JP2008527731A5 - - Google Patents
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- Publication number
- JP2008527731A5 JP2008527731A5 JP2007550755A JP2007550755A JP2008527731A5 JP 2008527731 A5 JP2008527731 A5 JP 2008527731A5 JP 2007550755 A JP2007550755 A JP 2007550755A JP 2007550755 A JP2007550755 A JP 2007550755A JP 2008527731 A5 JP2008527731 A5 JP 2008527731A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor nitride
- auxiliary
- layer
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP05290082.6 | 2005-01-13 | ||
| EP05290082A EP1681712A1 (en) | 2005-01-13 | 2005-01-13 | Method of producing substrates for optoelectronic applications |
| PCT/EP2006/000230 WO2006074933A1 (en) | 2005-01-13 | 2006-01-12 | Method of producing a substrate for an optoelectronic application |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008527731A JP2008527731A (ja) | 2008-07-24 |
| JP2008527731A5 true JP2008527731A5 (https=) | 2012-01-19 |
| JP5312797B2 JP5312797B2 (ja) | 2013-10-09 |
Family
ID=34941890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007550755A Expired - Lifetime JP5312797B2 (ja) | 2005-01-13 | 2006-01-12 | オプトエレクトロニクス用基板の作製方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US7537949B2 (https=) |
| EP (1) | EP1681712A1 (https=) |
| JP (1) | JP5312797B2 (https=) |
| KR (1) | KR100905977B1 (https=) |
| CN (1) | CN100580880C (https=) |
| WO (1) | WO2006074933A1 (https=) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10374120B2 (en) * | 2005-02-18 | 2019-08-06 | Koninklijke Philips N.V. | High efficiency solar cells utilizing wafer bonding and layer transfer to integrate non-lattice matched materials |
| TW200707799A (en) * | 2005-04-21 | 2007-02-16 | Aonex Technologies Inc | Bonded intermediate substrate and method of making same |
| TWI267946B (en) * | 2005-08-22 | 2006-12-01 | Univ Nat Chiao Tung | Interconnection of group III-V semiconductor device and fabrication method for making the same |
| CN100474642C (zh) * | 2005-10-27 | 2009-04-01 | 晶能光电(江西)有限公司 | 含有金属铬基板的铟镓铝氮半导体发光元件及其制造方法 |
| US20070243703A1 (en) * | 2006-04-14 | 2007-10-18 | Aonex Technololgies, Inc. | Processes and structures for epitaxial growth on laminate substrates |
| FR2914494A1 (fr) * | 2007-03-28 | 2008-10-03 | Soitec Silicon On Insulator | Procede de report d'une couche mince de materiau |
| US7732301B1 (en) | 2007-04-20 | 2010-06-08 | Pinnington Thomas Henry | Bonded intermediate substrate and method of making same |
| US20080303033A1 (en) * | 2007-06-05 | 2008-12-11 | Cree, Inc. | Formation of nitride-based optoelectronic and electronic device structures on lattice-matched substrates |
| EP2171748A1 (en) * | 2007-07-26 | 2010-04-07 | S.O.I.Tec Silicon on Insulator Technologies | Epitaxial methods and templates grown by the methods |
| US20090278233A1 (en) * | 2007-07-26 | 2009-11-12 | Pinnington Thomas Henry | Bonded intermediate substrate and method of making same |
| WO2009015337A1 (en) * | 2007-07-26 | 2009-01-29 | S.O.I.Tec Silicon On Insulator Technologies | Methods for producing improved epitaxial materials |
| EP2105972A3 (en) * | 2008-03-28 | 2015-06-10 | Semiconductor Energy Laboratory Co, Ltd. | Photoelectric conversion device and method for manufacturing the same |
| US7781780B2 (en) * | 2008-03-31 | 2010-08-24 | Bridgelux, Inc. | Light emitting diodes with smooth surface for reflective electrode |
| US20100295088A1 (en) * | 2008-10-02 | 2010-11-25 | Soraa, Inc. | Textured-surface light emitting diode and method of manufacture |
| FR2936903B1 (fr) * | 2008-10-07 | 2011-01-14 | Soitec Silicon On Insulator | Relaxation d'une couche de materiau contraint avec application d'un raidisseur |
| KR101408475B1 (ko) | 2008-10-30 | 2014-06-19 | 소이텍 | 감소된 격자 변형을 갖는 반도체 재료층들, 반도체 구조들, 디바이스들 및 이를 포함하는 가공된 기판을 형성하는 방법들 |
| US8637383B2 (en) | 2010-12-23 | 2014-01-28 | Soitec | Strain relaxation using metal materials and related structures |
