JP2008541430A - カスタマイズ可能な電子デバイス向けの汎用パターン付き伝導体 - Google Patents

カスタマイズ可能な電子デバイス向けの汎用パターン付き伝導体 Download PDF

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Publication number
JP2008541430A
JP2008541430A JP2008510064A JP2008510064A JP2008541430A JP 2008541430 A JP2008541430 A JP 2008541430A JP 2008510064 A JP2008510064 A JP 2008510064A JP 2008510064 A JP2008510064 A JP 2008510064A JP 2008541430 A JP2008541430 A JP 2008541430A
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JP
Japan
Prior art keywords
continuous
repetitive
layer
conductive pattern
webbing
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JP2008510064A
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English (en)
Japanese (ja)
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JP2008541430A5 (enExample
Inventor
エフ. ジャンボー,ジョージ
ジェイ. ロブレチト,マイケル
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3M Innovative Properties Co
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3M Innovative Properties Co
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Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2008541430A publication Critical patent/JP2008541430A/ja
Publication of JP2008541430A5 publication Critical patent/JP2008541430A5/ja
Withdrawn legal-status Critical Current

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    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03CPHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00Photographic processes or agents therefor; Regeneration of such processing agents
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/047Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0287Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0548Masks
    • H05K2203/0554Metal used as mask for etching vias, e.g. by laser ablation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1545Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2008510064A 2005-05-02 2006-04-27 カスタマイズ可能な電子デバイス向けの汎用パターン付き伝導体 Withdrawn JP2008541430A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/120,025 US7745733B2 (en) 2005-05-02 2005-05-02 Generic patterned conductor for customizable electronic devices
PCT/US2006/016099 WO2006118971A2 (en) 2005-05-02 2006-04-27 Generic patterned conductor for customizable electronic devices

Publications (2)

Publication Number Publication Date
JP2008541430A true JP2008541430A (ja) 2008-11-20
JP2008541430A5 JP2008541430A5 (enExample) 2009-05-07

Family

ID=36997480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008510064A Withdrawn JP2008541430A (ja) 2005-05-02 2006-04-27 カスタマイズ可能な電子デバイス向けの汎用パターン付き伝導体

Country Status (7)

Country Link
US (1) US7745733B2 (enExample)
EP (1) EP1878327A2 (enExample)
JP (1) JP2008541430A (enExample)
KR (1) KR101225363B1 (enExample)
CN (1) CN101185379B (enExample)
TW (1) TW200707471A (enExample)
WO (1) WO2006118971A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010529652A (ja) * 2007-06-01 2010-08-26 スリーエム イノベイティブ プロパティズ カンパニー フレキシブル回路
JP2015004997A (ja) * 2012-06-07 2015-01-08 日東電工株式会社 タッチパネル部材及びその製造方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7864160B2 (en) * 2005-10-05 2011-01-04 3M Innovative Properties Company Interleaved electrodes for touch sensing
US7651830B2 (en) * 2007-06-01 2010-01-26 3M Innovative Properties Company Patterned photoacid etching and articles therefrom
US8089604B2 (en) * 2007-06-26 2012-01-03 3M Innovative Properties Company Liquid crystal display panel and methods of manufacturing the same
JP5655567B2 (ja) * 2008-10-06 2015-01-21 旭硝子株式会社 電子デバイス用基板、その製造方法、これを用いた電子デバイス、その製造方法及び有機led素子用基板
US8711113B2 (en) 2011-02-07 2014-04-29 3M Innovative Properties Company Modular connector for touch sensitive device
KR20120130990A (ko) * 2011-05-24 2012-12-04 삼성전자주식회사 디지타이저 통합형 디스플레이
KR20140033785A (ko) * 2012-09-10 2014-03-19 삼성전기주식회사 디지타이저
KR101664441B1 (ko) * 2013-04-30 2016-10-11 주식회사 아모그린텍 연성인쇄회로기판 및 그 제조 방법
GB2519587A (en) 2013-10-28 2015-04-29 Barco Nv Tiled Display and method for assembling same
CN111712047B (zh) * 2020-06-29 2022-07-19 深圳市烯牛实业有限公司 一种贴合装置、柔性电路板贴合机及贴合方法
US12008204B2 (en) * 2021-10-04 2024-06-11 Google Llc Scalable gesture sensor for wearable and soft electronic devices

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GB1315030A (en) 1970-11-26 1973-04-26 Plessey Co Ltd Touch-wire overlay masks for cathode ray tubes
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JPS5745750A (en) * 1980-09-01 1982-03-15 Fanuc Ltd Transmission switching device having open line detecting function and industrial robot using said device
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010529652A (ja) * 2007-06-01 2010-08-26 スリーエム イノベイティブ プロパティズ カンパニー フレキシブル回路
JP2015004997A (ja) * 2012-06-07 2015-01-08 日東電工株式会社 タッチパネル部材及びその製造方法

Also Published As

Publication number Publication date
WO2006118971A3 (en) 2007-01-11
KR20080003396A (ko) 2008-01-07
US7745733B2 (en) 2010-06-29
KR101225363B1 (ko) 2013-01-22
WO2006118971A2 (en) 2006-11-09
EP1878327A2 (en) 2008-01-16
CN101185379B (zh) 2010-11-03
TW200707471A (en) 2007-02-16
CN101185379A (zh) 2008-05-21
US20060246379A1 (en) 2006-11-02

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