JP2009083119A5 - - Google Patents
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- Publication number
- JP2009083119A5 JP2009083119A5 JP2007252093A JP2007252093A JP2009083119A5 JP 2009083119 A5 JP2009083119 A5 JP 2009083119A5 JP 2007252093 A JP2007252093 A JP 2007252093A JP 2007252093 A JP2007252093 A JP 2007252093A JP 2009083119 A5 JP2009083119 A5 JP 2009083119A5
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- nozzle
- spot
- glass substrate
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 description 15
- 239000000758 substrate Substances 0.000 description 9
- 239000011521 glass Substances 0.000 description 7
- 239000002826 coolant Substances 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 239000001569 carbon dioxide Substances 0.000 description 3
- 230000003287 optical Effects 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007252093A JP5011048B2 (ja) | 2007-09-27 | 2007-09-27 | 脆性材料基板の加工方法 |
TW097125517A TWI406828B (zh) | 2007-09-27 | 2008-07-07 | Method for processing brittle material substrates |
KR1020080072120A KR101135436B1 (ko) | 2007-09-27 | 2008-07-24 | 취성재료기판의 가공방법 |
CN2008101491908A CN101396771B (zh) | 2007-09-27 | 2008-09-19 | 脆性材料基板的加工方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007252093A JP5011048B2 (ja) | 2007-09-27 | 2007-09-27 | 脆性材料基板の加工方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2009083119A JP2009083119A (ja) | 2009-04-23 |
JP2009083119A5 true JP2009083119A5 (zh) | 2010-10-14 |
JP5011048B2 JP5011048B2 (ja) | 2012-08-29 |
Family
ID=40515743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007252093A Expired - Fee Related JP5011048B2 (ja) | 2007-09-27 | 2007-09-27 | 脆性材料基板の加工方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5011048B2 (zh) |
KR (1) | KR101135436B1 (zh) |
CN (1) | CN101396771B (zh) |
TW (1) | TWI406828B (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011079690A (ja) * | 2009-10-06 | 2011-04-21 | Leo:Kk | 回折格子を用いた厚板ガラスのレーザ熱応力割断 |
JP5281544B2 (ja) * | 2009-10-30 | 2013-09-04 | 三星ダイヤモンド工業株式会社 | ブレイク装置 |
JP5558129B2 (ja) * | 2010-02-05 | 2014-07-23 | 株式会社ディスコ | 光デバイスウエーハの加工方法 |
JP2011165766A (ja) * | 2010-02-05 | 2011-08-25 | Disco Abrasive Syst Ltd | 光デバイスウエーハの加工方法 |
JP5558128B2 (ja) * | 2010-02-05 | 2014-07-23 | 株式会社ディスコ | 光デバイスウエーハの加工方法 |
CN102343507A (zh) * | 2010-07-30 | 2012-02-08 | 信义汽车玻璃(深圳)有限公司 | 汽车玻璃附件安装定位方法 |
TWI400137B (zh) * | 2010-12-17 | 2013-07-01 | Ind Tech Res Inst | 移除玻璃板材邊緣缺陷之裝置及其方法 |
CN102643017B (zh) * | 2011-03-14 | 2014-09-10 | 京东方科技集团股份有限公司 | 非接触式裂片方法、设备及切割和裂片的方法、设备 |
DE102012210527A1 (de) * | 2012-06-21 | 2013-12-24 | Robert Bosch Gmbh | Verfahren zur Herstellung einer Diode und Diode |
CN104684856B (zh) * | 2012-11-09 | 2017-07-07 | 日本电气硝子株式会社 | 初始裂纹形成装置以及形成方法 |
US9643878B2 (en) * | 2012-11-13 | 2017-05-09 | Nippon Electric Glass Co., Ltd. | Sheet glass manufacturing method and manufacturing device |
CN104071974B (zh) * | 2014-06-20 | 2016-04-13 | 武汉先河激光技术有限公司 | 一种用于玻璃切割的激光设备及切割方法 |
JP2016166120A (ja) * | 2015-03-06 | 2016-09-15 | 三星ダイヤモンド工業株式会社 | 積層基板の加工方法及びレーザ光による積層基板の加工装置 |
CN113828941B (zh) * | 2021-10-15 | 2022-05-13 | 华中科技大学 | 一种基于复合材料微米级高速识别的加工方法及装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100300418B1 (ko) * | 1999-01-18 | 2001-09-22 | 김순택 | 비금속 재료의 절단방법 및 그 장치 |
DE19952331C1 (de) * | 1999-10-29 | 2001-08-30 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen |
JP4390937B2 (ja) * | 1999-11-25 | 2009-12-24 | 三星ダイヤモンド工業株式会社 | ガラス板分割方法及び装置 |
TW592868B (en) * | 2001-07-18 | 2004-06-21 | Mitsuboshi Diamond Ind Co Ltd | Device and method for scribing fragile material substrate |
WO2003010102A1 (en) * | 2001-07-25 | 2003-02-06 | Kondratenko Vladimir Stepanovi | Cutting method for brittle non-metallic materials (two variants) |
TWI277612B (en) * | 2002-08-09 | 2007-04-01 | Mitsuboshi Diamond Ind Co Ltd | Method and device for scribing fragile material substrate |
KR101016157B1 (ko) * | 2002-08-21 | 2011-02-17 | 미쓰보시 다이야몬도 고교 가부시키가이샤 | 취성 재료의 기판 절단 방법 |
KR100497820B1 (ko) * | 2003-01-06 | 2005-07-01 | 로체 시스템즈(주) | 유리판절단장치 |
US7638730B2 (en) * | 2003-03-21 | 2009-12-29 | Rorze Systems Corporation | Apparatus for cutting glass plate |
JP4615231B2 (ja) * | 2004-02-02 | 2011-01-19 | 三星ダイヤモンド工業株式会社 | スクライブ装置およびこの装置を用いたスクライブ方法 |
US20080135532A1 (en) * | 2004-04-27 | 2008-06-12 | Mitsuboshi Diamond Industrial Co., Ltd. | Method of and an Apparatus for Forming a Perpendicular Crack in a Brittle Substrate |
WO2006002168A1 (en) * | 2004-06-21 | 2006-01-05 | Applied Photonics, Inc. | Device, system and method for cutting, cleaving or separating a substrate material |
MX2007003742A (es) * | 2004-10-01 | 2007-06-05 | Mitsuboshi Diamond Ind Co Ltd | Metodo de trazado para materiales fragiles y aparato de trazado. |
EP1806202B1 (en) | 2004-10-25 | 2011-08-17 | Mitsuboshi Diamond Industrial Co., Ltd. | Method and device for forming crack |
JP2007055000A (ja) * | 2005-08-23 | 2007-03-08 | Japan Steel Works Ltd:The | 非金属材料製の被加工物の切断方法及びその装置 |
JP2007090860A (ja) * | 2005-09-01 | 2007-04-12 | Shibaura Mechatronics Corp | 脆性材料の割断加工システム及びその方法 |
-
2007
- 2007-09-27 JP JP2007252093A patent/JP5011048B2/ja not_active Expired - Fee Related
-
2008
- 2008-07-07 TW TW097125517A patent/TWI406828B/zh not_active IP Right Cessation
- 2008-07-24 KR KR1020080072120A patent/KR101135436B1/ko not_active IP Right Cessation
- 2008-09-19 CN CN2008101491908A patent/CN101396771B/zh not_active Expired - Fee Related
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