CN101185379B - 用于可定制电子器件的通用图案化导体 - Google Patents

用于可定制电子器件的通用图案化导体 Download PDF

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Publication number
CN101185379B
CN101185379B CN2006800188086A CN200680018808A CN101185379B CN 101185379 B CN101185379 B CN 101185379B CN 2006800188086 A CN2006800188086 A CN 2006800188086A CN 200680018808 A CN200680018808 A CN 200680018808A CN 101185379 B CN101185379 B CN 101185379B
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China
Prior art keywords
continuous slice
layered product
conduction pattern
continuous
layer
Prior art date
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Expired - Fee Related
Application number
CN2006800188086A
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English (en)
Chinese (zh)
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CN101185379A (zh
Inventor
乔治·F·扬博尔
迈克尔·J·罗布瑞特
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of CN101185379A publication Critical patent/CN101185379A/zh
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    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03CPHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00Photographic processes or agents therefor; Regeneration of such processing agents
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/047Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0287Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0548Masks
    • H05K2203/0554Metal used as mask for etching vias, e.g. by laser ablation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1545Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
CN2006800188086A 2005-05-02 2006-04-27 用于可定制电子器件的通用图案化导体 Expired - Fee Related CN101185379B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/120,025 US7745733B2 (en) 2005-05-02 2005-05-02 Generic patterned conductor for customizable electronic devices
US11/120,025 2005-05-02
PCT/US2006/016099 WO2006118971A2 (en) 2005-05-02 2006-04-27 Generic patterned conductor for customizable electronic devices

Publications (2)

Publication Number Publication Date
CN101185379A CN101185379A (zh) 2008-05-21
CN101185379B true CN101185379B (zh) 2010-11-03

Family

ID=36997480

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2006800188086A Expired - Fee Related CN101185379B (zh) 2005-05-02 2006-04-27 用于可定制电子器件的通用图案化导体

Country Status (7)

Country Link
US (1) US7745733B2 (enExample)
EP (1) EP1878327A2 (enExample)
JP (1) JP2008541430A (enExample)
KR (1) KR101225363B1 (enExample)
CN (1) CN101185379B (enExample)
TW (1) TW200707471A (enExample)
WO (1) WO2006118971A2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7864160B2 (en) * 2005-10-05 2011-01-04 3M Innovative Properties Company Interleaved electrodes for touch sensing
US20080295327A1 (en) * 2007-06-01 2008-12-04 3M Innovative Properties Company Flexible circuit
US7651830B2 (en) * 2007-06-01 2010-01-26 3M Innovative Properties Company Patterned photoacid etching and articles therefrom
US8089604B2 (en) * 2007-06-26 2012-01-03 3M Innovative Properties Company Liquid crystal display panel and methods of manufacturing the same
JP5655567B2 (ja) * 2008-10-06 2015-01-21 旭硝子株式会社 電子デバイス用基板、その製造方法、これを用いた電子デバイス、その製造方法及び有機led素子用基板
US8711113B2 (en) 2011-02-07 2014-04-29 3M Innovative Properties Company Modular connector for touch sensitive device
KR20120130990A (ko) * 2011-05-24 2012-12-04 삼성전자주식회사 디지타이저 통합형 디스플레이
JP6117620B2 (ja) * 2012-06-07 2017-04-19 日東電工株式会社 タッチパネル部材及びその製造方法
KR20140033785A (ko) * 2012-09-10 2014-03-19 삼성전기주식회사 디지타이저
KR101664441B1 (ko) * 2013-04-30 2016-10-11 주식회사 아모그린텍 연성인쇄회로기판 및 그 제조 방법
GB2519587A (en) 2013-10-28 2015-04-29 Barco Nv Tiled Display and method for assembling same
CN111712047B (zh) * 2020-06-29 2022-07-19 深圳市烯牛实业有限公司 一种贴合装置、柔性电路板贴合机及贴合方法
US12008204B2 (en) * 2021-10-04 2024-06-11 Google Llc Scalable gesture sensor for wearable and soft electronic devices

Citations (8)

