JP2009024230A5 - - Google Patents

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Publication number
JP2009024230A5
JP2009024230A5 JP2007189471A JP2007189471A JP2009024230A5 JP 2009024230 A5 JP2009024230 A5 JP 2009024230A5 JP 2007189471 A JP2007189471 A JP 2007189471A JP 2007189471 A JP2007189471 A JP 2007189471A JP 2009024230 A5 JP2009024230 A5 JP 2009024230A5
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JP
Japan
Prior art keywords
pair
magnetic field
sputtering
evaporation sources
cylindrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007189471A
Other languages
English (en)
Japanese (ja)
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JP2009024230A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007189471A priority Critical patent/JP2009024230A/ja
Priority claimed from JP2007189471A external-priority patent/JP2009024230A/ja
Priority to US12/668,914 priority patent/US20100181191A1/en
Priority to PCT/JP2008/059880 priority patent/WO2009013935A1/ja
Priority to KR1020107001058A priority patent/KR101175843B1/ko
Priority to CN200880025385XA priority patent/CN101755071B/zh
Priority to DE112008001930T priority patent/DE112008001930T5/de
Publication of JP2009024230A publication Critical patent/JP2009024230A/ja
Publication of JP2009024230A5 publication Critical patent/JP2009024230A5/ja
Pending legal-status Critical Current

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JP2007189471A 2007-07-20 2007-07-20 スパッタリング装置 Pending JP2009024230A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2007189471A JP2009024230A (ja) 2007-07-20 2007-07-20 スパッタリング装置
US12/668,914 US20100181191A1 (en) 2007-07-20 2008-05-29 Sputtering apparatus
PCT/JP2008/059880 WO2009013935A1 (ja) 2007-07-20 2008-05-29 スパッタリング装置
KR1020107001058A KR101175843B1 (ko) 2007-07-20 2008-05-29 스퍼터링 장치
CN200880025385XA CN101755071B (zh) 2007-07-20 2008-05-29 溅射装置
DE112008001930T DE112008001930T5 (de) 2007-07-20 2008-05-29 Sputtergerät

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007189471A JP2009024230A (ja) 2007-07-20 2007-07-20 スパッタリング装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012161064A Division JP5524290B2 (ja) 2012-07-20 2012-07-20 スパッタリング装置

Publications (2)

Publication Number Publication Date
JP2009024230A JP2009024230A (ja) 2009-02-05
JP2009024230A5 true JP2009024230A5 (https=) 2009-08-20

Family

ID=40281195

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007189471A Pending JP2009024230A (ja) 2007-07-20 2007-07-20 スパッタリング装置

Country Status (6)

