JP2009024230A5 - - Google Patents

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Publication number
JP2009024230A5
JP2009024230A5 JP2007189471A JP2007189471A JP2009024230A5 JP 2009024230 A5 JP2009024230 A5 JP 2009024230A5 JP 2007189471 A JP2007189471 A JP 2007189471A JP 2007189471 A JP2007189471 A JP 2007189471A JP 2009024230 A5 JP2009024230 A5 JP 2009024230A5
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JP
Japan
Prior art keywords
pair
magnetic field
sputtering
evaporation sources
cylindrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007189471A
Other languages
English (en)
Japanese (ja)
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JP2009024230A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007189471A priority Critical patent/JP2009024230A/ja
Priority claimed from JP2007189471A external-priority patent/JP2009024230A/ja
Priority to KR1020107001058A priority patent/KR101175843B1/ko
Priority to DE112008001930T priority patent/DE112008001930T5/de
Priority to PCT/JP2008/059880 priority patent/WO2009013935A1/ja
Priority to US12/668,914 priority patent/US20100181191A1/en
Priority to CN200880025385XA priority patent/CN101755071B/zh
Publication of JP2009024230A publication Critical patent/JP2009024230A/ja
Publication of JP2009024230A5 publication Critical patent/JP2009024230A5/ja
Pending legal-status Critical Current

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JP2007189471A 2007-07-20 2007-07-20 スパッタリング装置 Pending JP2009024230A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2007189471A JP2009024230A (ja) 2007-07-20 2007-07-20 スパッタリング装置
KR1020107001058A KR101175843B1 (ko) 2007-07-20 2008-05-29 스퍼터링 장치
DE112008001930T DE112008001930T5 (de) 2007-07-20 2008-05-29 Sputtergerät
PCT/JP2008/059880 WO2009013935A1 (ja) 2007-07-20 2008-05-29 スパッタリング装置
US12/668,914 US20100181191A1 (en) 2007-07-20 2008-05-29 Sputtering apparatus
CN200880025385XA CN101755071B (zh) 2007-07-20 2008-05-29 溅射装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007189471A JP2009024230A (ja) 2007-07-20 2007-07-20 スパッタリング装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012161064A Division JP5524290B2 (ja) 2012-07-20 2012-07-20 スパッタリング装置

Publications (2)

Publication Number Publication Date
JP2009024230A JP2009024230A (ja) 2009-02-05
JP2009024230A5 true JP2009024230A5 (https=) 2009-08-20

Family

ID=40281195

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007189471A Pending JP2009024230A (ja) 2007-07-20 2007-07-20 スパッタリング装置

Country Status (6)

Country Link
US (1) US20100181191A1 (https=)
JP (1) JP2009024230A (https=)
KR (1) KR101175843B1 (https=)
CN (1) CN101755071B (https=)
DE (1) DE112008001930T5 (https=)
WO (1) WO2009013935A1 (https=)

Families Citing this family (28)

