WO2009022459A1 - マイクロホン装置およびその製造方法 - Google Patents

マイクロホン装置およびその製造方法 Download PDF

Info

Publication number
WO2009022459A1
WO2009022459A1 PCT/JP2008/002181 JP2008002181W WO2009022459A1 WO 2009022459 A1 WO2009022459 A1 WO 2009022459A1 JP 2008002181 W JP2008002181 W JP 2008002181W WO 2009022459 A1 WO2009022459 A1 WO 2009022459A1
Authority
WO
WIPO (PCT)
Prior art keywords
sound pickup
microphone apparatus
pickup element
processing section
signal processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/002181
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Yoshio Ohtsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Panasonic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp filed Critical Panasonic Corp
Priority to CN200880020602A priority Critical patent/CN101690255A/zh
Publication of WO2009022459A1 publication Critical patent/WO2009022459A1/ja
Priority to US12/610,811 priority patent/US20100119097A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/02Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04Structural association of microphone with electric circuitry therefor
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/005Electrostatic transducers using semiconductor materials
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10General applications
    • H04R2499/11Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Circuit For Audible Band Transducer (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
PCT/JP2008/002181 2007-08-10 2008-08-08 マイクロホン装置およびその製造方法 Ceased WO2009022459A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200880020602A CN101690255A (zh) 2007-08-10 2008-08-08 麦克风设备及其制造方法
US12/610,811 US20100119097A1 (en) 2007-08-10 2009-11-02 Microphone device and manufacturing method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007209123A JP2009044600A (ja) 2007-08-10 2007-08-10 マイクロホン装置およびその製造方法
JP2007-209123 2007-08-10

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/610,811 Continuation US20100119097A1 (en) 2007-08-10 2009-11-02 Microphone device and manufacturing method thereof

Publications (1)

Publication Number Publication Date
WO2009022459A1 true WO2009022459A1 (ja) 2009-02-19

Family

ID=40350517

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002181 Ceased WO2009022459A1 (ja) 2007-08-10 2008-08-08 マイクロホン装置およびその製造方法

Country Status (4)

Country Link
US (1) US20100119097A1 (https=)
JP (1) JP2009044600A (https=)
CN (1) CN101690255A (https=)
WO (1) WO2009022459A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8536663B1 (en) * 2011-04-28 2013-09-17 Amkor Technology, Inc. Metal mesh lid MEMS package and method
JP2015530030A (ja) * 2012-08-10 2015-10-08 ノールズ エレクトロニクス,リミテッド ライアビリティ カンパニー 汚染物質の浸入を防ぐためのバリアを備えたマイクアセンブリ
US10136226B2 (en) 2012-12-18 2018-11-20 Tdk Corporation Top-port MEMS microphone and method of manufacturing the same

