CN101185379B - 用于可定制电子器件的通用图案化导体 - Google Patents
用于可定制电子器件的通用图案化导体 Download PDFInfo
- Publication number
- CN101185379B CN101185379B CN2006800188086A CN200680018808A CN101185379B CN 101185379 B CN101185379 B CN 101185379B CN 2006800188086 A CN2006800188086 A CN 2006800188086A CN 200680018808 A CN200680018808 A CN 200680018808A CN 101185379 B CN101185379 B CN 101185379B
- Authority
- CN
- China
- Prior art keywords
- continuous slice
- layered product
- conduction pattern
- continuous
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/045—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/047—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Manufacturing Of Electric Cables (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/120,025 US7745733B2 (en) | 2005-05-02 | 2005-05-02 | Generic patterned conductor for customizable electronic devices |
| US11/120,025 | 2005-05-02 | ||
| PCT/US2006/016099 WO2006118971A2 (en) | 2005-05-02 | 2006-04-27 | Generic patterned conductor for customizable electronic devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101185379A CN101185379A (zh) | 2008-05-21 |
| CN101185379B true CN101185379B (zh) | 2010-11-03 |
Family
ID=36997480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006800188086A Expired - Fee Related CN101185379B (zh) | 2005-05-02 | 2006-04-27 | 用于可定制电子器件的通用图案化导体 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7745733B2 (enExample) |
| EP (1) | EP1878327A2 (enExample) |
| JP (1) | JP2008541430A (enExample) |
| KR (1) | KR101225363B1 (enExample) |
| CN (1) | CN101185379B (enExample) |
| TW (1) | TW200707471A (enExample) |
| WO (1) | WO2006118971A2 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7864160B2 (en) * | 2005-10-05 | 2011-01-04 | 3M Innovative Properties Company | Interleaved electrodes for touch sensing |
| US20080295327A1 (en) * | 2007-06-01 | 2008-12-04 | 3M Innovative Properties Company | Flexible circuit |
| US7651830B2 (en) * | 2007-06-01 | 2010-01-26 | 3M Innovative Properties Company | Patterned photoacid etching and articles therefrom |
| US8089604B2 (en) * | 2007-06-26 | 2012-01-03 | 3M Innovative Properties Company | Liquid crystal display panel and methods of manufacturing the same |
| JP5655567B2 (ja) * | 2008-10-06 | 2015-01-21 | 旭硝子株式会社 | 電子デバイス用基板、その製造方法、これを用いた電子デバイス、その製造方法及び有機led素子用基板 |
| US8711113B2 (en) | 2011-02-07 | 2014-04-29 | 3M Innovative Properties Company | Modular connector for touch sensitive device |
| KR20120130990A (ko) * | 2011-05-24 | 2012-12-04 | 삼성전자주식회사 | 디지타이저 통합형 디스플레이 |
| JP6117620B2 (ja) * | 2012-06-07 | 2017-04-19 | 日東電工株式会社 | タッチパネル部材及びその製造方法 |
| KR20140033785A (ko) * | 2012-09-10 | 2014-03-19 | 삼성전기주식회사 | 디지타이저 |
| KR101664441B1 (ko) * | 2013-04-30 | 2016-10-11 | 주식회사 아모그린텍 | 연성인쇄회로기판 및 그 제조 방법 |
| GB2519587A (en) | 2013-10-28 | 2015-04-29 | Barco Nv | Tiled Display and method for assembling same |
| CN111712047B (zh) * | 2020-06-29 | 2022-07-19 | 深圳市烯牛实业有限公司 | 一种贴合装置、柔性电路板贴合机及贴合方法 |
| US12008204B2 (en) * | 2021-10-04 | 2024-06-11 | Google Llc | Scalable gesture sensor for wearable and soft electronic devices |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3773989A (en) * | 1970-11-26 | 1973-11-20 | Plessey Handel Investment Ag | Touch-wire overlay masks for cathode ray tubes |
| US4307961A (en) * | 1979-04-02 | 1981-12-29 | Western Electric Company, Inc. | Apparatus for precisely aligning a pair of elements |
| GB2207815A (en) * | 1987-07-16 | 1989-02-08 | Crystalate Electronics | Process for producing a programmed matrix |
| EP0471149A2 (en) * | 1990-08-01 | 1992-02-19 | Dynapro Thin Film Products, Inc. | Method for the manufacture of electrical membrane panels having circuits on flexible plastic films |
| US6305073B1 (en) * | 1999-12-29 | 2001-10-23 | Gm Nameplate, Inc. | One-sided electrode arrangement on an intermediate spacer for a touchscreen |
| CN1366445A (zh) * | 2000-12-21 | 2002-08-28 | 索尼化学株式会社 | 多层柔性布线板的制造方法 |
