JP2009044600A - マイクロホン装置およびその製造方法 - Google Patents

マイクロホン装置およびその製造方法 Download PDF

Info

Publication number
JP2009044600A
JP2009044600A JP2007209123A JP2007209123A JP2009044600A JP 2009044600 A JP2009044600 A JP 2009044600A JP 2007209123 A JP2007209123 A JP 2007209123A JP 2007209123 A JP2007209123 A JP 2007209123A JP 2009044600 A JP2009044600 A JP 2009044600A
Authority
JP
Japan
Prior art keywords
microphone device
sound
case
manufacturing
signal processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007209123A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009044600A5 (https=
Inventor
Yasuo Otsuka
泰雄 大塚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to JP2007209123A priority Critical patent/JP2009044600A/ja
Priority to CN200880020602A priority patent/CN101690255A/zh
Priority to PCT/JP2008/002181 priority patent/WO2009022459A1/ja
Publication of JP2009044600A publication Critical patent/JP2009044600A/ja
Publication of JP2009044600A5 publication Critical patent/JP2009044600A5/ja
Priority to US12/610,811 priority patent/US20100119097A1/en
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/02Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04Structural association of microphone with electric circuitry therefor
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/005Electrostatic transducers using semiconductor materials
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10General applications
    • H04R2499/11Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Circuit For Audible Band Transducer (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
JP2007209123A 2007-08-10 2007-08-10 マイクロホン装置およびその製造方法 Pending JP2009044600A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007209123A JP2009044600A (ja) 2007-08-10 2007-08-10 マイクロホン装置およびその製造方法
CN200880020602A CN101690255A (zh) 2007-08-10 2008-08-08 麦克风设备及其制造方法
PCT/JP2008/002181 WO2009022459A1 (ja) 2007-08-10 2008-08-08 マイクロホン装置およびその製造方法
US12/610,811 US20100119097A1 (en) 2007-08-10 2009-11-02 Microphone device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007209123A JP2009044600A (ja) 2007-08-10 2007-08-10 マイクロホン装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2009044600A true JP2009044600A (ja) 2009-02-26
JP2009044600A5 JP2009044600A5 (https=) 2009-06-18

Family

ID=40350517

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007209123A Pending JP2009044600A (ja) 2007-08-10 2007-08-10 マイクロホン装置およびその製造方法

Country Status (4)

Country Link
US (1) US20100119097A1 (https=)
JP (1) JP2009044600A (https=)
CN (1) CN101690255A (https=)
WO (1) WO2009022459A1 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012039616A (ja) * 2010-08-06 2012-02-23 Research In Motion Ltd モバイル電子デバイスにおけるマイクロホンのための電磁遮蔽および音響室
US8340735B2 (en) 2010-08-06 2012-12-25 Research In Motion Limited Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device
JP2016500501A (ja) * 2012-12-18 2016-01-12 エプコス アクチエンゲゼルシャフトEpcos Ag トップポートmemsマイクロフォン及びその製造方法
JP2019145934A (ja) * 2018-02-19 2019-08-29 新日本無線株式会社 Memsトランスデューサ装置及びその製造方法
JP2021015045A (ja) * 2019-07-12 2021-02-12 新日本無線株式会社 音波センサの製造方法