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8450817B2 (en) * 2008-08-14 2013-05-28 Knowles Electronics Llc Microelectromechanical system package with strain relief bridge
US20110254111A1 (en) * 2010-04-19 2011-10-20 Avago Technologies Wireless Ip (Singapore) Pte. Ltd Packaged acoustic transducer device with shielding from electromagnetic interference
US9420378B1 (en) 2010-07-12 2016-08-16 Amkor Technology, Inc. Top port MEMS microphone package and method
JP5636795B2 (ja) * 2010-08-02 2014-12-10 船井電機株式会社 マイクロホンユニット
EP2416544B1 (en) * 2010-08-06 2015-04-29 BlackBerry Limited Electromagnetic Shielding and an Acoustic Chamber for a Microphone in a Mobile Electronic Device
US8340735B2 (en) 2010-08-06 2012-12-25 Research In Motion Limited Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device
DE112010006098T5 (de) * 2010-12-28 2014-03-20 Knowles Electronics, Llc Package mit einem unter einem MEMS-Chip angeordneten CMOS-Chip
US20120161258A1 (en) 2010-12-28 2012-06-28 Loeppert Peter V Package with a cmos die positioned underneath a mems die
JP5721452B2 (ja) * 2011-01-27 2015-05-20 ローム株式会社 静電容量型memsセンサ
US8618619B1 (en) 2011-01-28 2013-12-31 Amkor Technology, Inc. Top port with interposer MEMS microphone package and method
US9013011B1 (en) 2011-03-11 2015-04-21 Amkor Technology, Inc. Stacked and staggered die MEMS package and method
US8724841B2 (en) * 2012-08-30 2014-05-13 Apple Inc. Microphone with acoustic mesh to protect against sudden acoustic shock
US20140071594A1 (en) * 2012-09-07 2014-03-13 Sawyer I. Cohen Components Having Breakaway Installation Handles
CN103974170B (zh) * 2013-02-06 2018-06-22 宏达国际电子股份有限公司 多传感器录音装置与方法
US9294839B2 (en) 2013-03-01 2016-03-22 Clearone, Inc. Augmentation of a beamforming microphone array with non-beamforming microphones
DE112015004268T5 (de) * 2014-09-19 2017-11-02 Murata Manufacturing Co., Ltd. Drucksensormodul
US9565493B2 (en) 2015-04-30 2017-02-07 Shure Acquisition Holdings, Inc. Array microphone system and method of assembling the same
US9554207B2 (en) 2015-04-30 2017-01-24 Shure Acquisition Holdings, Inc. Offset cartridge microphones
CN106210968B (zh) * 2016-08-29 2019-06-07 陈立康 一种全息立体拾音器
CN106358129B (zh) * 2016-08-29 2019-06-11 陈立康 一种全息立体扬声器
US20180077477A1 (en) * 2016-09-15 2018-03-15 Nokia Technologies Oy Porous audio device housing
US10367948B2 (en) 2017-01-13 2019-07-30 Shure Acquisition Holdings, Inc. Post-mixing acoustic echo cancellation systems and methods
GB2561020B (en) * 2017-03-30 2020-04-22 Cirrus Logic Int Semiconductor Ltd Apparatus and methods for monitoring a microphone
CN107222821B (zh) * 2017-06-09 2019-09-17 京东方科技集团股份有限公司 复合电极、使用其的声学传感器及制造方法
US11769510B2 (en) 2017-09-29 2023-09-26 Cirrus Logic Inc. Microphone authentication
GB2567018B (en) 2017-09-29 2020-04-01 Cirrus Logic Int Semiconductor Ltd Microphone authentication
CN212572960U (zh) * 2017-12-28 2021-02-19 美商楼氏电子有限公司 传感器、麦克风和电子装置
JP2019145934A (ja) * 2018-02-19 2019-08-29 新日本無線株式会社 Memsトランスデューサ装置及びその製造方法
EP3804356A1 (en) 2018-06-01 2021-04-14 Shure Acquisition Holdings, Inc. Pattern-forming microphone array
US11297423B2 (en) 2018-06-15 2022-04-05 Shure Acquisition Holdings, Inc. Endfire linear array microphone
EP3854108B1 (en) 2018-09-20 2025-10-22 Shure Acquisition Holdings, Inc. Adjustable lobe shape for array microphones
CN109171700B (zh) * 2018-10-11 2021-12-28 南京大学 一种生理电检测用屏蔽有源电极
