WO2009022459A1 - マイクロホン装置およびその製造方法 - Google Patents
マイクロホン装置およびその製造方法 Download PDFInfo
- Publication number
- WO2009022459A1 WO2009022459A1 PCT/JP2008/002181 JP2008002181W WO2009022459A1 WO 2009022459 A1 WO2009022459 A1 WO 2009022459A1 JP 2008002181 W JP2008002181 W JP 2008002181W WO 2009022459 A1 WO2009022459 A1 WO 2009022459A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sound pickup
- microphone apparatus
- pickup element
- processing section
- signal processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Circuit For Audible Band Transducer (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200880020602A CN101690255A (zh) | 2007-08-10 | 2008-08-08 | 麦克风设备及其制造方法 |
| US12/610,811 US20100119097A1 (en) | 2007-08-10 | 2009-11-02 | Microphone device and manufacturing method thereof |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007209123A JP2009044600A (ja) | 2007-08-10 | 2007-08-10 | マイクロホン装置およびその製造方法 |
| JP2007-209123 | 2007-08-10 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US12/610,811 Continuation US20100119097A1 (en) | 2007-08-10 | 2009-11-02 | Microphone device and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2009022459A1 true WO2009022459A1 (ja) | 2009-02-19 |
Family
ID=40350517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2008/002181 Ceased WO2009022459A1 (ja) | 2007-08-10 | 2008-08-08 | マイクロホン装置およびその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20100119097A1 (https=) |
| JP (1) | JP2009044600A (https=) |
| CN (1) | CN101690255A (https=) |
| WO (1) | WO2009022459A1 (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8536663B1 (en) * | 2011-04-28 | 2013-09-17 | Amkor Technology, Inc. | Metal mesh lid MEMS package and method |
| JP2015530030A (ja) * | 2012-08-10 | 2015-10-08 | ノールズ エレクトロニクス,リミテッド ライアビリティ カンパニー | 汚染物質の浸入を防ぐためのバリアを備えたマイクアセンブリ |
| US10136226B2 (en) | 2012-12-18 | 2018-11-20 | Tdk Corporation | Top-port MEMS microphone and method of manufacturing the same |
Families Citing this family (59)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8450817B2 (en) * | 2008-08-14 | 2013-05-28 | Knowles Electronics Llc | Microelectromechanical system package with strain relief bridge |
| US20110254111A1 (en) * | 2010-04-19 | 2011-10-20 | Avago Technologies Wireless Ip (Singapore) Pte. Ltd | Packaged acoustic transducer device with shielding from electromagnetic interference |
| US9420378B1 (en) | 2010-07-12 | 2016-08-16 | Amkor Technology, Inc. | Top port MEMS microphone package and method |
| JP5636795B2 (ja) * | 2010-08-02 | 2014-12-10 | 船井電機株式会社 | マイクロホンユニット |
| EP2416544B1 (en) * | 2010-08-06 | 2015-04-29 | BlackBerry Limited | Electromagnetic Shielding and an Acoustic Chamber for a Microphone in a Mobile Electronic Device |
| US8340735B2 (en) | 2010-08-06 | 2012-12-25 | Research In Motion Limited | Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device |
| DE112010006098T5 (de) * | 2010-12-28 | 2014-03-20 | Knowles Electronics, Llc | Package mit einem unter einem MEMS-Chip angeordneten CMOS-Chip |
| US20120161258A1 (en) | 2010-12-28 | 2012-06-28 | Loeppert Peter V | Package with a cmos die positioned underneath a mems die |
| JP5721452B2 (ja) * | 2011-01-27 | 2015-05-20 | ローム株式会社 | 静電容量型memsセンサ |
| US8618619B1 (en) | 2011-01-28 | 2013-12-31 | Amkor Technology, Inc. | Top port with interposer MEMS microphone package and method |