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8450817B2 (en) * 2008-08-14 2013-05-28 Knowles Electronics Llc Microelectromechanical system package with strain relief bridge
US20110254111A1 (en) * 2010-04-19 2011-10-20 Avago Technologies Wireless Ip (Singapore) Pte. Ltd Packaged acoustic transducer device with shielding from electromagnetic interference
US9420378B1 (en) 2010-07-12 2016-08-16 Amkor Technology, Inc. Top port MEMS microphone package and method
JP5636795B2 (ja) * 2010-08-02 2014-12-10 船井電機株式会社 マイクロホンユニット
DE112010006098T5 (de) * 2010-12-28 2014-03-20 Knowles Electronics, Llc Package mit einem unter einem MEMS-Chip angeordneten CMOS-Chip
US20120161258A1 (en) 2010-12-28 2012-06-28 Loeppert Peter V Package with a cmos die positioned underneath a mems die
JP5721452B2 (ja) * 2011-01-27 2015-05-20 ローム株式会社 静電容量型memsセンサ
US8618619B1 (en) 2011-01-28 2013-12-31 Amkor Technology, Inc. Top port with interposer MEMS microphone package and method
US9013011B1 (en) 2011-03-11 2015-04-21 Amkor Technology, Inc. Stacked and staggered die MEMS package and method
US8536663B1 (en) * 2011-04-28 2013-09-17 Amkor Technology, Inc. Metal mesh lid MEMS package and method
US9078063B2 (en) * 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
US8724841B2 (en) * 2012-08-30 2014-05-13 Apple Inc. Microphone with acoustic mesh to protect against sudden acoustic shock
US20140071594A1 (en) * 2012-09-07 2014-03-13 Sawyer I. Cohen Components Having Breakaway Installation Handles
CN103974170B (zh) * 2013-02-06 2018-06-22 宏达国际电子股份有限公司 多传感器录音装置与方法
US9294839B2 (en) 2013-03-01 2016-03-22 Clearone, Inc. Augmentation of a beamforming microphone array with non-beamforming microphones
DE112015004268T5 (de) * 2014-09-19 2017-11-02 Murata Manufacturing Co., Ltd. Drucksensormodul
US9565493B2 (en) 2015-04-30 2017-02-07 Shure Acquisition Holdings, Inc. Array microphone system and method of assembling the same
US9554207B2 (en) 2015-04-30 2017-01-24 Shure Acquisition Holdings, Inc. Offset cartridge microphones
CN106210968B (zh) * 2016-08-29 2019-06-07 陈立康 一种全息立体拾音器
CN106358129B (zh) * 2016-08-29 2019-06-11 陈立康 一种全息立体扬声器
US20180077477A1 (en) * 2016-09-15 2018-03-15 Nokia Technologies Oy Porous audio device housing
US10367948B2 (en) 2017-01-13 2019-07-30 Shure Acquisition Holdings, Inc. Post-mixing acoustic echo cancellation systems and methods
GB2561020B (en) * 2017-03-30 2020-04-22 Cirrus Logic Int Semiconductor Ltd Apparatus and methods for monitoring a microphone
CN107222821B (zh) * 2017-06-09 2019-09-17 京东方科技集团股份有限公司 复合电极、使用其的声学传感器及制造方法
US11769510B2 (en) 2017-09-29 2023-09-26 Cirrus Logic Inc. Microphone authentication
GB2567018B (en) 2017-09-29 2020-04-01 Cirrus Logic Int Semiconductor Ltd Microphone authentication
CN212572960U (zh) * 2017-12-28 2021-02-19 美商楼氏电子有限公司 传感器、麦克风和电子装置
EP3804356A1 (en) 2018-06-01 2021-04-14 Shure Acquisition Holdings, Inc. Pattern-forming microphone array
US11297423B2 (en) 2018-06-15 2022-04-05 Shure Acquisition Holdings, Inc. Endfire linear array microphone
EP3854108B1 (en) 2018-09-20 2025-10-22 Shure Acquisition Holdings, Inc. Adjustable lobe shape for array microphones
CN109171700B (zh) * 2018-10-11 2021-12-28 南京大学 一种生理电检测用屏蔽有源电极
EP3942842B1 (en) 2019-03-21 2026-03-11 Shure Acquisition Holdings, Inc. Housings and associated design features for ceiling array microphones
US11558693B2 (en) 2019-03-21 2023-01-17 Shure Acquisition Holdings, Inc. Auto focus, auto focus within regions, and auto placement of beamformed microphone lobes with inhibition and voice activity detection functionality
JP7572964B2 (ja) 2019-03-21 2024-10-24 シュアー アクイジッション ホールディングス インコーポレイテッド 阻止機能を伴うビーム形成マイクロフォンローブの自動集束、領域内自動集束、および自動配置
CN114051738B (zh) 2019-05-23 2024-10-01 舒尔获得控股公司 可操纵扬声器阵列、系统及其方法
US11302347B2 (en) 2019-05-31 2022-04-12 Shure Acquisition Holdings, Inc. Low latency automixer integrated with voice and noise activity detection
US20220266367A1 (en) * 2019-07-26 2022-08-25 Origin Company, Limited Soldered product manufacturing device and method for manufacturing soldered product
EP4018680B1 (en) 2019-08-23 2026-04-29 Shure Acquisition Holdings, Inc. Two-dimensional microphone array with improved directivity
US11805342B2 (en) 2019-09-22 2023-10-31 xMEMS Labs, Inc. Sound producing package structure and manufacturing method thereof
US12028678B2 (en) 2019-11-01 2024-07-02 Shure Acquisition Holdings, Inc. Proximity microphone
US11395073B2 (en) 2020-04-18 2022-07-19 xMEMS Labs, Inc. Sound producing package structure and method for packaging sound producing package structure
US11252511B2 (en) 2019-12-27 2022-02-15 xMEMS Labs, Inc. Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus
US11057716B1 (en) * 2019-12-27 2021-07-06 xMEMS Labs, Inc. Sound producing device
US11552611B2 (en) 2020-02-07 2023-01-10 Shure Acquisition Holdings, Inc. System and method for automatic adjustment of reference gain
US11172300B2 (en) * 2020-02-07 2021-11-09 xMEMS Labs, Inc. Sound producing device
US11304005B2 (en) 2020-02-07 2022-04-12 xMEMS Labs, Inc. Crossover circuit
USD944776S1 (en) 2020-05-05 2022-03-01 Shure Acquisition Holdings, Inc. Audio device
WO2021243368A2 (en) 2020-05-29 2021-12-02 Shure Acquisition Holdings, Inc. Transducer steering and configuration systems and methods using a local positioning system
US11323823B1 (en) * 2021-01-18 2022-05-03 Knowles Electronics, Llc MEMS device with a diaphragm having a slotted layer
US11785380B2 (en) 2021-01-28 2023-10-10 Shure Acquisition Holdings, Inc. Hybrid audio beamforming system
US12452584B2 (en) 2021-01-29 2025-10-21 Shure Acquisition Holdings, Inc. Scalable conferencing systems and methods
US12542123B2 (en) 2021-08-31 2026-02-03 Shure Acquisition Holdings, Inc. Mask non-linear processor for acoustic echo cancellation
CN118216161A (zh) 2021-10-04 2024-06-18 舒尔获得控股公司 联网自动混合器系统及方法
WO2023060082A1 (en) 2021-10-05 2023-04-13 Shure Acquisition Holdings, Inc. Microphone assembly, filter for microphone, process for assembly and manufacturing microphone and filter for microphone, and method for filtering microphone
EP4427465A1 (en) 2021-11-05 2024-09-11 Shure Acquisition Holdings, Inc. Distributed algorithm for automixing speech over wireless networks
WO2023133513A1 (en) 2022-01-07 2023-07-13 Shure Acquisition Holdings, Inc. Audio beamforming with nulling control system and methods
US12598261B2 (en) 2022-09-28 2026-04-07 Shure Acquisition Holdings, Inc. Wideband doubletalk detection for optimization of acoustic echo cancellation