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Publication number Priority date Publication date Assignee Title
JP5240782B2 (ja) * 2009-05-18 2013-07-17 株式会社神戸製鋼所 連続成膜装置
JP5527894B2 (ja) * 2010-09-01 2014-06-25 株式会社アルバック スパッタ装置
KR101273771B1 (ko) * 2010-11-09 2013-06-12 경희대학교 산학협력단 롤투롤 스퍼터링 시스템
KR20150103383A (ko) * 2011-02-23 2015-09-10 가부시키가이샤 고베 세이코쇼 아크식 증발원
CN103160792B (zh) * 2011-12-12 2017-02-08 许聪波 镀膜装置
WO2013135265A1 (en) * 2012-03-12 2013-09-19 Applied Materials, Inc. Mini rotatable sputter devices for sputter deposition
KR20150023472A (ko) * 2012-05-29 2015-03-05 어플라이드 머티어리얼스, 인코포레이티드 기판 코팅 방법 및 코팅기
KR101494223B1 (ko) 2013-01-31 2015-02-17 (주)에스엔텍 원통형 플라즈마 캐소드 장치
KR102150455B1 (ko) * 2013-04-23 2020-09-01 주식회사 선익시스템 스퍼터링 장치 및 이를 포함하는 증착장치
KR102150456B1 (ko) * 2013-04-30 2020-09-01 주식회사 선익시스템 스퍼터링 장치 및 방법
CN103409725A (zh) * 2013-05-22 2013-11-27 东莞宏威数码机械有限公司 旋转异形靶阴极机构及磁控溅射镀膜装置
PL2811507T3 (pl) * 2013-06-07 2020-09-07 Soleras Advanced Coatings Bvba Konfiguracja magnesów dla systemu magnetronowego do napylania jonowego
EP2811509A1 (en) * 2013-06-07 2014-12-10 Soleras Advanced Coatings bvba Electronic configuration for magnetron sputter deposition systems
JP6309353B2 (ja) * 2014-06-06 2018-04-11 株式会社Ｓｃｒｅｅｎホールディングス スパッタリング装置およびスパッタリング方法
US9928997B2 (en) 2014-12-14 2018-03-27 Applied Materials, Inc. Apparatus for PVD dielectric deposition
JP6209286B2 (ja) * 2015-03-20 2017-10-04 芝浦メカトロニクス株式会社 成膜装置及び成膜ワーク製造方法
KR101716848B1 (ko) * 2015-09-18 2017-03-15 이만호 공간형 이온 빔 발생 장치
JP2018532890A (ja) * 2015-10-25 2018-11-08 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板上での真空堆積のための装置及び真空堆積中に基板をマスキングするための方法
DE102016101717A1 (de) * 2016-02-01 2017-08-03 Von Ardenne Gmbh Sputteranordnung
KR20200036065A (ko) 2016-03-30 2020-04-06 케이힌 람테크 가부시키가이샤 스퍼터링 캐소드, 스퍼터링 장치 및 성막체의 제조 방법
EP3452634B1 (en) * 2016-05-02 2023-09-06 Applied Materials, Inc. Magnetron sputtering method
CN106906447A (zh) * 2016-12-27 2017-06-30 王开安 磁控溅射镀膜源及其装置与方法
CN108456867A (zh) * 2018-06-22 2018-08-28 广东腾胜真空技术工程有限公司 配置辅助阳极的低温沉积设备
DE102018213534A1 (de) * 2018-08-10 2020-02-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zur Herstellung von Schichten mit verbesserter Uniformität bei Beschichtungsanlagen mit horizontal rotierender Substratführung
JP7530724B2 (ja) * 2019-03-26 2024-08-08 日東電工株式会社 マグネトロンプラズマ成膜装置
JP2022544641A (ja) * 2019-06-24 2022-10-20 アプライド マテリアルズ インコーポレイテッド 基板上に材料を堆積する方法
WO2022194377A1 (en) * 2021-03-18 2022-09-22 Applied Materials, Inc. Method of depositing material on a substrate
CN113403595A (zh) * 2021-06-01 2021-09-17 无锡爱尔华光电科技有限公司 一种旋转镜像靶磁控溅射设备

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US4356073A (en) * 1981-02-12 1982-10-26 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
JPH0368113A (ja) 1989-08-07 1991-03-25 Mitsubishi Electric Corp 油入電気機器
JPH03104864A (ja) * 1989-09-18 1991-05-01 Hitachi Ltd スパッタリングカソード
EP0822996B1 (en) * 1995-04-25 2003-07-02 VON ARDENNE ANLAGENTECHNIK GmbH Sputtering system using cylindrical rotating magnetron electrically powered using alternating current
US6488824B1 (en) * 1998-11-06 2002-12-03 Raycom Technologies, Inc. Sputtering apparatus and process for high rate coatings
JP2001200357A (ja) * 2000-01-19 2001-07-24 Nippon Sheet Glass Co Ltd 成膜装置と成膜方法
DE10213049A1 (de) * 2002-03-22 2003-10-02 Dieter Wurczinger Drehbare Rohrkatode
WO2004005574A2 (en) * 2002-07-02 2004-01-15 Academy Precision Materials A Division Of Academy Corporation Rotary target and method for onsite mechanical assembly of rotary target
DE502005000983D1 (de) * 2005-05-13 2007-08-16 Applied Materials Gmbh & Co Kg Verfahren zum Betreiben einer Sputterkathode mit einem Target
JP4922581B2 (ja) * 2005-07-29 2012-04-25 株式会社アルバック スパッタリング装置及びスパッタリング方法

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