JP2009075207A - フォトマスク及びそれを用いたパターン形成方法 - Google Patents

フォトマスク及びそれを用いたパターン形成方法 Download PDF

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Publication number
JP2009075207A
JP2009075207A JP2007242195A JP2007242195A JP2009075207A JP 2009075207 A JP2009075207 A JP 2009075207A JP 2007242195 A JP2007242195 A JP 2007242195A JP 2007242195 A JP2007242195 A JP 2007242195A JP 2009075207 A JP2009075207 A JP 2009075207A
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JP
Japan
Prior art keywords
light
shielding
pattern
exposure
semi
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Pending
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JP2007242195A
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English (en)
Japanese (ja)
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JP2009075207A5 (enExample
Inventor
Tadayoshi Shimizu
但美 清水
Akio Mitsusaka
章夫 三坂
Masaru Sasako
勝 笹子
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Panasonic Corp
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Panasonic Corp
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Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2007242195A priority Critical patent/JP2009075207A/ja
Priority to US12/204,252 priority patent/US7914953B2/en
Publication of JP2009075207A publication Critical patent/JP2009075207A/ja
Priority to US13/028,611 priority patent/US20110136048A1/en
Publication of JP2009075207A5 publication Critical patent/JP2009075207A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
JP2007242195A 2007-09-19 2007-09-19 フォトマスク及びそれを用いたパターン形成方法 Pending JP2009075207A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007242195A JP2009075207A (ja) 2007-09-19 2007-09-19 フォトマスク及びそれを用いたパターン形成方法
US12/204,252 US7914953B2 (en) 2007-09-19 2008-09-04 Photomask and pattern formation method using the same
US13/028,611 US20110136048A1 (en) 2007-09-19 2011-02-16 Photomask and pattern formation method using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007242195A JP2009075207A (ja) 2007-09-19 2007-09-19 フォトマスク及びそれを用いたパターン形成方法

Publications (2)

Publication Number Publication Date
JP2009075207A true JP2009075207A (ja) 2009-04-09
JP2009075207A5 JP2009075207A5 (enExample) 2011-12-15

Family

ID=40454857

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007242195A Pending JP2009075207A (ja) 2007-09-19 2007-09-19 フォトマスク及びそれを用いたパターン形成方法

Country Status (2)

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US (2) US7914953B2 (enExample)
JP (1) JP2009075207A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012039078A1 (ja) * 2010-09-21 2012-03-29 パナソニック株式会社 フォトマスク及びそれを用いたパターン形成方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM439824U (en) * 2010-11-01 2012-10-21 yao-qing Zeng Optical mask
JP2013084713A (ja) * 2011-10-07 2013-05-09 Sony Corp 固体撮像素子および製造方法、並びに撮像ユニット
JP5684168B2 (ja) * 2012-02-15 2015-03-11 株式会社東芝 フレア計測方法、反射型マスクおよび露光装置
KR20150028109A (ko) * 2013-09-05 2015-03-13 삼성디스플레이 주식회사 노광용 마스크, 이의 제조방법 및 이를 이용한 표시패널의 제조방법
US10838295B2 (en) * 2017-05-04 2020-11-17 Taiwan Semiconductor Manufacturing Company, Ltd. Photomask and fabrication method therefor

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08106151A (ja) * 1994-10-04 1996-04-23 Sony Corp 位相シフト・マスクおよびその製造方法
JPH1115130A (ja) * 1997-06-24 1999-01-22 Matsushita Electron Corp 半導体製造用ハーフトーンマスクおよびその製造方法
JP2000089449A (ja) * 1998-09-11 2000-03-31 Nec Kyushu Ltd レチクル及びそのレチクルを用いた半導体装置の製造方法
JP2003322949A (ja) * 2002-04-30 2003-11-14 Matsushita Electric Ind Co Ltd フォトマスク及びそれを用いたパターン形成方法
JP2004029747A (ja) * 2002-04-30 2004-01-29 Matsushita Electric Ind Co Ltd フォトマスク、その作成方法、及びそのフォトマスクを用いたパターン形成方法
WO2005081295A1 (ja) * 2004-02-20 2005-09-01 Nikon Corporation 露光方法、露光装置及び露光システム並びにデバイス製造方法
JP2006053589A (ja) * 2003-02-17 2006-02-23 Matsushita Electric Ind Co Ltd パターン形成方法
JP2008065139A (ja) * 2006-09-08 2008-03-21 Dainippon Printing Co Ltd 階調マスク

