PL2811507T3 - Konfiguracja magnesów dla systemu magnetronowego do napylania jonowego - Google Patents

Konfiguracja magnesów dla systemu magnetronowego do napylania jonowego

Info

Publication number
PL2811507T3
PL2811507T3 PL13171155T PL13171155T PL2811507T3 PL 2811507 T3 PL2811507 T3 PL 2811507T3 PL 13171155 T PL13171155 T PL 13171155T PL 13171155 T PL13171155 T PL 13171155T PL 2811507 T3 PL2811507 T3 PL 2811507T3
Authority
PL
Poland
Prior art keywords
deposition system
sputter deposition
magnetron sputter
magnetic configuration
magnetic
Prior art date
Application number
PL13171155T
Other languages
English (en)
Inventor
Wilmert De Bosscher
Original Assignee
Soleras Advanced Coatings Bvba
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soleras Advanced Coatings Bvba filed Critical Soleras Advanced Coatings Bvba
Publication of PL2811507T3 publication Critical patent/PL2811507T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452—Magnet distribution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3461—Means for shaping the magnetic field, e.g. magnetic shunts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
PL13171155T 2013-06-07 2013-06-07 Konfiguracja magnesów dla systemu magnetronowego do napylania jonowego PL2811507T3 (pl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP13171155.8A EP2811507B1 (en) 2013-06-07 2013-06-07 Magnetic configuration for a magnetron sputter deposition system

Publications (1)

Publication Number Publication Date
PL2811507T3 true PL2811507T3 (pl) 2020-09-07

Family

ID=48576867

Family Applications (1)

Application Number Title Priority Date Filing Date
PL13171155T PL2811507T3 (pl) 2013-06-07 2013-06-07 Konfiguracja magnesów dla systemu magnetronowego do napylania jonowego

Country Status (4)

Country Link
US (1) US20160273094A1 (pl)
EP (1) EP2811507B1 (pl)
PL (1) PL2811507T3 (pl)
WO (1) WO2014195517A1 (pl)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016101717A1 (de) * 2016-02-01 2017-08-03 Von Ardenne Gmbh Sputteranordnung
GB2562128B (en) * 2017-09-29 2020-08-05 Camvac Ltd Apparatus and Method for Processing, Coating or Curing a Substrate
BE1026116B1 (nl) * 2018-03-19 2019-10-17 Soleras Advanced Coatings Bvba Regelbare magnetron

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9006073D0 (en) * 1990-03-17 1990-05-16 D G Teer Coating Services Limi Magnetron sputter ion plating
DE4038497C1 (pl) * 1990-12-03 1992-02-20 Leybold Ag, 6450 Hanau, De
DE4202211A1 (de) * 1992-01-28 1993-07-29 Leybold Ag Sputteranlage mit wenigstens einer magnetron-kathode
GB2340845B (en) * 1998-08-19 2001-01-31 Kobe Steel Ltd Magnetron sputtering apparatus
US6488824B1 (en) * 1998-11-06 2002-12-03 Raycom Technologies, Inc. Sputtering apparatus and process for high rate coatings
US6610184B2 (en) 2001-11-14 2003-08-26 Applied Materials, Inc. Magnet array in conjunction with rotating magnetron for plasma sputtering
JP4219566B2 (ja) * 2001-03-30 2009-02-04 株式会社神戸製鋼所 スパッタ装置
JP2009024230A (ja) * 2007-07-20 2009-02-05 Kobe Steel Ltd スパッタリング装置

Also Published As

Publication number Publication date
EP2811507A1 (en) 2014-12-10
US20160273094A1 (en) 2016-09-22
WO2014195517A1 (en) 2014-12-11
EP2811507B1 (en) 2020-02-19

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