JP2009028922A5 - - Google Patents
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- Publication number
- JP2009028922A5 JP2009028922A5 JP2007192703A JP2007192703A JP2009028922A5 JP 2009028922 A5 JP2009028922 A5 JP 2009028922A5 JP 2007192703 A JP2007192703 A JP 2007192703A JP 2007192703 A JP2007192703 A JP 2007192703A JP 2009028922 A5 JP2009028922 A5 JP 2009028922A5
- Authority
- JP
- Japan
- Prior art keywords
- adherend
- plasma polymerized
- polymerized film
- energy
- joining method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 claims 33
- 239000000463 material Substances 0.000 claims 11
- 239000000758 substrate Substances 0.000 claims 6
- 238000010438 heat treatment Methods 0.000 claims 4
- 238000010030 laminating Methods 0.000 claims 3
- 229920000642 polymer Polymers 0.000 claims 3
- 238000006116 polymerization reaction Methods 0.000 claims 3
- 229920001795 coordination polymer Polymers 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 230000001678 irradiating effect Effects 0.000 claims 2
- 238000004381 surface treatment Methods 0.000 claims 2
- 238000003475 lamination Methods 0.000 claims 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims 1
- 230000035699 permeability Effects 0.000 claims 1
- 238000009832 plasma treatment Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- JLTRXTDYQLMHGR-UHFFFAOYSA-N trimethylaluminium Chemical compound C[Al](C)C JLTRXTDYQLMHGR-UHFFFAOYSA-N 0.000 claims 1
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007192703A JP2009028922A (ja) | 2007-07-24 | 2007-07-24 | 接合方法、接合体、液滴吐出ヘッドおよび液滴吐出装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007192703A JP2009028922A (ja) | 2007-07-24 | 2007-07-24 | 接合方法、接合体、液滴吐出ヘッドおよび液滴吐出装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009028922A JP2009028922A (ja) | 2009-02-12 |
| JP2009028922A5 true JP2009028922A5 (https=) | 2010-07-22 |
Family
ID=40399996
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007192703A Withdrawn JP2009028922A (ja) | 2007-07-24 | 2007-07-24 | 接合方法、接合体、液滴吐出ヘッドおよび液滴吐出装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009028922A (https=) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5397999B2 (ja) * | 2009-09-28 | 2014-01-22 | 富士フイルム株式会社 | 基材同士の接合方法及び接合体 |
| US10543662B2 (en) | 2012-02-08 | 2020-01-28 | Corning Incorporated | Device modified substrate article and methods for making |
| US10014177B2 (en) | 2012-12-13 | 2018-07-03 | Corning Incorporated | Methods for processing electronic devices |
| US10086584B2 (en) | 2012-12-13 | 2018-10-02 | Corning Incorporated | Glass articles and methods for controlled bonding of glass sheets with carriers |
| US9340443B2 (en) | 2012-12-13 | 2016-05-17 | Corning Incorporated | Bulk annealing of glass sheets |
| TWI617437B (zh) | 2012-12-13 | 2018-03-11 | 康寧公司 | 促進控制薄片與載體間接合之處理 |
| US10510576B2 (en) | 2013-10-14 | 2019-12-17 | Corning Incorporated | Carrier-bonding methods and articles for semiconductor and interposer processing |
| WO2015112958A1 (en) | 2014-01-27 | 2015-07-30 | Corning Incorporated | Articles and methods for controlled bonding of thin sheets with carriers |
| CN106457758B (zh) | 2014-04-09 | 2018-11-16 | 康宁股份有限公司 | 装置改性的基材制品及其制备方法 |
| CN107635769B (zh) | 2015-05-19 | 2020-09-15 | 康宁股份有限公司 | 使片材与载体粘结的制品和方法 |
| JP7106276B2 (ja) | 2015-06-26 | 2022-07-26 | コーニング インコーポレイテッド | シート及び担体を有する物品及び方法 |
| WO2017033545A1 (ja) * | 2015-08-26 | 2017-03-02 | ウシオ電機株式会社 | ２枚の基板の貼り合わせ方法および２枚の基板の貼り合わせ装置 |
| JP6065170B1 (ja) * | 2015-08-26 | 2017-01-25 | ウシオ電機株式会社 | ２枚の基板の貼り合わせ方法および２枚の基板の貼り合わせ装置 |
| TW202216444A (zh) | 2016-08-30 | 2022-05-01 | 美商康寧公司 | 用於片材接合的矽氧烷電漿聚合物 |
| TWI810161B (zh) | 2016-08-31 | 2023-08-01 | 美商康寧公司 | 具以可控制式黏結的薄片之製品及製作其之方法 |
| JP7260523B2 (ja) | 2017-08-18 | 2023-04-18 | コーニング インコーポレイテッド | ポリカチオン性高分子を使用した一時的結合 |
| US11331692B2 (en) | 2017-12-15 | 2022-05-17 | Corning Incorporated | Methods for treating a substrate and method for making articles comprising bonded sheets |
| EP3994384B1 (en) | 2019-07-01 | 2025-05-21 | Saint-Gobain Performance Plastics Corporation | Profile connection |
| EP3868245B1 (en) * | 2019-11-01 | 2024-04-10 | ASICS Corporation | Method for manufacturing shoe member, and molding die |
| BR112022011492A2 (pt) * | 2019-12-12 | 2022-08-23 | Saint Gobain Performance Plastics Corp | Aparelho para soldagem esterilizada |
| EP4121277A4 (en) * | 2020-03-20 | 2024-04-10 | Saint-Gobain Performance Plastics Corporation | STERILE SEALING DEVICE |
| CN115916510A (zh) | 2020-06-19 | 2023-04-04 | 美国圣戈班性能塑料公司 | 复合制品和形成复合制品的方法 |
-
2007
- 2007-07-24 JP JP2007192703A patent/JP2009028922A/ja not_active Withdrawn
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