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Publication number Priority date Publication date Assignee Title
JP3197484B2 (ja) 1995-05-31 2001-08-13 シャープ株式会社 フォトマスク及びその製造方法
KR0161879B1 (ko) 1995-09-25 1999-01-15 문정환 위상 반전 마스크의 구조 및 제조방법
KR100215850B1 (ko) 1996-04-12 1999-08-16 구본준 하프톤 위상 반전 마스크 및_그제조방법
US6214497B1 (en) * 1999-06-29 2001-04-10 Micron Technology, Inc. Method to eliminate side lobe printing of attenuated phase shift masks
US6207333B1 (en) 1999-07-29 2001-03-27 International Business Machines Corporation Mask with attenuating phase-shift and opaque regions
US6255023B1 (en) * 1999-11-04 2001-07-03 United Microelectronics Corp. Method of manufacturing binary phase shift mask
US6703168B1 (en) * 1999-11-08 2004-03-09 Matsushita Electric Industrial Co., Ltd. Photomask
JP2001296647A (ja) 2000-02-10 2001-10-26 Nec Corp フォトマスクおよびこれを用いた露光方法
JP3708877B2 (ja) 2001-05-01 2005-10-19 松下電器産業株式会社 フォトマスク
JP2003005344A (ja) 2001-06-20 2003-01-08 Nec Corp ハーフトーン位相シフトマスク及びその製造方法
US7147975B2 (en) 2003-02-17 2006-12-12 Matsushita Electric Industrial Co., Ltd. Photomask
US7348575B2 (en) * 2003-05-06 2008-03-25 Nikon Corporation Projection optical system, exposure apparatus, and exposure method
JP2005107195A (ja) 2003-09-30 2005-04-21 Renesas Technology Corp ホトマスク、ホトマスクの製造方法、およびそのホトマスクを用いた半導体装置の製造方法
JP4619043B2 (ja) 2004-06-02 2011-01-26 Ｈｏｙａ株式会社 位相シフトマスクの製造方法及びテンプレートの製造方法
JP5044095B2 (ja) 2004-11-02 2012-10-10 富士通セミコンダクター株式会社 半導体装置の製造方法
US7645552B2 (en) 2004-12-03 2010-01-12 Xerox Corporation Toner compositions
US7691559B2 (en) * 2005-06-30 2010-04-06 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion lithography edge bead removal
JP2009053575A (ja) * 2007-08-29 2009-03-12 Panasonic Corp フォトマスク及びそれを用いたパターン形成方法
JP2009058877A (ja) * 2007-09-03 2009-03-19 Panasonic Corp フォトマスク及びそれを用いたパターン形成方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08106151A (ja) * 1994-10-04 1996-04-23 Sony Corp 位相シフト・マスクおよびその製造方法
JPH1115130A (ja) * 1997-06-24 1999-01-22 Matsushita Electron Corp 半導体製造用ハーフトーンマスクおよびその製造方法
JP2000089449A (ja) * 1998-09-11 2000-03-31 Nec Kyushu Ltd レチクル及びそのレチクルを用いた半導体装置の製造方法
JP2003322949A (ja) * 2002-04-30 2003-11-14 Matsushita Electric Ind Co Ltd フォトマスク及びそれを用いたパターン形成方法
JP2004029747A (ja) * 2002-04-30 2004-01-29 Matsushita Electric Ind Co Ltd フォトマスク、その作成方法、及びそのフォトマスクを用いたパターン形成方法
JP2006053589A (ja) * 2003-02-17 2006-02-23 Matsushita Electric Ind Co Ltd パターン形成方法
WO2005081295A1 (ja) * 2004-02-20 2005-09-01 Nikon Corporation 露光方法、露光装置及び露光システム並びにデバイス製造方法
JP2008065139A (ja) * 2006-09-08 2008-03-21 Dainippon Printing Co Ltd 階調マスク

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012039078A1 (ja) * 2010-09-21 2012-03-29 パナソニック株式会社 フォトマスク及びそれを用いたパターン形成方法
JP2012068296A (ja) * 2010-09-21 2012-04-05 Panasonic Corp フォトマスク及びそれを用いたパターン形成方法

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Publication number Publication date
US20110136048A1 (en) 2011-06-09
US20090075182A1 (en) 2009-03-19
US7914953B2 (en) 2011-03-29

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