| US8247886B1 (en) | 2009-03-09 | 2012-08-21 | Soraa, Inc. | Polarization direction of optical devices using selected spatial configurations |
| US8791499B1 (en) | 2009-05-27 | 2014-07-29 | Soraa, Inc. | GaN containing optical devices and method with ESD stability |
| US8409366B2 (en) * | 2009-06-23 | 2013-04-02 | Oki Data Corporation | Separation method of nitride semiconductor layer, semiconductor device, manufacturing method thereof, semiconductor wafer, and manufacturing method thereof |
| US9000466B1 (en) | 2010-08-23 | 2015-04-07 | Soraa, Inc. | Methods and devices for light extraction from a group III-nitride volumetric LED using surface and sidewall roughening |
| US9583678B2 (en) | 2009-09-18 | 2017-02-28 | Soraa, Inc. | High-performance LED fabrication |
| US9293644B2 (en) | 2009-09-18 | 2016-03-22 | Soraa, Inc. | Power light emitting diode and method with uniform current density operation |
| CN107256915A (zh) | 2009-09-18 | 2017-10-17 | 天空公司 | 发光二极管器件 |
| US8933644B2 (en) | 2009-09-18 | 2015-01-13 | Soraa, Inc. | LED lamps with improved quality of light |
| US8648387B2 (en) * | 2009-12-30 | 2014-02-11 | Industrial Technology Research Institute | Nitride semiconductor template and method of manufacturing the same |
| US8905588B2 (en) | 2010-02-03 | 2014-12-09 | Sorra, Inc. | System and method for providing color light sources in proximity to predetermined wavelength conversion structures |
| US10147850B1 (en) | 2010-02-03 | 2018-12-04 | Soraa, Inc. | System and method for providing color light sources in proximity to predetermined wavelength conversion structures |
| US8740413B1 (en) | 2010-02-03 | 2014-06-03 | Soraa, Inc. | System and method for providing color light sources in proximity to predetermined wavelength conversion structures |
| US9450143B2 (en) | 2010-06-18 | 2016-09-20 | Soraa, Inc. | Gallium and nitrogen containing triangular or diamond-shaped configuration for optical devices |
| US8786053B2 (en) | 2011-01-24 | 2014-07-22 | Soraa, Inc. | Gallium-nitride-on-handle substrate materials and devices and method of manufacture |
| FR2977069B1 (fr) | 2011-06-23 | 2014-02-07 | Soitec Silicon On Insulator | Procede de fabrication d'une structure semi-conductrice mettant en oeuvre un collage temporaire |
| US8686431B2 (en) | 2011-08-22 | 2014-04-01 | Soraa, Inc. | Gallium and nitrogen containing trilateral configuration for optical devices |
| KR101254716B1 (ko) * | 2011-11-07 | 2013-04-15 | 삼성코닝정밀소재 주식회사 | 패턴을 갖는 전이기판 제조방법 |
| US8912025B2 (en) | 2011-11-23 | 2014-12-16 | Soraa, Inc. | Method for manufacture of bright GaN LEDs using a selective removal process |
| JP5879964B2 (ja) * | 2011-11-25 | 2016-03-08 | 住友電気工業株式会社 | 複合基板の製造方法および半導体デバイスの製造方法 |
| EP2823515A4 (en) | 2012-03-06 | 2015-08-19 | Soraa Inc | LIGHT-EMITTING DIODES WITH MATERIAL LAYERS WITH LOW BREAKING INDEX TO REDUCE LIGHT PIPE EFFECTS |
| JP2013247362A (ja) * | 2012-05-29 | 2013-12-09 | Samsung Corning Precision Materials Co Ltd | 半導体素子用薄膜貼り合わせ基板の製造方法 |
| US8971368B1 (en) | 2012-08-16 | 2015-03-03 | Soraa Laser Diode, Inc. | Laser devices having a gallium and nitrogen containing semipolar surface orientation |
| US9978904B2 (en) | 2012-10-16 | 2018-05-22 | Soraa, Inc. | Indium gallium nitride light emitting devices |
| US8802471B1 (en) | 2012-12-21 | 2014-08-12 | Soraa, Inc. | Contacts for an n-type gallium and nitrogen substrate for optical devices |
| US11721547B2 (en) * | 2013-03-14 | 2023-08-08 | Infineon Technologies Ag | Method for manufacturing a silicon carbide substrate for an electrical silicon carbide device, a silicon carbide substrate and an electrical silicon carbide device |
| US8994033B2 (en) | 2013-07-09 | 2015-03-31 | Soraa, Inc. | Contacts for an n-type gallium and nitrogen substrate for optical devices |
| US9548247B2 (en) * | 2013-07-22 | 2017-01-17 | Infineon Technologies Austria Ag | Methods for producing semiconductor devices |
