JP2009046734A - エピタキシャル膜形成用配向基板及びエピタキシャル膜形成用配向基板の表面改質方法 - Google Patents
エピタキシャル膜形成用配向基板及びエピタキシャル膜形成用配向基板の表面改質方法 Download PDFInfo
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- JP2009046734A JP2009046734A JP2007214364A JP2007214364A JP2009046734A JP 2009046734 A JP2009046734 A JP 2009046734A JP 2007214364 A JP2007214364 A JP 2007214364A JP 2007214364 A JP2007214364 A JP 2007214364A JP 2009046734 A JP2009046734 A JP 2009046734A
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- 239000000758 substrate Substances 0.000 title claims abstract description 79
- 230000015572 biosynthetic process Effects 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 115
- 239000002184 metal Substances 0.000 claims abstract description 114
- 239000010408 film Substances 0.000 claims abstract description 44
- 238000010438 heat treatment Methods 0.000 claims abstract description 22
- 239000010409 thin film Substances 0.000 claims abstract description 22
- 230000003746 surface roughness Effects 0.000 claims abstract description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 45
- 238000007747 plating Methods 0.000 claims description 23
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 22
- 229910052759 nickel Inorganic materials 0.000 claims description 22
- 239000013078 crystal Substances 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 17
- 229910052709 silver Inorganic materials 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 15
- 239000004332 silver Substances 0.000 claims description 15
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 12
- 229910052763 palladium Inorganic materials 0.000 claims description 11
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 230000000051 modifying effect Effects 0.000 claims description 6
- 229910052697 platinum Inorganic materials 0.000 claims description 6
- 229910000510 noble metal Inorganic materials 0.000 claims description 5
- 229910052703 rhodium Inorganic materials 0.000 claims description 5
- 239000010948 rhodium Substances 0.000 claims description 5
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052741 iridium Inorganic materials 0.000 claims description 4
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 238000012986 modification Methods 0.000 claims 1
- 230000004048 modification Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 89
- 230000006872 improvement Effects 0.000 description 20
- 239000000463 material Substances 0.000 description 16
- 230000000694 effects Effects 0.000 description 11
- 238000009499 grossing Methods 0.000 description 9
- 229910045601 alloy Inorganic materials 0.000 description 7
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- 230000000052 comparative effect Effects 0.000 description 2
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- 238000005238 degreasing Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
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- 239000010935 stainless steel Substances 0.000 description 2
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910000792 Monel Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- IYRDVAUFQZOLSB-UHFFFAOYSA-N copper iron Chemical compound [Fe].[Cu] IYRDVAUFQZOLSB-UHFFFAOYSA-N 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910000856 hastalloy Inorganic materials 0.000 description 1
- 229910001293 incoloy Inorganic materials 0.000 description 1
- 229910001026 inconel Inorganic materials 0.000 description 1
- 238000007737 ion beam deposition Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- 238000000984 pole figure measurement Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
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- 229910001220 stainless steel Inorganic materials 0.000 description 1
