JP2009021298A - 集積回路素子およびその製造方法 - Google Patents
集積回路素子およびその製造方法 Download PDFInfo
- Publication number
- JP2009021298A JP2009021298A JP2007181202A JP2007181202A JP2009021298A JP 2009021298 A JP2009021298 A JP 2009021298A JP 2007181202 A JP2007181202 A JP 2007181202A JP 2007181202 A JP2007181202 A JP 2007181202A JP 2009021298 A JP2009021298 A JP 2009021298A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- base plate
- circuit element
- functional component
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
【解決手段】集積回路素子30は、複数の貫通孔18を有する平面状のベースプレート15と、機能部品13と、上記機能部品13と導通し、かつ、上記各貫通孔18を貫通する複数の端子ピン14と、上記機能部品13を包み込むように、上記ベースプレート15の片面に形成されている樹脂パッケージ11と、を具備する。
【選択図】 図8
Description
11 樹脂パッケージ
12 配線基板
13 機能部品
14 端子ピン
15 ベースプレート
16 パッド
17 ハンダ
18 貫通孔
19A、19B 金型
31 つば
Claims (6)
- 複数の貫通孔を有する平面状のベースプレートと、
機能部品と、
上記機能部品と導通し、かつ、上記各貫通孔を貫通する複数の端子ピンと、
上記機能部品を包み込むように、上記ベースプレートの片面に形成されている樹脂パッケージと、
を具備する集積回路素子。 - 上記各端子ピンの各貫通孔への貫通は、圧入により行われており、上記樹脂パッケージは、熱可塑性樹脂からなる、請求項1に記載の集積回路素子。
- 上記複数の貫通孔は2列に並んでいる、請求項1または2に記載の集積回路素子。
- 上記機能部品と上記各端子ピンとを導通させる配線基板をさらに含む、請求項1から3のいずれか1つに記載の集積回路素子。
- 上記配線基板は、上記ベースプレートに対して平行に配置されている、請求項4に記載の集積回路素子。
- 平面状のベースプレートを準備する工程と、
上記ベースプレートに複数の貫通孔を設ける工程と、
上記各貫通孔に端子ピンを挿入する工程と、
上記各端子ピンを機能部品と導通させる工程と、
上記ベースプレートと金型とを接触させることによって、上記ベースプレートおよび上記金型によって囲まれるとともに、上記機能部品を包囲する空間を作る工程と、
上記空間に樹脂を流し込むことによって、樹脂パッケージを形成する工程と、
からなる、集積回路素子の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007181202A JP5355867B2 (ja) | 2007-07-10 | 2007-07-10 | 集積回路素子 |
US12/215,968 US8139377B2 (en) | 2007-07-10 | 2008-07-01 | IC device and method of manufacturing the same |
TW097125738A TW200921809A (en) | 2007-07-10 | 2008-07-08 | IC device and method of manufacturing the same |
CN2008101280288A CN101345226B (zh) | 2007-07-10 | 2008-07-09 | Ic器件和制造该ic器件的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007181202A JP5355867B2 (ja) | 2007-07-10 | 2007-07-10 | 集積回路素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009021298A true JP2009021298A (ja) | 2009-01-29 |
JP5355867B2 JP5355867B2 (ja) | 2013-11-27 |
Family
ID=40247180
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007181202A Active JP5355867B2 (ja) | 2007-07-10 | 2007-07-10 | 集積回路素子 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8139377B2 (ja) |
JP (1) | JP5355867B2 (ja) |
CN (1) | CN101345226B (ja) |
TW (1) | TW200921809A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012053554A (ja) * | 2010-08-31 | 2012-03-15 | Toshiba Corp | 半導体記憶装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8933555B2 (en) * | 2009-05-15 | 2015-01-13 | Infineon Technologies Ag | Semiconductor chip package |
US8853849B2 (en) * | 2013-03-06 | 2014-10-07 | Infineon Technologies Austria Ag | Package arrangement and a method of manufacturing a package arrangement |
DE102016225714A1 (de) * | 2016-12-21 | 2018-06-21 | Conti Temic Microelectronic Gmbh | Verfahren zum elektrischen Kontaktieren einer Leiterplatte mit einem Pin |
CN110132462B (zh) * | 2019-06-20 | 2024-01-26 | 江西新力传感科技有限公司 | 压力传感器封装结构及其封装方法 |
FR3134944A1 (fr) * | 2022-04-22 | 2023-10-27 | Vitesco Technologies | Procédé et système de connexion étanche d’au moins un fil à une carte électronique |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS547574A (en) * | 1977-06-20 | 1979-01-20 | Mitsubishi Electric Corp | Resinnsealed type hybrid integrated circuit device |
JPS62190823A (ja) * | 1986-02-18 | 1987-08-21 | 松下電器産業株式会社 | 電子部品の製造方法 |
JPH09102580A (ja) * | 1995-08-02 | 1997-04-15 | Matsushita Electron Corp | 樹脂封止型半導体装置およびその製造方法 |