| US9013011B1 (en) | 2011-03-11 | 2015-04-21 | Amkor Technology, Inc. | Stacked and staggered die MEMS package and method |
| US8724841B2 (en) * | 2012-08-30 | 2014-05-13 | Apple Inc. | Microphone with acoustic mesh to protect against sudden acoustic shock |
| US20140071594A1 (en) * | 2012-09-07 | 2014-03-13 | Sawyer I. Cohen | Components Having Breakaway Installation Handles |
| CN103974170B (zh) * | 2013-02-06 | 2018-06-22 | 宏达国际电子股份有限公司 | 多传感器录音装置与方法 |
| US9294839B2 (en) | 2013-03-01 | 2016-03-22 | Clearone, Inc. | Augmentation of a beamforming microphone array with non-beamforming microphones |
| DE112015004268T5 (de) * | 2014-09-19 | 2017-11-02 | Murata Manufacturing Co., Ltd. | Drucksensormodul |
| US9565493B2 (en) | 2015-04-30 | 2017-02-07 | Shure Acquisition Holdings, Inc. | Array microphone system and method of assembling the same |
| US9554207B2 (en) | 2015-04-30 | 2017-01-24 | Shure Acquisition Holdings, Inc. | Offset cartridge microphones |
| CN106210968B (zh) * | 2016-08-29 | 2019-06-07 | 陈立康 | 一种全息立体拾音器 |
| CN106358129B (zh) * | 2016-08-29 | 2019-06-11 | 陈立康 | 一种全息立体扬声器 |
| US20180077477A1 (en) * | 2016-09-15 | 2018-03-15 | Nokia Technologies Oy | Porous audio device housing |
| US10367948B2 (en) | 2017-01-13 | 2019-07-30 | Shure Acquisition Holdings, Inc. | Post-mixing acoustic echo cancellation systems and methods |
| GB2561020B (en) * | 2017-03-30 | 2020-04-22 | Cirrus Logic Int Semiconductor Ltd | Apparatus and methods for monitoring a microphone |
| CN107222821B (zh) * | 2017-06-09 | 2019-09-17 | 京东方科技集团股份有限公司 | 复合电极、使用其的声学传感器及制造方法 |
| US11769510B2 (en) | 2017-09-29 | 2023-09-26 | Cirrus Logic Inc. | Microphone authentication |
| GB2567018B (en) | 2017-09-29 | 2020-04-01 | Cirrus Logic Int Semiconductor Ltd | Microphone authentication |
| CN212572960U (zh) * | 2017-12-28 | 2021-02-19 | 美商楼氏电子有限公司 | 传感器、麦克风和电子装置 |
| JP2019145934A (ja) * | 2018-02-19 | 2019-08-29 | 新日本無線株式会社 | Memsトランスデューサ装置及びその製造方法 |
| EP3804356A1 (en) | 2018-06-01 | 2021-04-14 | Shure Acquisition Holdings, Inc. | Pattern-forming microphone array |
| US11297423B2 (en) | 2018-06-15 | 2022-04-05 | Shure Acquisition Holdings, Inc. | Endfire linear array microphone |
| EP3854108B1 (en) | 2018-09-20 | 2025-10-22 | Shure Acquisition Holdings, Inc. | Adjustable lobe shape for array microphones |
| CN109171700B (zh) * | 2018-10-11 | 2021-12-28 | 南京大学 | 一种生理电检测用屏蔽有源电极 |
| EP3942842B1 (en) | 2019-03-21 | 2026-03-11 | Shure Acquisition Holdings, Inc. | Housings and associated design features for ceiling array microphones |
| US11558693B2 (en) | 2019-03-21 | 2023-01-17 | Shure Acquisition Holdings, Inc. | Auto focus, auto focus within regions, and auto placement of beamformed microphone lobes with inhibition and voice activity detection functionality |
| JP7572964B2 (ja) | 2019-03-21 | 2024-10-24 | シュアー アクイジッション ホールディングス インコーポレイテッド | 阻止機能を伴うビーム形成マイクロフォンローブの自動集束、領域内自動集束、および自動配置 |
| CN114051738B (zh) | 2019-05-23 | 2024-10-01 | 舒尔获得控股公司 | 可操纵扬声器阵列、系统及其方法 |
| US11302347B2 (en) | 2019-05-31 | 2022-04-12 | Shure Acquisition Holdings, Inc. | Low latency automixer integrated with voice and noise activity detection |
| JP7283695B2 (ja) * | 2019-07-12 | 2023-05-30 | 日清紡マイクロデバイス株式会社 | 音波センサの製造方法 |