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- 238000005482 strain hardening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910021654 trace metal Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
- H10N60/0576—Processes for depositing or forming copper oxide superconductor layers characterised by the substrate
- H10N60/0632—Intermediate layers, e.g. for growth control
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
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- C25D5/48—After-treatment of electroplated surfaces
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
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- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
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- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
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- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
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- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
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Abstract
【解決手段】本発明は、少なくとも片面に配向化金属層を有するエピタキシャル膜形成用配向基板の表面上に金属薄膜からなり1〜5000nmの厚さの配向性改善層を備え、配向化金属層表面における配向度(Δφ及びΔω)と、配向性改善層表面における配向度(Δφ及びΔω)との差が、いずれも0.1〜3.0°であることを特徴とするエピタキシャル膜形成用配向基板である。また、この配向基板配向性改善層を構成する金属と異なる他の金属を、膜厚相当で30nm以下付加した後に熱処理を行うと、その表面の平滑性を改善することができる。このとき、基板表面の表面粗さは20nm以下となる。
【選択図】 図2
Description
"Biaxially textured copper and copper-iron alloy substrates for use inYBa[2]Cu[3]O[7][-][x]" (Superconductor science and technology ISSN0953-2048,2006,vol.19,pp.85-95) "Control of texture in Ag and Ag-alloy substrates for superconductingtapes" by T A Gladstone, JC Moore, B M Henry, S Speller, C J Salter, A JWilkinson and C R M Grovenor, Department of Materials, University of Oxford,Supecond. Sci.Techno. 13(2000) 1399-1407, printed in the UK
<配向性改善層の形成・検討>
まず、板厚1000μmのテープ状の銅板を用意し、これを圧延ロールで加工率95%に設定して、室温で冷間圧延し50μmのテープ材とした。圧延後、銅板を熱処理して結晶組織を配向化した。この熱処理は、窒素ガス95%と水素ガス5%とからなる雰囲気中で温度750℃、2時間加熱することにより行った。
次に、配向性改善層の平滑性の改善について検討した。上記でニッケル500nmをめっきした基板に、パラジウム、金、銀、白金、ロジウムをめっきした。めっき後、熱処理を行った。めっきはいずれも市販のめっき液を用い、浴温30〜50℃、電流密度1〜3A/dm2めっき時間を調整して膜厚相当の付加量を調整した。また、熱処理条件は、700℃で1時間とし、非酸化性雰囲気中で行った。
ここでは、第1実施形態と同様の銅基板について、他の金属(Ag、Au)をその厚さを変更しつつ配向性改善層として形成した。表2にその結果を示す。
Claims (15)
- 少なくとも片面に配向化金属層を有するエピタキシャル膜形成用配向基板において、
前記配向化金属層の表面上に、金属薄膜からなり1〜5000nmの厚さの配向性改善層を備え、
前記配向化金属層表面における配向度(Δφ及びΔω)と、前記配向性改善層表面における配向度(Δφ及びΔω)との差が、いずれも0.1〜3.0°であることを特徴とするエピタキシャル膜形成用配向基板。 - 配向性改善層を構成する金属は、配向化金属層と同一の結晶構造の金属である請求項1記載のエピタキシャル膜形成用配向基板。
- 配向性改善層を構成する金属は、配向化金属層と同一の結晶構造の金属であり、更に、格子定数が20%以下相違するものである請求項1又は請求項2記載のエピタキシャル膜形成用配向基板。
- 配向性改善層を構成する金属は、ニッケル、銅、銀、アルミニウム、金、白金、パラジウム、ロジウム、イリジウムである請求項1〜請求項3のいずれかに記載のエピタキシャル膜形成用配向基板。
- 配向性改善層は、エピタキシャル成長により形成されたものである請求項1〜請求項4のいずれかに記載のエピタキシャル膜形成用配向基板。
- 配向性改善層は、その表面粗さが20nm以下である請求項1〜請求項5のいずれかに記載のエピタキシャル膜形成用配向基板。
- 配向性改善層は、その表面に配向性改善層を構成する金属と異なる他の金属を含み、前記他の金属は、膜厚相当で30nm以下の量である請求項6記載のエピタキシャル膜形成用配向基板。
- 他の金属は、配向性改善層を構成する金属に対して固溶可能な金属である請求項7記載のエピタキシャル膜形成用配向基板。
- 他の金属は、貴金属である請求項7又は請求項8記載のエピタキシャル膜形成用配向基板。
- 少なくとも一面に配向化金属層を有するエピタキシャル膜形成用配向基板の表面改質方法であって、
前記配向化金属層の表面に1〜5000nmの厚さの金属薄膜をエピタキシャル成長させることにより、基板表面における配向度Δφ及びΔωを0.1〜3.0°低下させる方法。 - 金属薄膜の形成は、めっきによるものである請求項10記載のエピタキシャル膜形成用配向基板の表面改質方法。
- 金属薄膜表面に、前記金属薄膜を構成する金属と異なる他の金属を、膜厚相当で30nm以下付加した後、熱処理を行う請求項10又は請求項11記載のエピタキシャル膜形成用配向基板の表面改質方法。
- 他の金属の付加はめっきによるものである請求項12記載のエピタキシャル膜形成用配向基板の表面改質方法。
- 他の金属は、貴金属である請求項11〜請求項13のいずれかに記載のエピタキシャル膜形成用配向基板の表面改質方法。
- 熱処理温度を400℃以上で他の金属の融点以下とする請求項12〜請求項14のいずれかに記載のエピタキシャル膜形成用配向基板の表面改質方法。
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EP08012859.8A EP2028289B1 (en) | 2007-08-21 | 2008-07-16 | Textured substrate for epitaxial film formation and surface improving method of textured substrate for epitaxial film formation |
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