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US3773989A (en) * 1970-11-26 1973-11-20 Plessey Handel Investment Ag Touch-wire overlay masks for cathode ray tubes
US4307961A (en) * 1979-04-02 1981-12-29 Western Electric Company, Inc. Apparatus for precisely aligning a pair of elements
GB2207815A (en) * 1987-07-16 1989-02-08 Crystalate Electronics Process for producing a programmed matrix
EP0471149A2 (en) * 1990-08-01 1992-02-19 Dynapro Thin Film Products, Inc. Method for the manufacture of electrical membrane panels having circuits on flexible plastic films
US6305073B1 (en) * 1999-12-29 2001-10-23 Gm Nameplate, Inc. One-sided electrode arrangement on an intermediate spacer for a touchscreen
CN1366445A (zh) * 2000-12-21 2002-08-28 索尼化学株式会社 多层柔性布线板的制造方法
CN1457227A (zh) * 2002-05-10 2003-11-19 华通电脑股份有限公司 以二次或二次以上压合制成印刷电路板使用的靶位制造方法
CN1475964A (zh) * 2002-08-13 2004-02-18 突破光电科技股份有限公司 触控屏上、下电极导通结构

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DE1919421C3 (de) 1969-04-17 1975-03-13 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Mehrschichtleiterplatte
US4446188A (en) 1979-12-20 1984-05-01 The Mica Corporation Multi-layered circuit board
JPS5745750A (en) * 1980-09-01 1982-03-15 Fanuc Ltd Transmission switching device having open line detecting function and industrial robot using said device
KR940008852B1 (ko) 1986-05-05 1994-09-28 제이. 주팬시크 데릭 컴퓨터 격납장치내의 전자 및 전기 조립체 장치용 브래킷(Bracket) 세트
EP0375328B1 (en) 1988-12-19 1997-03-19 Sharp Kabushiki Kaisha Tablet integrated with display
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EP0600052B1 (de) 1992-06-15 1996-04-17 Dyconex Patente Ag Verfahren zur herstellung von nachträglich konditionierbaren kontaktstellen an schaltungsträgern und schaltungsträger mit solchen kontaktstellen
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US5544018A (en) 1994-04-13 1996-08-06 Microelectronics And Computer Technology Corporation Electrical interconnect device with customizeable surface layer and interwoven signal lines
US5543589A (en) 1994-05-23 1996-08-06 International Business Machines Corporation Touchpad with dual sensor that simplifies scanning
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Publication number Priority date Publication date Assignee Title
US3773989A (en) * 1970-11-26 1973-11-20 Plessey Handel Investment Ag Touch-wire overlay masks for cathode ray tubes
US4307961A (en) * 1979-04-02 1981-12-29 Western Electric Company, Inc. Apparatus for precisely aligning a pair of elements
GB2207815A (en) * 1987-07-16 1989-02-08 Crystalate Electronics Process for producing a programmed matrix
EP0471149A2 (en) * 1990-08-01 1992-02-19 Dynapro Thin Film Products, Inc. Method for the manufacture of electrical membrane panels having circuits on flexible plastic films
US6305073B1 (en) * 1999-12-29 2001-10-23 Gm Nameplate, Inc. One-sided electrode arrangement on an intermediate spacer for a touchscreen
CN1366445A (zh) * 2000-12-21 2002-08-28 索尼化学株式会社 多层柔性布线板的制造方法
CN1457227A (zh) * 2002-05-10 2003-11-19 华通电脑股份有限公司 以二次或二次以上压合制成印刷电路板使用的靶位制造方法
CN1475964A (zh) * 2002-08-13 2004-02-18 突破光电科技股份有限公司 触控屏上、下电极导通结构

Also Published As

Publication number Publication date
WO2006118971A3 (en) 2007-01-11
KR20080003396A (ko) 2008-01-07
US7745733B2 (en) 2010-06-29
JP2008541430A (ja) 2008-11-20
KR101225363B1 (ko) 2013-01-22
WO2006118971A2 (en) 2006-11-09
EP1878327A2 (en) 2008-01-16
TW200707471A (en) 2007-02-16
CN101185379A (zh) 2008-05-21
US20060246379A1 (en) 2006-11-02

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Granted publication date: 20101103