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2694462A (en) * 1951-09-19 1954-11-16 Robbins Frank Acoustic system for loud-speakers
JP3861006B2 (ja) * 2000-04-26 2006-12-20 ホシデン株式会社 半導体エレクトレットコンデンサマイクロホン
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
US7434305B2 (en) * 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US7439616B2 (en) * 2000-11-28 2008-10-21 Knowles Electronics, Llc Miniature silicon condenser microphone
US7166910B2 (en) * 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
US7022546B2 (en) * 2000-12-05 2006-04-04 Analog Devices, Inc. Method and device for protecting micro electromechanical systems structures during dicing of a wafer
US7298856B2 (en) * 2001-09-05 2007-11-20 Nippon Hoso Kyokai Chip microphone and method of making same
US7146016B2 (en) * 2001-11-27 2006-12-05 Center For National Research Initiatives Miniature condenser microphone and fabrication method therefor
ATE493226T1 (de) * 2002-03-12 2011-01-15 Hamamatsu Photonics Kk Verfahren zum schneiden eines bearbeiteten objekts
US7135070B2 (en) * 2002-04-23 2006-11-14 Sharp Laboratories Of America, Inc. Monolithic stacked/layered crystal-structure-processed mechanical, and combined mechanical and electrical, devices and methods and systems for making
US7039593B2 (en) * 2002-06-20 2006-05-02 Robert David Sager Payment convergence system and method
US6822326B2 (en) * 2002-09-25 2004-11-23 Ziptronix Wafer bonding hermetic encapsulation
JP2004328232A (ja) * 2003-04-23 2004-11-18 Matsushita Electric Ind Co Ltd 風防兼静電遮蔽機能付きマイクロホン及びこれに用いる風防兼静電遮蔽スクリーン
JP2005039652A (ja) * 2003-07-17 2005-02-10 Hosiden Corp 音響検出機構
JP4191555B2 (ja) * 2003-07-29 2008-12-03 シチズン電子株式会社 動電型発音体の製造方法
JP2007500941A (ja) * 2003-07-31 2007-01-18 エフエスアイ インターナショナル インコーポレイテッド 高度に均一な酸化物層、とりわけ超薄層の調節された成長
US6936524B2 (en) * 2003-11-05 2005-08-30 Akustica, Inc. Ultrathin form factor MEMS microphones and microspeakers
JP3875240B2 (ja) * 2004-03-31 2007-01-31 株式会社東芝 電子部品の製造方法
US7155024B2 (en) * 2004-12-13 2006-12-26 Taiwan Carol Electronics Co., Ltd. Microphone
JP4560424B2 (ja) * 2005-02-24 2010-10-13 株式会社オーディオテクニカ コンデンサマイクロホン
US7334901B2 (en) * 2005-04-22 2008-02-26 Ostendo Technologies, Inc. Low profile, large screen display using a rear projection array system
US20060280319A1 (en) * 2005-06-08 2006-12-14 General Mems Corporation Micromachined Capacitive Microphone
JP2007006149A (ja) * 2005-06-23 2007-01-11 Hosiden Corp 電子部品
US7202552B2 (en) * 2005-07-15 2007-04-10 Silicon Matrix Pte. Ltd. MEMS package using flexible substrates, and method thereof
JP4701032B2 (ja) * 2005-07-28 2011-06-15 日本製紙株式会社 印刷用紙の裏抜け評価方法及び評価装置
SG130158A1 (en) * 2005-08-20 2007-03-20 Bse Co Ltd Silicon based condenser microphone and packaging method for the same
JP4655017B2 (ja) * 2005-11-25 2011-03-23 パナソニック電工株式会社 音響センサ
JP4787648B2 (ja) * 2006-03-29 2011-10-05 パナソニック株式会社 コンデンサマイクロホンの製造方法およびコンデンサマイクロホン
WO2007136706A1 (en) * 2006-05-17 2007-11-29 Qualcomm Mems Technologies Inc. Desiccant in a mems device
US8005250B2 (en) * 2007-12-21 2011-08-23 Josephson Engineering, Inc. Microphone housing

