JP2009065133A5 - - Google Patents

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Publication number
JP2009065133A5
JP2009065133A5 JP2008198466A JP2008198466A JP2009065133A5 JP 2009065133 A5 JP2009065133 A5 JP 2009065133A5 JP 2008198466 A JP2008198466 A JP 2008198466A JP 2008198466 A JP2008198466 A JP 2008198466A JP 2009065133 A5 JP2009065133 A5 JP 2009065133A5
Authority
JP
Japan
Prior art keywords
dielectric
component
plate
dielectric component
electrostatic chuck
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008198466A
Other languages
English (en)
Japanese (ja)
Other versions
JP5140516B2 (ja
JP2009065133A (ja
Filing date
Publication date
Priority claimed from US11/888,327 external-priority patent/US8108981B2/en
Priority claimed from US11/888,311 external-priority patent/US7848076B2/en
Priority claimed from US11/888,341 external-priority patent/US9202736B2/en
Application filed filed Critical
Publication of JP2009065133A publication Critical patent/JP2009065133A/ja
Publication of JP2009065133A5 publication Critical patent/JP2009065133A5/ja
Application granted granted Critical
Publication of JP5140516B2 publication Critical patent/JP5140516B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008198466A 2007-07-31 2008-07-31 プラズマ侵入及びアーキングを減少させた静電チャックを準備するための方法及び装置 Expired - Fee Related JP5140516B2 (ja)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US11/888,341 2007-07-31
US11/888,311 2007-07-31
US11/888,327 US8108981B2 (en) 2007-07-31 2007-07-31 Method of making an electrostatic chuck with reduced plasma penetration and arcing
US11/888,327 2007-07-31
US11/888,311 US7848076B2 (en) 2007-07-31 2007-07-31 Method and apparatus for providing an electrostatic chuck with reduced plasma penetration and arcing
US11/888,341 US9202736B2 (en) 2007-07-31 2007-07-31 Method for refurbishing an electrostatic chuck with reduced plasma penetration and arcing

Publications (3)

Publication Number Publication Date
JP2009065133A JP2009065133A (ja) 2009-03-26
JP2009065133A5 true JP2009065133A5 (enExample) 2011-09-15
JP5140516B2 JP5140516B2 (ja) 2013-02-06

Family

ID=40380622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008198466A Expired - Fee Related JP5140516B2 (ja) 2007-07-31 2008-07-31 プラズマ侵入及びアーキングを減少させた静電チャックを準備するための方法及び装置

Country Status (4)

Country Link
JP (1) JP5140516B2 (enExample)
KR (1) KR101125885B1 (enExample)
SG (1) SG149791A1 (enExample)
TW (2) TWI479597B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8336891B2 (en) * 2008-03-11 2012-12-25 Ngk Insulators, Ltd. Electrostatic chuck
US9728429B2 (en) 2010-07-27 2017-08-08 Lam Research Corporation Parasitic plasma prevention in plasma processing chambers
JP5984504B2 (ja) * 2012-05-21 2016-09-06 新光電気工業株式会社 静電チャック、静電チャックの製造方法
US10784139B2 (en) * 2016-12-16 2020-09-22 Applied Materials, Inc. Rotatable electrostatic chuck having backside gas supply
US11456161B2 (en) * 2018-06-04 2022-09-27 Applied Materials, Inc. Substrate support pedestal
JP7269759B2 (ja) * 2019-03-12 2023-05-09 新光電気工業株式会社 基板固定装置
CN112908919B (zh) * 2019-12-04 2024-07-09 中微半导体设备(上海)股份有限公司 静电吸盘装置及包括该静电吸盘装置的等离子体处理装置
US12288672B2 (en) * 2020-01-15 2025-04-29 Applied Materials, Inc. Methods and apparatus for carbon compound film deposition
US11887811B2 (en) * 2020-09-08 2024-01-30 Applied Materials, Inc. Semiconductor processing chambers for deposition and etch
US11699571B2 (en) 2020-09-08 2023-07-11 Applied Materials, Inc. Semiconductor processing chambers for deposition and etch
US20230238267A1 (en) * 2022-01-26 2023-07-27 Applied Materials, Inc. Methods for electrostatic chuck ceramic surfacing
JP7507812B2 (ja) * 2022-06-16 2024-06-28 日本特殊陶業株式会社 保持装置
WO2024034127A1 (ja) * 2022-08-12 2024-02-15 日本碍子株式会社 半導体製造装置用部材

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2106325A (en) * 1981-09-14 1983-04-07 Philips Electronic Associated Electrostatic chuck
US5792562A (en) * 1995-01-12 1998-08-11 Applied Materials, Inc. Electrostatic chuck with polymeric impregnation and method of making
US5644467A (en) * 1995-09-28 1997-07-01 Applied Materials, Inc. Method and structure for improving gas breakdown resistance and reducing the potential of arcing in a electrostatic chuck
US5720818A (en) * 1996-04-26 1998-02-24 Applied Materials, Inc. Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck
EP0803900A3 (en) * 1996-04-26 1999-12-29 Applied Materials, Inc. Surface preparation to enhance the adhesion of a dielectric layer
US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
US6263829B1 (en) * 1999-01-22 2001-07-24 Applied Materials, Inc. Process chamber having improved gas distributor and method of manufacture
US6500299B1 (en) * 1999-07-22 2002-12-31 Applied Materials Inc. Chamber having improved gas feed-through and method
JP3482949B2 (ja) * 2000-08-04 2004-01-06 松下電器産業株式会社 プラズマ処理方法及び装置
US6581275B2 (en) * 2001-01-22 2003-06-24 Applied Materials Inc. Fabricating an electrostatic chuck having plasma resistant gas conduits
TW502368B (en) * 2001-11-06 2002-09-11 Duratek Inc Electrostatic chuck and method for manufacturing the same
JP2004158751A (ja) * 2002-11-08 2004-06-03 Matsushita Electric Ind Co Ltd プラズマ処理装置
JP4421874B2 (ja) * 2003-10-31 2010-02-24 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
JP4364667B2 (ja) * 2004-02-13 2009-11-18 東京エレクトロン株式会社 溶射部材、電極、およびプラズマ処理装置

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