Country Link
US (1) US20100181191A1 (https=)
JP (1) JP2009024230A (https=)
KR (1) KR101175843B1 (https=)
CN (1) CN101755071B (https=)
DE (1) DE112008001930T5 (https=)
WO (1) WO2009013935A1 (https=)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5240782B2 (ja) * 2009-05-18 2013-07-17 株式会社神戸製鋼所 連続成膜装置
JP5527894B2 (ja) * 2010-09-01 2014-06-25 株式会社アルバック スパッタ装置
KR101273771B1 (ko) * 2010-11-09 2013-06-12 경희대학교 산학협력단 롤투롤 스퍼터링 시스템
KR20150103383A (ko) * 2011-02-23 2015-09-10 가부시키가이샤 고베 세이코쇼 아크식 증발원
CN103160792B (zh) * 2011-12-12 2017-02-08 许聪波 镀膜装置
JP6073383B2 (ja) * 2012-03-12 2017-02-01 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ スパッタ堆積用の小型の回転可能なスパッタデバイス
JP2015524022A (ja) * 2012-05-29 2015-08-20 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板をコーティングするための方法とコーター
KR101494223B1 (ko) 2013-01-31 2015-02-17 (주)에스엔텍 원통형 플라즈마 캐소드 장치
KR102150455B1 (ko) * 2013-04-23 2020-09-01 주식회사 선익시스템 스퍼터링 장치 및 이를 포함하는 증착장치
KR102150456B1 (ko) * 2013-04-30 2020-09-01 주식회사 선익시스템 스퍼터링 장치 및 방법
CN103409725A (zh) * 2013-05-22 2013-11-27 东莞宏威数码机械有限公司 旋转异形靶阴极机构及磁控溅射镀膜装置
EP2811509A1 (en) * 2013-06-07 2014-12-10 Soleras Advanced Coatings bvba Electronic configuration for magnetron sputter deposition systems
PL2811507T3 (pl) * 2013-06-07 2020-09-07 Soleras Advanced Coatings Bvba Konfiguracja magnesów dla systemu magnetronowego do napylania jonowego
JP6309353B2 (ja) * 2014-06-06 2018-04-11 株式会社Ｓｃｒｅｅｎホールディングス スパッタリング装置およびスパッタリング方法
US9928997B2 (en) 2014-12-14 2018-03-27 Applied Materials, Inc. Apparatus for PVD dielectric deposition
US10422032B2 (en) * 2015-03-20 2019-09-24 Shibaura Mechatronics Corporation Film formation apparatus and film-formed workpiece manufacturing method
KR101716848B1 (ko) * 2015-09-18 2017-03-15 이만호 공간형 이온 빔 발생 장치
WO2017074484A1 (en) * 2015-10-25 2017-05-04 Applied Materials, Inc. Apparatus for vacuum deposition on a substrate and method for masking the substrate during vacuum deposition
DE102016101717A1 (de) * 2016-02-01 2017-08-03 Von Ardenne Gmbh Sputteranordnung
CN109881166B (zh) 2016-03-30 2021-04-20 京浜乐梦金属科技株式会社 溅射阴极、溅射装置和成膜体的制造方法
WO2017190763A1 (en) * 2016-05-02 2017-11-09 Applied Materials, Inc. Magnetron sputtering method
CN106906447A (zh) * 2016-12-27 2017-06-30 王开安 磁控溅射镀膜源及其装置与方法
CN108456867A (zh) * 2018-06-22 2018-08-28 广东腾胜真空技术工程有限公司 配置辅助阳极的低温沉积设备
DE102018213534A1 (de) 2018-08-10 2020-02-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zur Herstellung von Schichten mit verbesserter Uniformität bei Beschichtungsanlagen mit horizontal rotierender Substratführung
JP7530724B2 (ja) * 2019-03-26 2024-08-08 日東電工株式会社 マグネトロンプラズマ成膜装置
US20220246411A1 (en) * 2019-06-24 2022-08-04 Applied Materials, Inc. Method of depositing a material on a substrate
CN116917532A (zh) * 2021-03-18 2023-10-20 应用材料公司 在基板上沉积材料的方法
CN113403595A (zh) * 2021-06-01 2021-09-17 无锡爱尔华光电科技有限公司 一种旋转镜像靶磁控溅射设备

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US4356073A (en) * 1981-02-12 1982-10-26 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
JPH0368113A (ja) 1989-08-07 1991-03-25 Mitsubishi Electric Corp 油入電気機器
JPH03104864A (ja) * 1989-09-18 1991-05-01 Hitachi Ltd スパッタリングカソード
WO1996034124A1 (en) * 1995-04-25 1996-10-31 The Boc Group, Inc. Sputtering system using cylindrical rotating magnetron electrically powered using alternating current
US6488824B1 (en) * 1998-11-06 2002-12-03 Raycom Technologies, Inc. Sputtering apparatus and process for high rate coatings
JP2001200357A (ja) * 2000-01-19 2001-07-24 Nippon Sheet Glass Co Ltd 成膜装置と成膜方法
DE10213049A1 (de) * 2002-03-22 2003-10-02 Dieter Wurczinger Drehbare Rohrkatode
WO2004005574A2 (en) * 2002-07-02 2004-01-15 Academy Precision Materials A Division Of Academy Corporation Rotary target and method for onsite mechanical assembly of rotary target
DE502005000983D1 (de) * 2005-05-13 2007-08-16 Applied Materials Gmbh & Co Kg Verfahren zum Betreiben einer Sputterkathode mit einem Target
JP4922581B2 (ja) * 2005-07-29 2012-04-25 株式会社アルバック スパッタリング装置及びスパッタリング方法

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