| US20220266367A1 (en) * | 2019-07-26 | 2022-08-25 | Origin Company, Limited | Soldered product manufacturing device and method for manufacturing soldered product |
| EP4018680B1 (en) | 2019-08-23 | 2026-04-29 | Shure Acquisition Holdings, Inc. | Two-dimensional microphone array with improved directivity |
| US11805342B2 (en) | 2019-09-22 | 2023-10-31 | xMEMS Labs, Inc. | Sound producing package structure and manufacturing method thereof |
| US12028678B2 (en) | 2019-11-01 | 2024-07-02 | Shure Acquisition Holdings, Inc. | Proximity microphone |
| US11395073B2 (en) | 2020-04-18 | 2022-07-19 | xMEMS Labs, Inc. | Sound producing package structure and method for packaging sound producing package structure |
| US11252511B2 (en) | 2019-12-27 | 2022-02-15 | xMEMS Labs, Inc. | Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus |
| US11057716B1 (en) * | 2019-12-27 | 2021-07-06 | xMEMS Labs, Inc. | Sound producing device |
| US11552611B2 (en) | 2020-02-07 | 2023-01-10 | Shure Acquisition Holdings, Inc. | System and method for automatic adjustment of reference gain |
| US11172300B2 (en) * | 2020-02-07 | 2021-11-09 | xMEMS Labs, Inc. | Sound producing device |
| US11304005B2 (en) | 2020-02-07 | 2022-04-12 | xMEMS Labs, Inc. | Crossover circuit |
| USD944776S1 (en) | 2020-05-05 | 2022-03-01 | Shure Acquisition Holdings, Inc. | Audio device |
| WO2021243368A2 (en) | 2020-05-29 | 2021-12-02 | Shure Acquisition Holdings, Inc. | Transducer steering and configuration systems and methods using a local positioning system |
| US11323823B1 (en) * | 2021-01-18 | 2022-05-03 | Knowles Electronics, Llc | MEMS device with a diaphragm having a slotted layer |
| US11785380B2 (en) | 2021-01-28 | 2023-10-10 | Shure Acquisition Holdings, Inc. | Hybrid audio beamforming system |
| US12452584B2 (en) | 2021-01-29 | 2025-10-21 | Shure Acquisition Holdings, Inc. | Scalable conferencing systems and methods |
| US12542123B2 (en) | 2021-08-31 | 2026-02-03 | Shure Acquisition Holdings, Inc. | Mask non-linear processor for acoustic echo cancellation |
| CN118216161A (zh) | 2021-10-04 | 2024-06-18 | 舒尔获得控股公司 | 联网自动混合器系统及方法 |
| WO2023060082A1 (en) | 2021-10-05 | 2023-04-13 | Shure Acquisition Holdings, Inc. | Microphone assembly, filter for microphone, process for assembly and manufacturing microphone and filter for microphone, and method for filtering microphone |
| EP4427465A1 (en) | 2021-11-05 | 2024-09-11 | Shure Acquisition Holdings, Inc. | Distributed algorithm for automixing speech over wireless networks |
| WO2023133513A1 (en) | 2022-01-07 | 2023-07-13 | Shure Acquisition Holdings, Inc. | Audio beamforming with nulling control system and methods |
| US12598261B2 (en) | 2022-09-28 | 2026-04-07 | Shure Acquisition Holdings, Inc. | Wideband doubletalk detection for optimization of acoustic echo cancellation |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004328232A (ja) * | 2003-04-23 | 2004-11-18 | Matsushita Electric Ind Co Ltd | 風防兼静電遮蔽機能付きマイクロホン及びこれに用いる風防兼静電遮蔽スクリーン |
| JP2004537182A (ja) * | 2000-11-28 | 2004-12-09 | ノウレス エレクトロニクス, リミテッド ライアビリティ カンパニー | 小型シリコンコンデンサマイクロフォンおよびその製造方法 |
| JP2005051293A (ja) * | 2003-07-29 | 2005-02-24 | Citizen Electronics Co Ltd | 動電型発音体の製造方法 |
| JP2006237921A (ja) * | 2005-02-24 | 2006-09-07 | Audio Technica Corp | コンデンサマイクロホン |
| JP2007006149A (ja) * | 2005-06-23 | 2007-01-11 | Hosiden Corp | 電子部品 |