EP3942842B1 (en) 2019-03-21 2026-03-11 Shure Acquisition Holdings, Inc. Housings and associated design features for ceiling array microphones
US11558693B2 (en) 2019-03-21 2023-01-17 Shure Acquisition Holdings, Inc. Auto focus, auto focus within regions, and auto placement of beamformed microphone lobes with inhibition and voice activity detection functionality
JP7572964B2 (ja) 2019-03-21 2024-10-24 シュアー アクイジッション ホールディングス インコーポレイテッド 阻止機能を伴うビーム形成マイクロフォンローブの自動集束、領域内自動集束、および自動配置
CN114051738B (zh) 2019-05-23 2024-10-01 舒尔获得控股公司 可操纵扬声器阵列、系统及其方法
US11302347B2 (en) 2019-05-31 2022-04-12 Shure Acquisition Holdings, Inc. Low latency automixer integrated with voice and noise activity detection
JP7283695B2 (ja) * 2019-07-12 2023-05-30 日清紡マイクロデバイス株式会社 音波センサの製造方法
US20220266367A1 (en) * 2019-07-26 2022-08-25 Origin Company, Limited Soldered product manufacturing device and method for manufacturing soldered product
EP4018680B1 (en) 2019-08-23 2026-04-29 Shure Acquisition Holdings, Inc. Two-dimensional microphone array with improved directivity
US11805342B2 (en) 2019-09-22 2023-10-31 xMEMS Labs, Inc. Sound producing package structure and manufacturing method thereof
US12028678B2 (en) 2019-11-01 2024-07-02 Shure Acquisition Holdings, Inc. Proximity microphone
US11395073B2 (en) 2020-04-18 2022-07-19 xMEMS Labs, Inc. Sound producing package structure and method for packaging sound producing package structure
US11252511B2 (en) 2019-12-27 2022-02-15 xMEMS Labs, Inc. Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus
US11057716B1 (en) * 2019-12-27 2021-07-06 xMEMS Labs, Inc. Sound producing device
US11552611B2 (en) 2020-02-07 2023-01-10 Shure Acquisition Holdings, Inc. System and method for automatic adjustment of reference gain
US11172300B2 (en) * 2020-02-07 2021-11-09 xMEMS Labs, Inc. Sound producing device
US11304005B2 (en) 2020-02-07 2022-04-12 xMEMS Labs, Inc. Crossover circuit
USD944776S1 (en) 2020-05-05 2022-03-01 Shure Acquisition Holdings, Inc. Audio device
WO2021243368A2 (en) 2020-05-29 2021-12-02 Shure Acquisition Holdings, Inc. Transducer steering and configuration systems and methods using a local positioning system
US11323823B1 (en) * 2021-01-18 2022-05-03 Knowles Electronics, Llc MEMS device with a diaphragm having a slotted layer
US11785380B2 (en) 2021-01-28 2023-10-10 Shure Acquisition Holdings, Inc. Hybrid audio beamforming system
US12452584B2 (en) 2021-01-29 2025-10-21 Shure Acquisition Holdings, Inc. Scalable conferencing systems and methods
US12542123B2 (en) 2021-08-31 2026-02-03 Shure Acquisition Holdings, Inc. Mask non-linear processor for acoustic echo cancellation
CN118216161A (zh) 2021-10-04 2024-06-18 舒尔获得控股公司 联网自动混合器系统及方法
WO2023060082A1 (en) 2021-10-05 2023-04-13 Shure Acquisition Holdings, Inc. Microphone assembly, filter for microphone, process for assembly and manufacturing microphone and filter for microphone, and method for filtering microphone
EP4427465A1 (en) 2021-11-05 2024-09-11 Shure Acquisition Holdings, Inc. Distributed algorithm for automixing speech over wireless networks
WO2023133513A1 (en) 2022-01-07 2023-07-13 Shure Acquisition Holdings, Inc. Audio beamforming with nulling control system and methods
US12598261B2 (en) 2022-09-28 2026-04-07 Shure Acquisition Holdings, Inc. Wideband doubletalk detection for optimization of acoustic echo cancellation