| US9419189B1 (en) | 2013-11-04 | 2016-08-16 | Soraa, Inc. | Small LED source with high brightness and high efficiency |
| WO2016075927A1 (ja) * | 2014-11-11 | 2016-05-19 | 出光興産株式会社 | 新規な積層体 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2540791B2 (ja) * | 1991-11-08 | 1996-10-09 | 日亜化学工業株式会社 | p型窒化ガリウム系化合物半導体の製造方法。 |
| JP3325713B2 (ja) * | 1994-08-22 | 2002-09-17 | ローム株式会社 | 半導体発光素子の製法 |
| US20010042866A1 (en) * | 1999-02-05 | 2001-11-22 | Carrie Carter Coman | Inxalygazn optical emitters fabricated via substrate removal |
| JP4024994B2 (ja) * | 2000-06-30 | 2007-12-19 | 株式会社東芝 | 半導体発光素子 |
| FR2816445B1 (fr) * | 2000-11-06 | 2003-07-25 | Commissariat Energie Atomique | Procede de fabrication d'une structure empilee comprenant une couche mince adherant a un substrat cible |
| FR2840731B3 (fr) * | 2002-06-11 | 2004-07-30 | Soitec Silicon On Insulator | Procede de fabrication d'un substrat comportant une couche utile en materiau semi-conducteur monocristallin de proprietes ameliorees |
| FR2817394B1 (fr) * | 2000-11-27 | 2003-10-31 | Soitec Silicon On Insulator | Procede de fabrication d'un substrat notamment pour l'optique, l'electronique ou l'optoelectronique et substrat obtenu par ce procede |
| JP2002284600A (ja) | 2001-03-26 | 2002-10-03 | Hitachi Cable Ltd | 窒化ガリウム結晶基板の製造方法及び窒化ガリウム結晶基板 |
| JP3886341B2 (ja) * | 2001-05-21 | 2007-02-28 | 日本電気株式会社 | 窒化ガリウム結晶基板の製造方法及び窒化ガリウム結晶基板 |
| US6936357B2 (en) * | 2001-07-06 | 2005-08-30 | Technologies And Devices International, Inc. | Bulk GaN and ALGaN single crystals |
| US7052974B2 (en) * | 2001-12-04 | 2006-05-30 | Shin-Etsu Handotai Co., Ltd. | Bonded wafer and method of producing bonded wafer |
| FR2834123B1 (fr) * | 2001-12-21 | 2005-02-04 | Soitec Silicon On Insulator | Procede de report de couches minces semi-conductrices et procede d'obtention d'une plaquette donneuse pour un tel procede de report |
| FR2835095B1 (fr) | 2002-01-22 | 2005-03-18 | Procede de preparation d'ensembles a semi-conducteurs separables, notamment pour former des substrats pour l'electronique, l'optoelectrique et l'optique | |
| TW577178B (en) | 2002-03-04 | 2004-02-21 | United Epitaxy Co Ltd | High efficient reflective metal layer of light emitting diode |
| US6791120B2 (en) | 2002-03-26 | 2004-09-14 | Sanyo Electric Co., Ltd. | Nitride-based semiconductor device and method of fabricating the same |
| US20030189215A1 (en) * | 2002-04-09 | 2003-10-09 | Jong-Lam Lee | Method of fabricating vertical structure leds |
| KR20110042249A (ko) * | 2003-06-04 | 2011-04-25 | 유명철 | 수직 구조 화합물 반도체 디바이스의 제조 방법 |
| TWI240434B (en) | 2003-06-24 | 2005-09-21 | Osram Opto Semiconductors Gmbh | Method to produce semiconductor-chips |
| JP4232605B2 (ja) * | 2003-10-30 | 2009-03-04 | 住友電気工業株式会社 | 窒化物半導体基板の製造方法と窒化物半導体基板 |
| US7118813B2 (en) * | 2003-11-14 | 2006-10-10 | Cree, Inc. | Vicinal gallium nitride substrate for high quality homoepitaxy |
| US7148124B1 (en) * | 2004-11-18 | 2006-12-12 | Alexander Yuri Usenko | Method for forming a fragile layer inside of a single crystalline substrate preferably for making silicon-on-insulator wafers |
| US20060124956A1 (en) * | 2004-12-13 | 2006-06-15 | Hui Peng | Quasi group III-nitride substrates and methods of mass production of the same |
-
2005
- 2005-01-13 EP EP05290082A patent/EP1681712A1/en not_active Ceased
- 2005-03-21 US US11/084,747 patent/US7537949B2/en not_active Expired - Lifetime
-
2006
- 2006-01-12 WO PCT/EP2006/000230 patent/WO2006074933A1/en not_active Ceased
- 2006-01-12 KR KR1020077014329A patent/KR100905977B1/ko not_active Expired - Lifetime
- 2006-01-12 JP JP2007550755A patent/JP5312797B2/ja not_active Expired - Lifetime
- 2006-01-12 CN CN200680001546A patent/CN100580880C/zh not_active Expired - Lifetime
-
2009
- 2009-04-16 US US12/424,868 patent/US20090200569A1/en not_active Abandoned
-
2011
- 2011-06-07 US US13/154,510 patent/US8541290B2/en not_active Expired - Fee Related
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