| CN1457227A (zh) * | 2002-05-10 | 2003-11-19 | 华通电脑股份有限公司 | 以二次或二次以上压合制成印刷电路板使用的靶位制造方法 |
| CN1475964A (zh) * | 2002-08-13 | 2004-02-18 | 突破光电科技股份有限公司 | 触控屏上、下电极导通结构 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1919421C3 (de) | 1969-04-17 | 1975-03-13 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Mehrschichtleiterplatte |
| US4446188A (en) | 1979-12-20 | 1984-05-01 | The Mica Corporation | Multi-layered circuit board |
| JPS5745750A (en) * | 1980-09-01 | 1982-03-15 | Fanuc Ltd | Transmission switching device having open line detecting function and industrial robot using said device |
| KR940008852B1 (ko) | 1986-05-05 | 1994-09-28 | 제이. 주팬시크 데릭 | 컴퓨터 격납장치내의 전자 및 전기 조립체 장치용 브래킷(Bracket) 세트 |
| EP0375328B1 (en) | 1988-12-19 | 1997-03-19 | Sharp Kabushiki Kaisha | Tablet integrated with display |
| US5543590A (en) | 1992-06-08 | 1996-08-06 | Synaptics, Incorporated | Object position detector with edge motion feature |
| EP0600052B1 (de) | 1992-06-15 | 1996-04-17 | Dyconex Patente Ag | Verfahren zur herstellung von nachträglich konditionierbaren kontaktstellen an schaltungsträgern und schaltungsträger mit solchen kontaktstellen |
| US5491706A (en) | 1993-04-07 | 1996-02-13 | Sharp Kabushiki Kaisha | Display-integrated type tablet device capable of detecting correct coordinates at a tip end of a detection pen by detecting external noise |
| US5544018A (en) | 1994-04-13 | 1996-08-06 | Microelectronics And Computer Technology Corporation | Electrical interconnect device with customizeable surface layer and interwoven signal lines |
| US5543589A (en) | 1994-05-23 | 1996-08-06 | International Business Machines Corporation | Touchpad with dual sensor that simplifies scanning |
| US5945980A (en) | 1997-11-14 | 1999-08-31 | Logitech, Inc. | Touchpad with active plane for pen detection |
| US6819316B2 (en) | 2001-04-17 | 2004-11-16 | 3M Innovative Properties Company | Flexible capacitive touch sensor |
-
2005
- 2005-05-02 US US11/120,025 patent/US7745733B2/en not_active Expired - Fee Related
-
2006
- 2006-04-27 JP JP2008510064A patent/JP2008541430A/ja not_active Withdrawn
- 2006-04-27 CN CN2006800188086A patent/CN101185379B/zh not_active Expired - Fee Related
- 2006-04-27 EP EP06751688A patent/EP1878327A2/en not_active Withdrawn
- 2006-04-27 KR KR1020077025470A patent/KR101225363B1/ko not_active Expired - Fee Related
- 2006-04-27 WO PCT/US2006/016099 patent/WO2006118971A2/en not_active Ceased
- 2006-04-28 TW TW095115370A patent/TW200707471A/zh unknown
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3773989A (en) * | 1970-11-26 | 1973-11-20 | Plessey Handel Investment Ag | Touch-wire overlay masks for cathode ray tubes |
| US4307961A (en) * | 1979-04-02 | 1981-12-29 | Western Electric Company, Inc. | Apparatus for precisely aligning a pair of elements |
| GB2207815A (en) * | 1987-07-16 | 1989-02-08 | Crystalate Electronics | Process for producing a programmed matrix |
| EP0471149A2 (en) * | 1990-08-01 | 1992-02-19 | Dynapro Thin Film Products, Inc. | Method for the manufacture of electrical membrane panels having circuits on flexible plastic films |
| US6305073B1 (en) * | 1999-12-29 | 2001-10-23 | Gm Nameplate, Inc. | One-sided electrode arrangement on an intermediate spacer for a touchscreen |
| CN1366445A (zh) * | 2000-12-21 | 2002-08-28 | 索尼化学株式会社 | 多层柔性布线板的制造方法 |
| CN1457227A (zh) * | 2002-05-10 | 2003-11-19 | 华通电脑股份有限公司 | 以二次或二次以上压合制成印刷电路板使用的靶位制造方法 |
| CN1475964A (zh) * | 2002-08-13 | 2004-02-18 | 突破光电科技股份有限公司 | 触控屏上、下电极导通结构 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2006118971A3 (en) | 2007-01-11 |
| KR20080003396A (ko) | 2008-01-07 |
| US7745733B2 (en) | 2010-06-29 |
| JP2008541430A (ja) | 2008-11-20 |
| KR101225363B1 (ko) | 2013-01-22 |
| WO2006118971A2 (en) | 2006-11-09 |
| EP1878327A2 (en) | 2008-01-16 |
| TW200707471A (en) | 2007-02-16 |
| CN101185379A (zh) | 2008-05-21 |
| US20060246379A1 (en) | 2006-11-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101103 |