JP2009083119A5 - - Google Patents

Download PDF

Info

Publication number
JP2009083119A5
JP2009083119A5 JP2007252093A JP2007252093A JP2009083119A5 JP 2009083119 A5 JP2009083119 A5 JP 2009083119A5 JP 2007252093 A JP2007252093 A JP 2007252093A JP 2007252093 A JP2007252093 A JP 2007252093A JP 2009083119 A5 JP2009083119 A5 JP 2009083119A5
Authority
JP
Japan
Prior art keywords
cooling
nozzle
spot
glass substrate
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007252093A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009083119A (ja
JP5011048B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007252093A priority Critical patent/JP5011048B2/ja
Priority claimed from JP2007252093A external-priority patent/JP5011048B2/ja
Priority to TW097125517A priority patent/TWI406828B/zh
Priority to KR1020080072120A priority patent/KR101135436B1/ko
Priority to CN2008101491908A priority patent/CN101396771B/zh
Publication of JP2009083119A publication Critical patent/JP2009083119A/ja
Publication of JP2009083119A5 publication Critical patent/JP2009083119A5/ja
Application granted granted Critical
Publication of JP5011048B2 publication Critical patent/JP5011048B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

JP2007252093A 2007-09-27 2007-09-27 脆性材料基板の加工方法 Expired - Fee Related JP5011048B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007252093A JP5011048B2 (ja) 2007-09-27 2007-09-27 脆性材料基板の加工方法
TW097125517A TWI406828B (zh) 2007-09-27 2008-07-07 Method for processing brittle material substrates
KR1020080072120A KR101135436B1 (ko) 2007-09-27 2008-07-24 취성재료기판의 가공방법
CN2008101491908A CN101396771B (zh) 2007-09-27 2008-09-19 脆性材料基板的加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007252093A JP5011048B2 (ja) 2007-09-27 2007-09-27 脆性材料基板の加工方法

Publications (3)

Publication Number Publication Date
JP2009083119A JP2009083119A (ja) 2009-04-23
JP2009083119A5 true JP2009083119A5 (zh) 2010-10-14
JP5011048B2 JP5011048B2 (ja) 2012-08-29

Family

ID=40515743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007252093A Expired - Fee Related JP5011048B2 (ja) 2007-09-27 2007-09-27 脆性材料基板の加工方法

Country Status (4)

