JP2008537628A5 - - Google Patents

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Publication number
JP2008537628A5
JP2008537628A5 JP2007555173A JP2007555173A JP2008537628A5 JP 2008537628 A5 JP2008537628 A5 JP 2008537628A5 JP 2007555173 A JP2007555173 A JP 2007555173A JP 2007555173 A JP2007555173 A JP 2007555173A JP 2008537628 A5 JP2008537628 A5 JP 2008537628A5
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JP
Japan
Prior art keywords
gas
zone
distribution member
zones
flow rate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2007555173A
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English (en)
Japanese (ja)
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JP4814259B2 (ja
JP2008537628A (ja
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Publication date
Priority claimed from US11/057,433 external-priority patent/US7480974B2/en
Application filed filed Critical
Publication of JP2008537628A publication Critical patent/JP2008537628A/ja
Publication of JP2008537628A5 publication Critical patent/JP2008537628A5/ja
Application granted granted Critical
Publication of JP4814259B2 publication Critical patent/JP4814259B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007555173A 2005-02-15 2006-02-08 プラズマ処理装置用ガス分配部材の製造方法および該部材のガス透過率の調整方法 Expired - Fee Related JP4814259B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/057,433 2005-02-15
US11/057,433 US7480974B2 (en) 2005-02-15 2005-02-15 Methods of making gas distribution members for plasma processing apparatuses
PCT/US2006/004284 WO2006088697A2 (en) 2005-02-15 2006-02-08 Methods of making gas distribution members for plasma processing apparatuses

Publications (3)

Publication Number Publication Date
JP2008537628A JP2008537628A (ja) 2008-09-18
JP2008537628A5 true JP2008537628A5 (enExample) 2009-03-26
JP4814259B2 JP4814259B2 (ja) 2011-11-16

Family

ID=36814467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007555173A Expired - Fee Related JP4814259B2 (ja) 2005-02-15 2006-02-08 プラズマ処理装置用ガス分配部材の製造方法および該部材のガス透過率の調整方法

Country Status (6)

Country Link
US (2) US7480974B2 (enExample)
JP (1) JP4814259B2 (enExample)
KR (1) KR101323025B1 (enExample)
CN (1) CN101495268B (enExample)
TW (1) TWI378152B (enExample)
WO (1) WO2006088697A2 (enExample)

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US8702866B2 (en) 2006-12-18 2014-04-22 Lam Research Corporation Showerhead electrode assembly with gas flow modification for extended electrode life
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CN101980959A (zh) * 2008-03-26 2011-02-23 Gt太阳能公司 涂覆金的多晶硅反应器系统和方法
US20100071210A1 (en) * 2008-09-24 2010-03-25 Applied Materials, Inc. Methods for fabricating faceplate of semiconductor apparatus
KR101460555B1 (ko) * 2008-12-29 2014-11-14 주식회사 케이씨텍 샤워헤드 및 이를 구비하는 원자층 증착장치
JP5336968B2 (ja) * 2009-07-30 2013-11-06 東京エレクトロン株式会社 プラズマ処理装置用電極及びプラズマ処理装置
US9245717B2 (en) * 2011-05-31 2016-01-26 Lam Research Corporation Gas distribution system for ceramic showerhead of plasma etch reactor
US8883029B2 (en) 2013-02-13 2014-11-11 Lam Research Corporation Method of making a gas distribution member for a plasma processing chamber
US9275840B2 (en) 2014-01-25 2016-03-01 Yuri Glukhoy Method for providing uniform distribution of plasma density in a plasma treatment apparatus
US9484190B2 (en) 2014-01-25 2016-11-01 Yuri Glukhoy Showerhead-cooler system of a semiconductor-processing chamber for semiconductor wafers of large area
US9570289B2 (en) * 2015-03-06 2017-02-14 Lam Research Corporation Method and apparatus to minimize seam effect during TEOS oxide film deposition
JP6421294B1 (ja) * 2017-05-25 2018-11-14 株式会社三井Ｅ＆Ｓマシナリー シャワーヘッド加工工具およびシャワーヘッド加工工具の製造方法
JP7716425B2 (ja) * 2020-04-29 2025-07-31 ラム リサーチ コーポレーション 基板処理システムにおけるシャワーヘッドのグルーピングフィーチャ
JP7563846B2 (ja) * 2020-12-21 2024-10-08 東京エレクトロン株式会社 流量測定方法及び基板処理装置

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US7480974B2 (en) * 2005-02-15 2009-01-27 Lam Research Corporation Methods of making gas distribution members for plasma processing apparatuses

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