TW200707471A - Generic patterned conductor for customizable electronic devices - Google Patents

Generic patterned conductor for customizable electronic devices

Info

Publication number
TW200707471A
TW200707471A TW095115370A TW95115370A TW200707471A TW 200707471 A TW200707471 A TW 200707471A TW 095115370 A TW095115370 A TW 095115370A TW 95115370 A TW95115370 A TW 95115370A TW 200707471 A TW200707471 A TW 200707471A
Authority
TW
Taiwan
Prior art keywords
roll
continuous
repeating
continuous web
electronic devices
Prior art date
Application number
TW095115370A
Other languages
English (en)
Chinese (zh)
Inventor
George Ferenc Jambor
Michael John Robrecht
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW200707471A publication Critical patent/TW200707471A/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/047—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
TW095115370A 2005-05-02 2006-04-28 Generic patterned conductor for customizable electronic devices TW200707471A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/120,025 US7745733B2 (en) 2005-05-02 2005-05-02 Generic patterned conductor for customizable electronic devices

Publications (1)

Publication Number Publication Date
TW200707471A true TW200707471A (en) 2007-02-16

Family

ID=36997480

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115370A TW200707471A (en) 2005-05-02 2006-04-28 Generic patterned conductor for customizable electronic devices

Country Status (7)

Country Link
US (1) US7745733B2 (enExample)
EP (1) EP1878327A2 (enExample)
JP (1) JP2008541430A (enExample)
KR (1) KR101225363B1 (enExample)
CN (1) CN101185379B (enExample)
TW (1) TW200707471A (enExample)
WO (1) WO2006118971A2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7864160B2 (en) * 2005-10-05 2011-01-04 3M Innovative Properties Company Interleaved electrodes for touch sensing
US20080295327A1 (en) * 2007-06-01 2008-12-04 3M Innovative Properties Company Flexible circuit
US7651830B2 (en) * 2007-06-01 2010-01-26 3M Innovative Properties Company Patterned photoacid etching and articles therefrom
US8089604B2 (en) * 2007-06-26 2012-01-03 3M Innovative Properties Company Liquid crystal display panel and methods of manufacturing the same
JP5655567B2 (ja) * 2008-10-06 2015-01-21 旭硝子株式会社 電子デバイス用基板、その製造方法、これを用いた電子デバイス、その製造方法及び有機ｌｅｄ素子用基板
US8711113B2 (en) 2011-02-07 2014-04-29 3M Innovative Properties Company Modular connector for touch sensitive device
KR20120130990A (ko) * 2011-05-24 2012-12-04 삼성전자주식회사 디지타이저 통합형 디스플레이
JP6117620B2 (ja) * 2012-06-07 2017-04-19 日東電工株式会社 タッチパネル部材及びその製造方法
KR20140033785A (ko) * 2012-09-10 2014-03-19 삼성전기주식회사 디지타이저
KR101664441B1 (ko) * 2013-04-30 2016-10-11 주식회사 아모그린텍 연성인쇄회로기판 및 그 제조 방법
GB2519587A (en) 2013-10-28 2015-04-29 Barco Nv Tiled Display and method for assembling same
CN111712047B (zh) * 2020-06-29 2022-07-19 深圳市烯牛实业有限公司 一种贴合装置、柔性电路板贴合机及贴合方法
US12008204B2 (en) * 2021-10-04 2024-06-11 Google Llc Scalable gesture sensor for wearable and soft electronic devices

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1919421C3 (de) 1969-04-17 1975-03-13 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Mehrschichtleiterplatte
GB1315030A (en) 1970-11-26 1973-04-26 Plessey Co Ltd Touch-wire overlay masks for cathode ray tubes
US4307961A (en) * 1979-04-02 1981-12-29 Western Electric Company, Inc. Apparatus for precisely aligning a pair of elements
US4446188A (en) 1979-12-20 1984-05-01 The Mica Corporation Multi-layered circuit board
JPS5745750A (en) * 1980-09-01 1982-03-15 Fanuc Ltd Transmission switching device having open line detecting function and industrial robot using said device
KR940008852B1 (ko) 1986-05-05 1994-09-28 제이. 주팬시크 데릭 컴퓨터 격납장치내의 전자 및 전기 조립체 장치용 브래킷(Bracket) 세트
GB2207815A (en) 1987-07-16 1989-02-08 Crystalate Electronics Process for producing a programmed matrix
EP0375328B1 (en) 1988-12-19 1997-03-19 Sharp Kabushiki Kaisha Tablet integrated with display
US5062916A (en) 1990-08-01 1991-11-05 W. H. Brady Co. Method for the manufacture of electrical membrane panels having circuits on flexible plastic films
US5543590A (en) 1992-06-08 1996-08-06 Synaptics, Incorporated Object position detector with edge motion feature
EP0600052B1 (de) 1992-06-15 1996-04-17 Dyconex Patente Ag Verfahren zur herstellung von nachträglich konditionierbaren kontaktstellen an schaltungsträgern und schaltungsträger mit solchen kontaktstellen
US5491706A (en) 1993-04-07 1996-02-13 Sharp Kabushiki Kaisha Display-integrated type tablet device capable of detecting correct coordinates at a tip end of a detection pen by detecting external noise
US5544018A (en) 1994-04-13 1996-08-06 Microelectronics And Computer Technology Corporation Electrical interconnect device with customizeable surface layer and interwoven signal lines
US5543589A (en) 1994-05-23 1996-08-06 International Business Machines Corporation Touchpad with dual sensor that simplifies scanning
US5945980A (en) 1997-11-14 1999-08-31 Logitech, Inc. Touchpad with active plane for pen detection
US6305073B1 (en) * 1999-12-29 2001-10-23 Gm Nameplate, Inc. One-sided electrode arrangement on an intermediate spacer for a touchscreen
JP2002190674A (ja) * 2000-12-21 2002-07-05 Sony Chem Corp 多層フレキシブル配線板の製造方法
US6819316B2 (en) 2001-04-17 2004-11-16 3M Innovative Properties Company Flexible capacitive touch sensor
CN1245062C (zh) * 2002-05-10 2006-03-08 华通电脑股份有限公司 以二次或二次以上压合制成印刷电路板使用的靶位制造方法
CN1218275C (zh) * 2002-08-13 2005-09-07 突破光电科技股份有限公司 触控屏上、下电极导通结构

Also Published As

Publication number Publication date
WO2006118971A3 (en) 2007-01-11
KR20080003396A (ko) 2008-01-07
US7745733B2 (en) 2010-06-29
JP2008541430A (ja) 2008-11-20
KR101225363B1 (ko) 2013-01-22
WO2006118971A2 (en) 2006-11-09
EP1878327A2 (en) 2008-01-16
CN101185379B (zh) 2010-11-03
CN101185379A (zh) 2008-05-21
US20060246379A1 (en) 2006-11-02

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