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004328232A (ja) * 2003-04-23 2004-11-18 Matsushita Electric Ind Co Ltd 風防兼静電遮蔽機能付きマイクロホン及びこれに用いる風防兼静電遮蔽スクリーン
JP2004537182A (ja) * 2000-11-28 2004-12-09 ノウレス エレクトロニクス, リミテッド ライアビリティ カンパニー 小型シリコンコンデンサマイクロフォンおよびその製造方法
JP2005051293A (ja) * 2003-07-29 2005-02-24 Citizen Electronics Co Ltd 動電型発音体の製造方法
JP2006237921A (ja) * 2005-02-24 2006-09-07 Audio Technica Corp コンデンサマイクロホン
JP2007006149A (ja) * 2005-06-23 2007-01-11 Hosiden Corp 電子部品
JP2007060661A (ja) * 2005-08-20 2007-03-08 Bse Co Ltd シリコンコンデンサマイクロホン及びシリコンコンデンサマイクロホンのパッケージング方法
JP2007174622A (ja) * 2005-11-25 2007-07-05 Matsushita Electric Works Ltd 音響センサ

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2694462A (en) * 1951-09-19 1954-11-16 Robbins Frank Acoustic system for loud-speakers
JP3861006B2 (ja) * 2000-04-26 2006-12-20 ホシデン株式会社 半導体エレクトレットコンデンサマイクロホン
JP4659300B2 (ja) * 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
US7434305B2 (en) * 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US7439616B2 (en) * 2000-11-28 2008-10-21 Knowles Electronics, Llc Miniature silicon condenser microphone
US7022546B2 (en) * 2000-12-05 2006-04-04 Analog Devices, Inc. Method and device for protecting micro electromechanical systems structures during dicing of a wafer
US7298856B2 (en) * 2001-09-05 2007-11-20 Nippon Hoso Kyokai Chip microphone and method of making same
US7146016B2 (en) * 2001-11-27 2006-12-05 Center For National Research Initiatives Miniature condenser microphone and fabrication method therefor
ATE493226T1 (de) * 2002-03-12 2011-01-15 Hamamatsu Photonics Kk Verfahren zum schneiden eines bearbeiteten objekts
US7135070B2 (en) * 2002-04-23 2006-11-14 Sharp Laboratories Of America, Inc. Monolithic stacked/layered crystal-structure-processed mechanical, and combined mechanical and electrical, devices and methods and systems for making
US7039593B2 (en) * 2002-06-20 2006-05-02 Robert David Sager Payment convergence system and method
US6822326B2 (en) * 2002-09-25 2004-11-23 Ziptronix Wafer bonding hermetic encapsulation
JP2005039652A (ja) * 2003-07-17 2005-02-10 Hosiden Corp 音響検出機構
JP2007500941A (ja) * 2003-07-31 2007-01-18 エフエスアイ インターナショナル インコーポレイテッド 高度に均一な酸化物層、とりわけ超薄層の調節された成長
US6936524B2 (en) * 2003-11-05 2005-08-30 Akustica, Inc. Ultrathin form factor MEMS microphones and microspeakers
JP3875240B2 (ja) * 2004-03-31 2007-01-31 株式会社東芝 電子部品の製造方法
US7155024B2 (en) * 2004-12-13 2006-12-26 Taiwan Carol Electronics Co., Ltd. Microphone
US7334901B2 (en) * 2005-04-22 2008-02-26 Ostendo Technologies, Inc. Low profile, large screen display using a rear projection array system
US20060280319A1 (en) * 2005-06-08 2006-12-14 General Mems Corporation Micromachined Capacitive Microphone
US7202552B2 (en) * 2005-07-15 2007-04-10 Silicon Matrix Pte. Ltd. MEMS package using flexible substrates, and method thereof
JP4701032B2 (ja) * 2005-07-28 2011-06-15 日本製紙株式会社 印刷用紙の裏抜け評価方法及び評価装置
JP4787648B2 (ja) * 2006-03-29 2011-10-05 パナソニック株式会社 コンデンサマイクロホンの製造方法およびコンデンサマイクロホン
WO2007136706A1 (en) * 2006-05-17 2007-11-29 Qualcomm Mems Technologies Inc. Desiccant in a mems device
US8005250B2 (en) * 2007-12-21 2011-08-23 Josephson Engineering, Inc. Microphone housing

