponenter |
| US6550665B1 (en) * | 2001-06-06 | 2003-04-22 | Indigo Systems Corporation | Method for electrically interconnecting large contact arrays using eutectic alloy bumping |
| US7215022B2 (en) * | 2001-06-21 | 2007-05-08 | Ati Technologies Inc. | Multi-die module |
| JP2003297873A (ja) * | 2002-03-29 | 2003-10-17 | Hitachi Ltd | 半導体装置，構造体及び電子装置 |
| JP2004193404A (ja) * | 2002-12-12 | 2004-07-08 | Alps Electric Co Ltd | 回路モジュール、及びその製造方法 |
| JP2005011838A (ja) * | 2003-06-16 | 2005-01-13 | Toshiba Corp | 半導体装置及びその組立方法 |
| JP2005095977A (ja) * | 2003-08-26 | 2005-04-14 | Sanyo Electric Co Ltd | 回路装置 |
| JP2005108950A (ja) * | 2003-09-29 | 2005-04-21 | Matsushita Electric Ind Co Ltd | セラミックモジュール部品およびその製造方法 |
| JP4552934B2 (ja) * | 2004-03-02 | 2010-09-29 | 富士電機ホールディングス株式会社 | 電子部品の実装方法 |
| JP4383257B2 (ja) * | 2004-05-31 | 2009-12-16 | 三洋電機株式会社 | 回路装置およびその製造方法 |
| JP2006100752A (ja) * | 2004-09-30 | 2006-04-13 | Sanyo Electric Co Ltd | 回路装置およびその製造方法 |
| CN101048863B (zh) * | 2004-10-28 | 2010-12-01 | 京瓷株式会社 | 电子部件模块以及无线通信设备 |
| JP4975342B2 (ja) * | 2005-03-15 | 2012-07-11 | パナソニック株式会社 | 導電性接着剤 |
| WO2007018288A1 (ja) * | 2005-08-11 | 2007-02-15 | Senju Metal Industry Co., Ltd. | 鉛フリーソルダペーストとその応用 |
| US7652892B2 (en) * | 2006-03-03 | 2010-01-26 | Kingston Technology Corporation | Waterproof USB drives and method of making |
-
2008
- 2008-10-23 KR KR1020080104081A patent/KR101011199B1/ko not_active Expired - Fee Related
- 2008-10-29 US US12/260,219 patent/US8410377B2/en not_active Expired - Fee Related
- 2008-10-30 CN CN200810173147.5A patent/CN101425511B/zh not_active Expired - Fee Related
- 2008-11-04 JP JP2008282666A patent/JP5202233B2/ja not_active Expired - Fee Related
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