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012039616A (ja) * 2010-08-06 2012-02-23 Research In Motion Ltd モバイル電子デバイスにおけるマイクロホンのための電磁遮蔽および音響室
US8340735B2 (en) 2010-08-06 2012-12-25 Research In Motion Limited Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device
US8918150B2 (en) 2010-08-06 2014-12-23 Blackberry Limited Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device
JP2016500501A (ja) * 2012-12-18 2016-01-12 エプコス アクチエンゲゼルシャフトEpcos Ag トップポートmemsマイクロフォン及びその製造方法
US10136226B2 (en) 2012-12-18 2018-11-20 Tdk Corporation Top-port MEMS microphone and method of manufacturing the same
JP2019145934A (ja) * 2018-02-19 2019-08-29 新日本無線株式会社 Memsトランスデューサ装置及びその製造方法
JP2021015045A (ja) * 2019-07-12 2021-02-12 新日本無線株式会社 音波センサの製造方法
JP7283695B2 (ja) 2019-07-12 2023-05-30 日清紡マイクロデバイス株式会社 音波センサの製造方法

Also Published As

Publication number Publication date
WO2009022459A1 (ja) 2009-02-19
CN101690255A (zh) 2010-03-31
US20100119097A1 (en) 2010-05-13

Similar Documents

Publication Publication Date Title
JP2009044600A (ja) マイクロホン装置およびその製造方法
US11968487B2 (en) Adapters for microphones and combinations thereof
US9264815B2 (en) Silicon condenser microphone
JP5434798B2 (ja) マイクロホンユニット、及び、それを備えた音声入力装置
JP5636796B2 (ja) マイクロホンユニット
JP5325555B2 (ja) マイクロホンユニット
JP5200737B2 (ja) 差動マイクロホンユニット
US20110135122A1 (en) Microphone
KR101612851B1 (ko) 초소형 보청기
JP2010187076A (ja) マイクロホンユニット
KR20100065123A (ko) 음성입력장치
TW201034474A (en) Microphone unit and voice input device equipped with the same
CN102308593A (zh) 麦克风单元
US20150189443A1 (en) Silicon Condenser Microphone
JP5636795B2 (ja) マイクロホンユニット
JP2004128957A (ja) 音響検出機構
JP5402320B2 (ja) マイクロホンユニット
JP5097603B2 (ja) マイクロホンユニット
JP2008211466A (ja) マイクロホン用パッケージ、マイクロホン搭載体、マイクロホン装置
US9420365B2 (en) Silicon condenser microphone
KR100464700B1 (ko) 지향성 콘덴서 마이크로폰
JP2006332799A (ja) 音響センサ
KR100629688B1 (ko) 전면음 단일지향성 마이크로폰
JP2009135661A (ja) マイクロフォンユニット及びその製造方法並びに音声入力装置
JP2006325034A (ja) 音響センサ

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090428

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20090428

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20090430

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20090521

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090526

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090724

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20091014

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100114

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20100127

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20100312