Country Link
JP (1) JP5011048B2 (zh)
KR (1) KR101135436B1 (zh)
CN (1) CN101396771B (zh)
TW (1) TWI406828B (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011079690A (ja) * 2009-10-06 2011-04-21 Leo:Kk 回折格子を用いた厚板ガラスのレーザ熱応力割断
JP5281544B2 (ja) * 2009-10-30 2013-09-04 三星ダイヤモンド工業株式会社 ブレイク装置
JP5558129B2 (ja) * 2010-02-05 2014-07-23 株式会社ディスコ 光デバイスウエーハの加工方法
JP2011165766A (ja) * 2010-02-05 2011-08-25 Disco Abrasive Syst Ltd 光デバイスウエーハの加工方法
JP5558128B2 (ja) * 2010-02-05 2014-07-23 株式会社ディスコ 光デバイスウエーハの加工方法
CN102343507A (zh) * 2010-07-30 2012-02-08 信义汽车玻璃(深圳)有限公司 汽车玻璃附件安装定位方法
TWI400137B (zh) * 2010-12-17 2013-07-01 Ind Tech Res Inst 移除玻璃板材邊緣缺陷之裝置及其方法
CN102643017B (zh) * 2011-03-14 2014-09-10 京东方科技集团股份有限公司 非接触式裂片方法、设备及切割和裂片的方法、设备
DE102012210527A1 (de) * 2012-06-21 2013-12-24 Robert Bosch Gmbh Verfahren zur Herstellung einer Diode und Diode
CN104684856B (zh) * 2012-11-09 2017-07-07 日本电气硝子株式会社 初始裂纹形成装置以及形成方法
US9643878B2 (en) * 2012-11-13 2017-05-09 Nippon Electric Glass Co., Ltd. Sheet glass manufacturing method and manufacturing device
CN104071974B (zh) * 2014-06-20 2016-04-13 武汉先河激光技术有限公司 一种用于玻璃切割的激光设备及切割方法
JP2016166120A (ja) * 2015-03-06 2016-09-15 三星ダイヤモンド工業株式会社 積層基板の加工方法及びレーザ光による積層基板の加工装置
CN113828941B (zh) * 2021-10-15 2022-05-13 华中科技大学 一种基于复合材料微米级高速识别的加工方法及装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100300418B1 (ko) * 1999-01-18 2001-09-22 김순택 비금속 재료의 절단방법 및 그 장치
DE19952331C1 (de) * 1999-10-29 2001-08-30 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen
JP4390937B2 (ja) * 1999-11-25 2009-12-24 三星ダイヤモンド工業株式会社 ガラス板分割方法及び装置
TW592868B (en) * 2001-07-18 2004-06-21 Mitsuboshi Diamond Ind Co Ltd Device and method for scribing fragile material substrate
WO2003010102A1 (en) * 2001-07-25 2003-02-06 Kondratenko Vladimir Stepanovi Cutting method for brittle non-metallic materials (two variants)
TWI277612B (en) * 2002-08-09 2007-04-01 Mitsuboshi Diamond Ind Co Ltd Method and device for scribing fragile material substrate
KR101016157B1 (ko) * 2002-08-21 2011-02-17 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료의 기판 절단 방법
KR100497820B1 (ko) * 2003-01-06 2005-07-01 로체 시스템즈(주) 유리판절단장치
US7638730B2 (en) * 2003-03-21 2009-12-29 Rorze Systems Corporation Apparatus for cutting glass plate
JP4615231B2 (ja) * 2004-02-02 2011-01-19 三星ダイヤモンド工業株式会社 スクライブ装置およびこの装置を用いたスクライブ方法
US20080135532A1 (en) * 2004-04-27 2008-06-12 Mitsuboshi Diamond Industrial Co., Ltd. Method of and an Apparatus for Forming a Perpendicular Crack in a Brittle Substrate
WO2006002168A1 (en) * 2004-06-21 2006-01-05 Applied Photonics, Inc. Device, system and method for cutting, cleaving or separating a substrate material
MX2007003742A (es) * 2004-10-01 2007-06-05 Mitsuboshi Diamond Ind Co Ltd Metodo de trazado para materiales fragiles y aparato de trazado.
EP1806202B1 (en) 2004-10-25 2011-08-17 Mitsuboshi Diamond Industrial Co., Ltd. Method and device for forming crack
JP2007055000A (ja) * 2005-08-23 2007-03-08 Japan Steel Works Ltd:The 非金属材料製の被加工物の切断方法及びその装置
JP2007090860A (ja) * 2005-09-01 2007-04-12 Shibaura Mechatronics Corp 脆性材料の割断加工システム及びその方法

Similar Documents

Publication Publication Date Title
JP2009083119A5 (zh)
TWI587959B (zh) Lamination method of substrate and processing device
JP5190089B2 (ja) 基板切断装置、及び基板切断方法
JP5011048B2 (ja) 脆性材料基板の加工方法
JP5171838B2 (ja) 脆性材料基板のレーザスクライブ方法
WO2009145008A1 (ja) レーザ加工装置およびレーザ加工方法
JP2010150068A (ja) 脆性材料基板の割断方法
JP4080484B2 (ja) 脆性材料基板のスクライブ方法およびスクライブ装置
TWI292352B (zh)
KR101197109B1 (ko) 레이저 할단 장치
JP2010228005A (ja) 基板切断装置及びこれを用いた基板切断方法
JP5554158B2 (ja) 脆性材料基板の割断方法
TW201321322A (zh) 刻劃裝置
JP6303950B2 (ja) ガラス板の加工方法
TWI461251B (zh) Method for cutting brittle material substrates
JP5379073B2 (ja) 冷却ノズル及びそれを用いた冷却方法並びに脆性材料基板の割断方法
CN204657738U (zh) 紫外激光织构汽缸套内壁专用加工装置
JP2015160769A (ja) ガラス基板の割断方法
TW536438B (en) Method of processing brittle material and processing device
CN101717187A (zh) 玻璃基板激光切割机
TWM467665U (zh) 用於光學玻璃的切割設備及其鑽石刀
JP2013202659A (ja) レーザー加工装置
JP6936534B1 (ja) ヒューム捕集ノズル
JPH11841A (ja) レーザ・ウォータジェット複合切断装置
KR102570919B1 (ko) 파이브 녹 클리닝모드 제어형 파이버 레이저식 녹제거장치 및 방법