| JP2007060661A (ja) * | 2005-08-20 | 2007-03-08 | Bse Co Ltd | シリコンコンデンサマイクロホン及びシリコンコンデンサマイクロホンのパッケージング方法 |
| JP2007174622A (ja) * | 2005-11-25 | 2007-07-05 | Matsushita Electric Works Ltd | 音響センサ |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2694462A (en) * | 1951-09-19 | 1954-11-16 | Robbins Frank | Acoustic system for loud-speakers |
| JP3861006B2 (ja) * | 2000-04-26 | 2006-12-20 | ホシデン株式会社 | 半導体エレクトレットコンデンサマイクロホン |
| JP4659300B2 (ja) * | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
| US7434305B2 (en) * | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
| US7439616B2 (en) * | 2000-11-28 | 2008-10-21 | Knowles Electronics, Llc | Miniature silicon condenser microphone |
| US7022546B2 (en) * | 2000-12-05 | 2006-04-04 | Analog Devices, Inc. | Method and device for protecting micro electromechanical systems structures during dicing of a wafer |
| US7298856B2 (en) * | 2001-09-05 | 2007-11-20 | Nippon Hoso Kyokai | Chip microphone and method of making same |
| US7146016B2 (en) * | 2001-11-27 | 2006-12-05 | Center For National Research Initiatives | Miniature condenser microphone and fabrication method therefor |
| ATE493226T1 (de) * | 2002-03-12 | 2011-01-15 | Hamamatsu Photonics Kk | Verfahren zum schneiden eines bearbeiteten objekts |
| US7135070B2 (en) * | 2002-04-23 | 2006-11-14 | Sharp Laboratories Of America, Inc. | Monolithic stacked/layered crystal-structure-processed mechanical, and combined mechanical and electrical, devices and methods and systems for making |
| US7039593B2 (en) * | 2002-06-20 | 2006-05-02 | Robert David Sager | Payment convergence system and method |
| US6822326B2 (en) * | 2002-09-25 | 2004-11-23 | Ziptronix | Wafer bonding hermetic encapsulation |
| JP2005039652A (ja) * | 2003-07-17 | 2005-02-10 | Hosiden Corp | 音響検出機構 |
| JP2007500941A (ja) * | 2003-07-31 | 2007-01-18 | エフエスアイ インターナショナル インコーポレイテッド | 高度に均一な酸化物層、とりわけ超薄層の調節された成長 |
| US6936524B2 (en) * | 2003-11-05 | 2005-08-30 | Akustica, Inc. | Ultrathin form factor MEMS microphones and microspeakers |
| JP3875240B2 (ja) * | 2004-03-31 | 2007-01-31 | 株式会社東芝 | 電子部品の製造方法 |
| US7155024B2 (en) * | 2004-12-13 | 2006-12-26 | Taiwan Carol Electronics Co., Ltd. | Microphone |
| US7334901B2 (en) * | 2005-04-22 | 2008-02-26 | Ostendo Technologies, Inc. | Low profile, large screen display using a rear projection array system |
| US20060280319A1 (en) * | 2005-06-08 | 2006-12-14 | General Mems Corporation | Micromachined Capacitive Microphone |
| US7202552B2 (en) * | 2005-07-15 | 2007-04-10 | Silicon Matrix Pte. Ltd. | MEMS package using flexible substrates, and method thereof |
| JP4701032B2 (ja) * | 2005-07-28 | 2011-06-15 | 日本製紙株式会社 | 印刷用紙の裏抜け評価方法及び評価装置 |
| JP4787648B2 (ja) * | 2006-03-29 | 2011-10-05 | パナソニック株式会社 | コンデンサマイクロホンの製造方法およびコンデンサマイクロホン |
| WO2007136706A1 (en) * | 2006-05-17 | 2007-11-29 | Qualcomm Mems Technologies Inc. | Desiccant in a mems device |
| US8005250B2 (en) * | 2007-12-21 | 2011-08-23 | Josephson Engineering, Inc. | Microphone housing |
-
2007
- 2007-08-10 JP JP2007209123A patent/JP2009044600A/ja active Pending
-
2008
- 2008-08-08 WO PCT/JP2008/002181 patent/WO2009022459A1/ja not_active Ceased
- 2008-08-08 CN CN200880020602A patent/CN101690255A/zh active Pending
-
2009
- 2009-11-02 US US12/610,811 patent/US20100119097A1/en not_active Abandoned