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004537182A (ja) * 2000-11-28 2004-12-09 ノウレス エレクトロニクス, リミテッド ライアビリティ カンパニー 小型シリコンコンデンサマイクロフォンおよびその製造方法
JP2004328232A (ja) * 2003-04-23 2004-11-18 Matsushita Electric Ind Co Ltd 風防兼静電遮蔽機能付きマイクロホン及びこれに用いる風防兼静電遮蔽スクリーン
JP2005051293A (ja) * 2003-07-29 2005-02-24 Citizen Electronics Co Ltd 動電型発音体の製造方法
JP2006237921A (ja) * 2005-02-24 2006-09-07 Audio Technica Corp コンデンサマイクロホン
JP2007006149A (ja) * 2005-06-23 2007-01-11 Hosiden Corp 電子部品
JP2007060661A (ja) * 2005-08-20 2007-03-08 Bse Co Ltd シリコンコンデンサマイクロホン及びシリコンコンデンサマイクロホンのパッケージング方法
JP2007174622A (ja) * 2005-11-25 2007-07-05 Matsushita Electric Works Ltd 音響センサ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8536663B1 (en) * 2011-04-28 2013-09-17 Amkor Technology, Inc. Metal mesh lid MEMS package and method
US9162871B1 (en) 2011-04-28 2015-10-20 Amkor Technology, Inc. Metal mesh lid MEMS package and method
JP2015530030A (ja) * 2012-08-10 2015-10-08 ノールズ エレクトロニクス,リミテッド ライアビリティ カンパニー 汚染物質の浸入を防ぐためのバリアを備えたマイクアセンブリ
US10136226B2 (en) 2012-12-18 2018-11-20 Tdk Corporation Top-port MEMS microphone and method of manufacturing the same

Also Published As

Publication number Publication date
JP2009044600A (ja) 2009-02-26
CN101690255A (zh) 2010-03-31
US20100119097A1 (en) 2010-05-13

Similar Documents

Publication Publication Date Title
WO2009022459A1 (ja) マイクロホン装置およびその製造方法
US8731220B2 (en) MEMS microphone
WO2010036321A3 (en) Self-steering directional hearing aid and method of operation thereof
JP5201598B2 (ja) コンデンサマイクロホン
US10057687B2 (en) Speaker structure
WO2009022330A3 (en) Dynamically variable filter
ATE524933T1 (de) System zur begrenzung der lautsprecherauslenkung
JP2013121105A5 (https=)
DE602007003605D1 (de) Hörinstrument mit adaptiver richtsignalverarbeitung
ATE530033T1 (de) Zweiteilige steckverbinderbaugruppe
CN104349251B (zh) 扬声器结构
WO2008138349A3 (en) Enhanced management of sound provided via headphones
WO2007099116A3 (en) Hearing aid and method of compensation for direct sound in hearing aids
WO2012079028A3 (en) Audio speaker assembly
CN205017534U (zh) 一种耳机
US20180227655A1 (en) Electronic device
WO2008105180A1 (ja) 振動ピックアップ型マイクロホン
JP2018519770A (ja) 音響バンドパスフィルタ及び音響感知装置
KR20160131986A (ko) 마이크로폰 신호를 생성하는 방법 및 마이크로폰 패키지
WO2008148048A3 (en) Advanced speech encoding dual microphone configuration (dmc)
WO2012051352A3 (en) Acoustic transducer including airfoil for generating sound
CN104185125A (zh) 扬声器系统及其驱动方法
DK1931172T3 (da) Höreapparat med undertrykkelse af stöjlyde og en tilsvarende fremgangsmåde
WO2008098258A3 (en) Method and apparatus for modifying an audio signal
DK1339256T3 (da) Fremgangsmåde til fremstilling af akustiske apparater og til at mindske vindforstyrrelsen

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880020602.6

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08827226

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08827226

Country of ref document: EP

Kind code of ref document: A1