JPH10116962A (ja) * | 1996-08-20 | 1998-05-06 | Hitachi Ltd | 半導体装置とその製造方法 |
Family Cites Families (21)
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US3501582A (en) * | 1968-04-18 | 1970-03-17 | Burroughs Corp | Electrical assembly |
US3950603A (en) * | 1975-01-23 | 1976-04-13 | Analog Devices, Incorporated | Enclosure case for potless immobilization of circuit components |
US4336417A (en) * | 1979-07-10 | 1982-06-22 | Plessey Handel Und Investments Ag | Cover assemblies for electrical apparatus |
US4518112A (en) * | 1982-12-30 | 1985-05-21 | International Business Machines Corporation | Process for controlled braze joining of electronic packaging elements |
US4890152A (en) * | 1986-02-14 | 1989-12-26 | Matsushita Electric Works, Ltd. | Plastic molded chip carrier package and method of fabricating the same |
JPH061226B2 (ja) * | 1986-05-07 | 1994-01-05 | 日本電装株式会社 | 半導体圧力センサ |
US4878611A (en) * | 1986-05-30 | 1989-11-07 | American Telephone And Telegraph Company, At&T Bell Laboratories | Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate |
US4767344A (en) * | 1986-08-22 | 1988-08-30 | Burndy Corporation | Solder mounting of electrical contacts |
JPH01112758A (ja) | 1987-10-27 | 1989-05-01 | Matsushita Electric Works Ltd | 半導体パッケージ |
JPH04354363A (ja) * | 1991-05-31 | 1992-12-08 | Fujitsu Ltd | 半導体装置ユニット |
US5257547A (en) * | 1991-11-26 | 1993-11-02 | Honeywell Inc. | Amplified pressure transducer |
JPH07183626A (ja) | 1993-12-24 | 1995-07-21 | Matsushita Electric Works Ltd | セラミック集積回路基板の封止構造 |
US5503016A (en) * | 1994-02-01 | 1996-04-02 | Ic Sensors, Inc. | Vertically mounted accelerometer chip |
JPH08233848A (ja) * | 1995-02-28 | 1996-09-13 | Mitsubishi Electric Corp | 半導体センサ |
JP3147786B2 (ja) * | 1996-09-02 | 2001-03-19 | 株式会社村田製作所 | 加速度センサ |
US5870272A (en) * | 1997-05-06 | 1999-02-09 | Medtronic Inc. | Capacitive filter feedthrough for implantable medical device |
CN1146988C (zh) * | 1997-12-08 | 2004-04-21 | 东芝株式会社 | 半导体功率器件的封装及其组装方法 |
TW465146B (en) * | 1999-02-02 | 2001-11-21 | Hon Hai Prec Ind Co Ltd | Thermal expansion adjustment method of plate-shaped electronic devices and the structure thereof |
JP4473141B2 (ja) * | 2005-01-04 | 2010-06-02 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
JP4455488B2 (ja) * | 2005-12-19 | 2010-04-21 | 三菱電機株式会社 | 半導体装置 |
JP4970924B2 (ja) * | 2006-03-28 | 2012-07-11 | 三菱電機株式会社 | 光素子用パッケージとこれを用いた光半導体装置 |
-
2007
- 2007-07-10 JP JP2007181202A patent/JP5355867B2/ja active Active
-
2008
- 2008-07-01 US US12/215,968 patent/US8139377B2/en active Active
- 2008-07-08 TW TW097125738A patent/TW200921809A/zh unknown
- 2008-07-09 CN CN2008101280288A patent/CN101345226B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS547574A (en) * | 1977-06-20 | 1979-01-20 | Mitsubishi Electric Corp | Resinnsealed type hybrid integrated circuit device |
JPS62190823A (ja) * | 1986-02-18 | 1987-08-21 | 松下電器産業株式会社 | 電子部品の製造方法 |
JPH09102580A (ja) * | 1995-08-02 | 1997-04-15 | Matsushita Electron Corp | 樹脂封止型半導体装置およびその製造方法 |
JPH10116962A (ja) * | 1996-08-20 | 1998-05-06 | Hitachi Ltd | 半導体装置とその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012053554A (ja) * | 2010-08-31 | 2012-03-15 | Toshiba Corp | 半導体記憶装置 |
Also Published As
Publication number | Publication date |
---|---|
US8139377B2 (en) | 2012-03-20 |
CN101345226A (zh) | 2009-01-14 |
CN101345226B (zh) | 2010-12-08 |
JP5355867B2 (ja) | 2013-11-27 |
US20090016040A1 (en) | 2009-01-15 |
TW200921809A (en) | 2009-05-16 |
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