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004537182A (ja) * | 2000-11-28 | 2004-12-09 | ノウレス エレクトロニクス, リミテッド ライアビリティ カンパニー | 小型シリコンコンデンサマイクロフォンおよびその製造方法 |
| JP2004328232A (ja) * | 2003-04-23 | 2004-11-18 | Matsushita Electric Ind Co Ltd | 風防兼静電遮蔽機能付きマイクロホン及びこれに用いる風防兼静電遮蔽スクリーン |
| JP2005051293A (ja) * | 2003-07-29 | 2005-02-24 | Citizen Electronics Co Ltd | 動電型発音体の製造方法 |
| JP2006237921A (ja) * | 2005-02-24 | 2006-09-07 | Audio Technica Corp | コンデンサマイクロホン |
| JP2007006149A (ja) * | 2005-06-23 | 2007-01-11 | Hosiden Corp | 電子部品 |
| JP2007060661A (ja) * | 2005-08-20 | 2007-03-08 | Bse Co Ltd | シリコンコンデンサマイクロホン及びシリコンコンデンサマイクロホンのパッケージング方法 |
| JP2007174622A (ja) * | 2005-11-25 | 2007-07-05 | Matsushita Electric Works Ltd | 音響センサ |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8536663B1 (en) * | 2011-04-28 | 2013-09-17 | Amkor Technology, Inc. | Metal mesh lid MEMS package and method |
| US9162871B1 (en) | 2011-04-28 | 2015-10-20 | Amkor Technology, Inc. | Metal mesh lid MEMS package and method |
| JP2015530030A (ja) * | 2012-08-10 | 2015-10-08 | ノールズ エレクトロニクス,リミテッド ライアビリティ カンパニー | 汚染物質の浸入を防ぐためのバリアを備えたマイクアセンブリ |
| US10136226B2 (en) | 2012-12-18 | 2018-11-20 | Tdk Corporation | Top-port MEMS microphone and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009044600A (ja) | 2009-02-26 |
| CN101690255A (zh) | 2010-03-31 |
| US20100119097A1 (en) | 2010-05-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2009022459A1 (ja) | マイクロホン装置およびその製造方法 | |
| US8731220B2 (en) | MEMS microphone | |
| WO2010036321A3 (en) | Self-steering directional hearing aid and method of operation thereof | |
| JP5201598B2 (ja) | コンデンサマイクロホン | |
| US10057687B2 (en) | Speaker structure | |
| WO2009022330A3 (en) | Dynamically variable filter | |
| ATE524933T1 (de) | System zur begrenzung der lautsprecherauslenkung | |
| JP2013121105A5 (https=) | ||
| DE602007003605D1 (de) | Hörinstrument mit adaptiver richtsignalverarbeitung | |
| ATE530033T1 (de) | Zweiteilige steckverbinderbaugruppe | |
| CN104349251B (zh) | 扬声器结构 | |
| WO2008138349A3 (en) | Enhanced management of sound provided via headphones | |
| WO2007099116A3 (en) | Hearing aid and method of compensation for direct sound in hearing aids | |
| WO2012079028A3 (en) | Audio speaker assembly | |
| CN205017534U (zh) | 一种耳机 | |
| US20180227655A1 (en) | Electronic device | |
| WO2008105180A1 (ja) | 振動ピックアップ型マイクロホン | |
| JP2018519770A (ja) | 音響バンドパスフィルタ及び音響感知装置 | |
| KR20160131986A (ko) | 마이크로폰 신호를 생성하는 방법 및 마이크로폰 패키지 | |
| WO2008148048A3 (en) | Advanced speech encoding dual microphone configuration (dmc) | |
| WO2012051352A3 (en) | Acoustic transducer including airfoil for generating sound | |
| CN104185125A (zh) | 扬声器系统及其驱动方法 | |
| DK1931172T3 (da) | Höreapparat med undertrykkelse af stöjlyde og en tilsvarende fremgangsmåde | |
| WO2008098258A3 (en) | Method and apparatus for modifying an audio signal | |
| DK1339256T3 (da) | Fremgangsmåde til fremstilling af akustiske apparater og til at mindske vindforstyrrelsen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WWE | Wipo information: entry into national phase |
Ref document number: 200880020602.6 Country of ref document: CN |
|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08827226 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 08827226 Country of ref document: EP Kind code of ref document: A1 |